Gold-copper-based brazing filler metal and welding method thereof

A welding method and solder technology, applied in welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of difficult wetting of solder and large residual stress of brazing joints, so as to prevent crack propagation and improve Wetting condition, effect of high normal/high temperature shear strength

Active Publication Date: 2020-04-10
SHENYANG LIMING AERO-ENGINE GROUP CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the existing SiC f During the welding process of SiC and superalloy GH3536, it is difficult for conventional solder to wet SiC f / SiC, the residual stress of the brazed joint is relatively large, and SiC f Ni elements diffused in SiC and Si elements react excessively to form hard and brittle problems. The present invention provides a gold-copper-based solder and its welding method, so as to obtain a brazed joint with a certain room temperature and high temperature shear strength. The specific The technical solution is as follows:

Method used

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  • Gold-copper-based brazing filler metal and welding method thereof
  • Gold-copper-based brazing filler metal and welding method thereof

Examples

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Effect test

Embodiment 1

[0041] A gold-copper-based solder, specifically a composite solder of Au-Cu-Ti-B / Mo / Au-Cu-Ti-B, consisting of Au foil, Cu foil, Mo foil and paste solder, The mass ratio of Au foil, Cu foil and Mo foil is Au:Cu:Mo=197:64:96, the paste solder is a mixture of TiB powder and binder, and the mass ratio of TiB powder and binder is TiB powder : adhesive=1:0.5, described TiB powder is prepared by TiH powder and B powder, and TiH powder and B powder mass ratio are TiH:B=142:1;

[0042] The purity of the described Au foil, Cu foil and Mo foil is above 99%;

[0043] The thickness of the Mo foil is 50 μm;

[0044] The thickness of the Au foil is 50 μm;

[0045] The thickness of the Cu foil is 50 μm;

[0046] The thickness of the paste solder is 15 μm;

[0047] The particle size of described TiH powder, B powder is 300 mesh, and purity is more than 99%;

[0048] Described bonding agent is the mixture of terpineol and dehydrated alcohol, and the volume ratio of terpineol and dehydrated...

Embodiment 2

[0065] A gold-copper-based solder, specifically a composite solder of Au-Cu-Ti-B / Mo / Au-Cu-Ti-B, consisting of Au foil, Cu foil, Mo foil and paste solder, The mass ratio of Au foil, Cu foil and Mo foil is Au:Cu:Mo=197:64:100, the paste solder is a mixture of TiB powder and binder, and the mass ratio of TiB powder and binder is TiB powder : adhesive=1:0.2, described TiB powder is prepared by TiH powder and B powder, and TiH powder and B powder mass ratio are TiH:B=17.6:1;

[0066] The purity of the described Au foil, Cu foil and Mo foil is above 99%;

[0067] The thickness of the Mo foil is 52 μm;

[0068] The thickness of the Au foil is 50 μm;

[0069] The thickness of the Cu foil is 50 μm;

[0070] The thickness of the paste solder is 20 μm;

[0071] The particle size of described TiH powder, B powder is 300 mesh, and purity is more than 99%;

[0072] Described binding agent is the mixture of terpineol and dehydrated alcohol, and the volume ratio of terpineol and dehydrat...

Embodiment 3

[0089] A gold-copper-based solder, specifically a composite solder of Au-Cu-Ti-B / Mo / Au-Cu-Ti-B, consisting of Au foil, Cu foil, Mo foil and paste solder, The mass ratio of Au foil, Cu foil and Mo foil is Au:Cu:Mo=196:63:115, the paste solder is a mixture of TiB powder and binder, and the mass ratio of TiB powder and binder is TiB powder : adhesive=1:0.3, described TiB powder is prepared by TiH powder and B powder, and TiH powder and B powder mass ratio are TiH:B=48:1;

[0090] The purity of the described Au foil, Cu foil and Mo foil is above 99%;

[0091] The thickness of the Mo foil is 60 μm;

[0092] The thickness of the Au foil is 50 μm;

[0093] The thickness of the Cu foil is 50 μm;

[0094] The thickness of the paste solder is 15 μm;

[0095] The particle size of described TiH powder, B powder is 300 mesh, and purity is more than 99%;

[0096] Described bonding agent is the mixture of terpineol and dehydrated alcohol, and the volume ratio of terpineol and dehydrated a...

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Abstract

The invention discloses gold-copper-based brazing filler metal and a welding method thereof, belongs to the technical field of welding, and particularly relates to Au-Cu-Ti-B/Mo/Au-Cu-Ti-B composite brazing filler metal which is composed of an Au foil, a Cu foil, a Mo foil and paste brazing filler metal. The gold-copper-based brazing filler metal welding method comprises the following steps of 1)preparing the paste brazing filler metal; 2) preparing a foil; 3) cleaning SiCf/SiC and high-temperature alloy GH3536 base metal; 4) coating the paste brazing filler metal; 5) assembling a weld assembly; and 6) welding. By using a gold-copper-based brazing filler metal system, effective welding of SiCf/SiC and high-temperature alloy GH3536 can be achieved, a residual stress caused by a large performance difference of heterogeneous materials is effectively relieved, and high-temperature strength, satisfying basic technical indexes, of a joint is obtained.

Description

technical field [0001] The invention belongs to the technical field of welding, and in particular relates to a gold-copper-based solder and a welding method thereof. Background technique [0002] Silicon carbide fiber reinforced silicon carbide (SiC f / SiC) is a new type of material obtained by compounding SiC fiber and SiC matrix through special process means. It has outstanding characteristics such as high temperature resistance, high strength, corrosion resistance, wear resistance, and oxidation resistance. To a certain extent, the shortcomings of SiC itself, such as poor bending resistance and fracture toughness, are overcome. Therefore, SiC f / SiC is an ideal high-temperature resistant material, which is suitable for many fields such as military devices and satellite technology; but SiC f / SiC has poor processability, which greatly limits its application in large-size samples and complex-shaped components. Therefore, in the application process of this material, there...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/14B23K1/008
CPCB23K1/008B23K35/0222B23K35/3013
Inventor 马广璐林盼盼杜静林铁松何鹏
Owner SHENYANG LIMING AERO-ENGINE GROUP CORPORATION
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