Method for growing large-area single-layer or multi-layer molybdenum ditelluride structure through secondary reaction
A molybdenum ditelluride, secondary reaction technology, applied in coating, gaseous chemical plating, metal material coating technology and other directions, to achieve the effects of good controllability, simple operation and wide application prospects
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Embodiment 1
[0009] First deposit a molybdenum telluride nano-film on a silicon substrate with a size of 100 square centimeters by atomic layer deposition, the deposition temperature is 500°C, and the deposition time is 10 minutes; High-temperature secondary reaction with elemental tellurium under high temperature, the reaction temperature is 1000°C, the reaction pressure is 80 Torr, and the reaction time is 1 minute, and a large-area single-layer molybdenum ditelluride structure is obtained.
Embodiment 2
[0011] First deposit a molybdenum telluride nano-film on a sapphire wafer substrate with a size of 66 square centimeters by atomic layer deposition, the deposition temperature is 380°C, and the deposition time is 5 hours; High-temperature secondary reaction with elemental tellurium is carried out under the atmosphere, the reaction temperature is 710°C, the reaction pressure is 170 Torr, and the reaction time is 3 minutes, and a large-area multilayer molybdenum ditelluride structure is obtained.
Embodiment 3
[0013] First deposit a molybdenum telluride nano-film on an aluminum oxide substrate with a size of 4 square centimeters by atomic layer deposition, the deposition temperature is 100°C, and the deposition time is 150 minutes; A high-temperature secondary reaction with simple tellurium was carried out under an argon atmosphere. The reaction temperature was 600° C., the reaction pressure was 230 Torr, and the reaction time was 7 minutes to obtain a large-area multilayer molybdenum ditelluride structure.
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