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High-precision circuit board and manufacturing method thereof

A circuit board, high-precision technology, applied in the direction of printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve the problems of high graphics accuracy, limited circuit density of printed circuit boards, and difficult to achieve

Inactive Publication Date: 2020-04-07
SHANTOU GOWORLD DISPLAY TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, since the flatness of the epoxy board is insufficient, and the thickness of the copper conductive layer is too thick, and the etching protection layer during etching is mostly set by printing, it is difficult to achieve high pattern accuracy ( >50μm), which severely limits the circuit density of printed circuit boards

Method used

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  • High-precision circuit board and manufacturing method thereof
  • High-precision circuit board and manufacturing method thereof
  • High-precision circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as figure 1 As shown, this high-precision circuit board includes a support base 1 and a conductive circuit 2 arranged on the support base 1. The support base 1 is a polyimide film 200 formed on a flat mother glass 100, and the conductive circuit 2 is The metal layer 300, the metal layer 300 has the corresponding pattern of the conductive circuit 2, the formation conditions of the metal layer 300 include that the support base 1 is on the flat mother glass 100, the metal layer 300 is deposited on the support base 1 by magnetron sputtering, the metal layer 300 forms the corresponding pattern of the conductive circuit 2 through a photolithography process.

[0029] The thickness of the above-mentioned polyimide film 200 may be 10 μm˜100 μm. The above-mentioned flat mother glass 100 is preferably float glass with very high flatness, which can ensure that the formed polyimide film 200 has high flatness (thickness uniformity) and high smoothness.

[0030] In this embodim...

Embodiment 2

[0048] Such as Figure 8 As shown, in the case that other parts are the same as the first embodiment, the difference is that the conductive circuit 2 includes a first wire layer 201 and a second wire layer 202, and a There is an insulating isolation layer 5, and the isolation layer 5 is a patterned photosensitive resin coating; the isolation layer 5 is provided with a through hole 6, and the first wire layer 201 and the second wire layer 202 are connected to each other through the through hole 6. .

[0049] Specifically, it is preferred that the isolation layer 5 is a photosensitive resin layer coated by spin coating, flat coating (or extrusion coating, slit coating), which has good thickness uniformity and smoothness, and its thickness can be 0.5 μm ~5μm. The isolation layer 5 is preferably patterned using a yellow light process (i.e., exposure and development), and its pattern accuracy can also reach a level above 10 μm, so it can be matched with high-precision lines and r...

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Abstract

The invention discloses a high-precision circuit board and a manufacturing method thereof. The circuit board comprises a supporting bottom plate and a conductive circuit arranged on the supporting bottom plate, the supporting bottom plate is a polyimide film formed on a flat glass mother plate; the conductive circuit is a metal layer, the metal layer is provided with a pattern corresponding to theconductive circuit, and the forming conditions of the metal layer comprise that the supporting bottom plate is located on the flat glass mother plate, the metal layer is deposited on the supporting bottom plate in a magnetron sputtering mode, and the metal layer forms a pattern corresponding to the conductive circuit through a photoetching process. The polyimide film is formed on the flat glass mother board to serve as the supporting bottom plate, the supporting base plate is flatter and smoother, when the supporting base plate is located on the flat glass mother plate, the metal layer with very high uniformity is plated on the supporting base plate in the magnetron sputtering mode, the circuit precision can reach the level of 10 micrometers or above through patterning of the photoetchingprocess, and the circuit density can also be remarkably improved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a high-precision circuit board and a manufacturing method thereof. Background technique [0002] A printed circuit board generally includes a supporting base body and a patterned conductive circuit disposed thereon. In recent years, with the increasing integration of electronic equipment such as mobile phones, the requirements for circuit density of printed circuit boards are also increasing, so the requirements for graphic accuracy of printed circuit boards are also getting higher and higher. [0003] In the prior art, the printed circuit board generally adopts an epoxy board as a supporting base, and then adheres a copper conductive layer on it, and then etches a circuit pattern on the copper conductive layer by etching. In this method, since the flatness of the epoxy board is insufficient, and the thickness of the copper conductive layer is too thick, and the etching pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/02
CPCH05K1/032H05K3/027H05K2201/0154
Inventor 沈奕吕岳敏彭嘉鑫欧建平郑清交杨秋强陈远明蔡泽锋
Owner SHANTOU GOWORLD DISPLAY TECH CO LTD
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