Smelting method for high-purity low-oxygen recovery sputtering target material

Abstract

The invention discloses a smelting method for a high-purity low-oxygen recovery sputtering target material. The smelting method comprises the following specific steps: 1) a recovered target material and high-purity low-oxygen metal crystals / powder are detected and analyzed; 2) the number of layers of the recovered target materials after a bin is fully paved with the recovered target materials is calculated according to the calculated dosage ratio, the bin length and the length of the recovered target material; 3) the high-purity low-oxygen metal crystal / powder is uniformly mixed and is pressedinto a block; 4) the recycled target material and the block body are stacked and fully pave the bin; and 5) the stacked recycled target materials and blocks are put into an electron beam smelting furnace for smelting and ingot casting. According to the method, the oxygen content of the recovered target remelting cast ingot is effectively reduced, the metal impurity content is balanced, cast ingotcomponents are distributed uniformly and stably and meet the requirements of industries such as semiconductors, the utilization value of the recovered target material is improved, and the productivity of high-purity metal is improved; moreover, the adopted equipment is existing equipment, extra investment is not needed, the cost is low, and the operation is simple.

Description

technical field

[0001] The invention relates to the technical field of material recovery, in particular to a smelting method for recovering sputtering targets with high purity and low oxygen. Background technique

[0002] The sputtering target refers to the sputtering source that forms various functional thin films on the substrate by sputtering under appropriate process conditions through magnetron sputtering, multi-arc ion plating or other types of coating systems. Sputtering targets include metals, alloys, ceramics, borides, etc. Usually, the target is divided into two parts, the target body and the back plate, for reasons such as improving the conductivity of the target and reducing costs, and then connected together by welding. Generally, the recycled sputtering target refers to the target after the back plate is completely peeled off. However, the existing technology usually briquettes the recovered target material, and then uses an electron beam cooling bed melting ...