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Preparation method of micron/submicron order silver powder

A sub-micron silver powder technology, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of low sintering activity of silver powder, high sintering activity of silver powder, poor dispersion, etc., achieve good dispersion, easy to remove, and prevent agglomeration Effect

Pending Publication Date: 2020-04-03
CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for preparing micron / submicron silver powder, which overcomes the defects of low sintering activity and poor dispersibility of silver powder in the prior art, and the prepared silver powder has high sintering activity and good dispersibility

Method used

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  • Preparation method of micron/submicron order silver powder
  • Preparation method of micron/submicron order silver powder
  • Preparation method of micron/submicron order silver powder

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preparation example Construction

[0021] The present invention proposes a kind of preparation method of micron / submicron silver powder, comprising:

[0022] S1: preparing a dispersion emulsion, the dispersion emulsion includes a dispersant, an emulsifier and a solvent;

[0023] The dispersion emulsion is used to increase the dispersibility of the prepared silver powder.

[0024] In the preparation method provided by the invention, the dispersant is formulated into a dispersed emulsion first, in order to make the dispersant difficult to attach to the surface of the newly generated silver powder, so that the redundant dispersant can be easily removed when the silver powder is washed, so that the prepared silver powder Has a lower weight loss on ignition.

[0025] Preferably, the specific preparation process of the dispersed emulsion is:

[0026] S11: Weigh the dispersant, emulsifier and solvent according to the mass ratio (3~10):(30~80):(15~60);

[0027] S12: Stir the dispersant, emulsifier and solvent weighe...

Embodiment 1

[0050] The present embodiment provides a kind of preparation method of micron / submicron silver powder, comprising:

[0051] S1: To prepare a dispersed emulsion, accurately weigh oleic acid, Tween 80 and ethanol according to the mass ratio of 6:60:34, stir evenly at 35°C, and add deionized water while stirring (the amount of deionized water added is oil acid, Tween 80 and 200% of the total mass of ethanol) to obtain a pale blue dispersed emulsion;

[0052] S2: preparing a reducing solution, weighing vitamin C and deionized water according to a mass ratio of 5:95 (the concentration of reducing organic matter in the reducing solution is 5%), and mixing uniformly at a constant temperature of 25°C to obtain a reducing solution;

[0053] S3: Mix the dispersed emulsion and the reducing solution at a volume ratio of 1:10 to obtain a mixed solution, and adjust the pH value of the mixed solution to 4.5±0.1 with ammonia water;

[0054] S4: Weigh silver nitrate according to the stoichiom...

Embodiment 2

[0061] The present embodiment provides a kind of preparation method of micron / submicron silver powder, comprising:

[0062] S1: To prepare a dispersed emulsion, accurately weigh stearic acid, Tween 60 and methanol according to the mass ratio of 3:30:67, stir evenly at 25°C, and add deionized water while stirring (the amount of deionized water added is 100% of the total mass of stearic acid, Tween 60 and methanol), to obtain a pale blue dispersed emulsion;

[0063] S2: preparing a reducing solution, weighing glucose and deionized water according to a mass ratio of 1:99 (the concentration of reducing organic matter in the reducing solution is 1%), and mixing uniformly at a constant temperature of 45° C. to obtain a reducing solution;

[0064] S3: Mix the dispersed emulsion and the reducing solution at a volume ratio of 1:2 to obtain a mixed solution, and adjust the pH value of the mixed solution to 9.0±0.1 with ammonia water;

[0065] S4: Weigh silver nitrate according to the s...

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Abstract

The invention discloses a preparation method of micron / submicron order silver powder. The preparation method comprises the following steps that S1, a dispersion emulsion is prepared; S2, a reducing liquid is prepared; S3, the dispersion emulsion is mixed with the reducing liquid according to the volume ratio to obtain a mixed solution, and the pH of the mixed solution is adjusted; S4, silver nitrate is weighed according to the stoichiometric ratio of a reducing organic matter to the silver nitrate, a silver nitrate solution is prepared, then the silver nitrate solution is mixed with the mixedsolution obtained in the step S3, and stirring is carried out to obtain wet silver powder; and S5, washing, filtering, dispersing, surface modification and drying are carried out on the wet silver powder obtained in the step S4 to obtain the silver powder. According to the preparation method, firstly, a dispersing agent is prepared into the dispersion emulsion so that the burning weight loss of the silver powder can be effectively reduced; and meanwhile, the surface modification is carried out on the wet silver powder in the subsequent step by adopting a substance containing a mercapto group so that the dispersibility and the sintering activity of the silver powder can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of silver powder preparation, in particular to a preparation method of micron / submicron silver powder. Background technique [0002] Printing circuits by printing provides new ideas and solutions for the preparation of conductive patterns. The printing method has high material utilization, simple manufacturing process, and low cost. When printing circuits, it can achieve higher wiring density and accuracy. Therefore, Technologies such as inkjet printing have very broad application prospects and can be used in printing radio frequency electronic tags, solar cells, transparent conductive films and other fields. The patterns prepared by printing are finer and more favorable in terms of environmental factors and cost factors. [0003] The granular conductive ink commonly used in the prior art is the main raw material of printed circuits, and nano-silver is an important component of the conductive ink. There ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00
CPCB22F9/24B22F1/14
Inventor 刘飞全马锦
Owner CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
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