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Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board

A technology for printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve problems affecting heat dissipation effects, etc., achieve enhanced heat conduction effects, eliminate the need for installing heat dissipation devices, and improve storage capacity volume effect

Inactive Publication Date: 2020-03-27
赣州金顺科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the object of the present invention is to provide a method for manufacturing a high heat dissipation double-sided sandwich copper-based printed circuit board, which aims to solve the problem of current metal-based single-sided wire board wiring and containing components. There are large limitations, and the double-sided or multi-layer circuit board will affect the technical problem of its heat dissipation effect; this production method directly pastes the heat dissipation surface of the component on the copper base, so that the heat conduction effect is greatly enhanced, thereby eliminating The addition of a soldered heat dissipation module improves the performance of the PCB, and at the same time, the manufacturer has strong practicability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This specific implementation mode is to make a high heat dissipation double-sided sandwich copper-based printed circuit board, and its core steps are:

[0032] 1. Manufacturing process of sandwich copper substrate

[0033] a. Pre-drilling; at the position where conduction drilling is required on both sides, first pre-drill 0.3mm on the copper base for drilling. If the diameter of the drilled hole on the double-sided panel is 1.0mm, then the copper base needs to be drilled 1.3mm ;

[0034] b. Insulation hole production; roughen the hole wall by browning after drilling to increase the bonding force, and then use aluminum sheet mesh on the copper-based pre-drilled hole (the aperture of the aluminum sheet mesh needs to be pre-drilled than the copper substrate drilling hole) 0.1mm) filled with resin by silk screen printing or dispensing. The resin can be made of Shanrong’s special plug slot resin. After the plug hole is completed, bake it at 140°C for 35 minutes and solidif...

Embodiment 2

[0042] This specific implementation mode is to make a high heat dissipation double-sided sandwich copper-based printed circuit board, and its core steps are:

[0043] 1. Manufacturing process of sandwich copper substrate

[0044] a. Pre-drilling; at the position where conduction drilling is required on both sides, first pre-drill 0.3mm on the copper base for drilling. If the diameter of the drilled hole on the double-sided panel is 1.0mm, then the copper base needs to be drilled 1.3mm ;

[0045] b. Insulation hole production; roughen the hole wall by browning after drilling to increase the bonding force, and then use aluminum sheet mesh on the copper-based pre-drilled hole (the aperture of the aluminum sheet mesh needs to be pre-drilled than the copper substrate drilling hole) 0.1mm) filled with resin by silk screen printing or dispensing. The resin can be made of Shanrong’s special plug slot resin. After the plug hole is completed, bake it at 150°C for 30 minutes and cure it...

Embodiment 3

[0053] This specific implementation mode is to make a high heat dissipation double-sided sandwich copper-based printed circuit board, and its core steps are:

[0054] 1. Manufacturing process of sandwich copper substrate

[0055] a. Pre-drilling; at the position where conduction drilling is required on both sides, first pre-drill 0.4mm on the copper base for drilling. If the hole diameter is 1.0mm on the double-sided board, then 1.4mm needs to be drilled on the copper base ;

[0056] b. Insulation hole production; roughen the hole wall by browning after drilling to increase the bonding force, and then use aluminum sheet mesh on the copper-based pre-drilled hole (the aperture of the aluminum sheet mesh needs to be pre-drilled than the copper substrate drilling hole) The resin can be filled with resin by silk screen printing or dispensing. The resin can be made of Shanrong’s special plug slot resin. After the plug hole is completed, bake it at 160°C for 25 minutes and cure it. ...

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Abstract

The invention discloses a manufacturing method of a high-heat-dissipation double-sided sandwich copper-based printed circuit board, and aims to solve the technical problems that wiring and component accommodating of an existing metal-based single-sided circuit board are greatly limited, and a double-sided or multi-layer circuit board affects the heat dissipation effect of the existing metal-basedsingle-sided circuit board. The process of the manufacturing method comprises the following steps: pre-drilling holes in positions, needing to be conducted, of circuit layers on two surfaces of a copper base; after the holes are filled with resin, adding PP (polypropylene) and copper foils on two sides of the holes and pressing the PP (polypropylene) and copper foils into a double-sided board; andperforming laser ablation windowing on the two layers of circuit surfaces where the copper base needs to be exposed for heat dissipation, ablating the copper foil and the dielectric layer by laser, exposing the copper base, enabling the epitaxy of the sandwich copper base to be flush with the circuit surfaces through a filling and plating process, and directly dissipating the heat of the component by the copper base. According to the manufacturing method, the heat dissipation surface of the component is directly pasted on the copper base, so that the heat conduction effect is greatly enhanced, and an additional welding heat dissipation module is omitted, and the performance of the PCB is improved, and meanwhile, the manufacturing method has extremely high practicability.

Description

technical field [0001] The invention belongs to the field of preparation of copper-based printed circuit boards, in particular to a method for manufacturing high-radiation double-sided sandwich copper-based printed circuit boards. Background technique [0002] The printed circuit board is designed according to the predetermined design, through the process of pattern transfer, electroplating, etching, etc., to form conductive patterns on the insulating substrate, realize the electrical connection of electronic components, and provide the required electrical characteristics, assembly characters and other characteristics. It is an electronic Carrier of components. Printed circuit boards can be divided into single-sided boards, double-sided boards and multi-layer boards according to the number of circuit layers. At present, the common multi-layer boards are generally 4-layer boards or 6-layer boards, and complex multi-layer boards can reach dozens of layers. In addition, Accord...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/10H05K3/22H05K1/02H05K1/11
CPCH05K3/00H05K3/10H05K3/22H05K1/0204H05K1/11
Inventor 肖世翔刘海明邓昱曾庆辉
Owner 赣州金顺科技有限公司
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