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A kind of high stability solder paste and preparation method thereof

A high stability, solder paste technology, used in welding equipment, manufacturing tools, welding media, etc., can solve the problems of low solder joint toughness, unstable product quality, and difficult to disperse, etc., to improve dispersion and compatibility, enhance Storage stability, the effect of improving printing performance

Active Publication Date: 2021-07-27
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the large amount of bismuth metal contained in this type of solder paste, the toughness of the solder joints is low
Carbon nanotubes are developing into an excellent reinforcing phase for traditional solder paste due to their good mechanical, electrical and thermal properties. However, due to their nano-size effect and surface inertness, they are not easily dispersed in solder paste and have low solubility in solvents. , poor compatibility with other components, especially tin-bismuth series alloys, resulting in the inability to exert the toughening and reinforcing effect of carbon nanotubes in solder paste
[0004] In the current research, the surface metallization treatment of carbon nanotubes is often carried out to enhance the compatibility with tin alloys, but this method is complex in process, high in cost, and unstable in product quality.
The applicant found in the research that mixing carbon nanotubes with tin alloys in the form of pure substances to prepare solder, and then adding solder paste containing specific components can effectively improve the dispersion and compatibility of carbon nanotubes in solder paste However, on the one hand, this method has higher requirements on carbon nanometers, such as the number of carbon atomic layers, aspect ratio, surface defects, etc. On the other hand, although this method enhances the toughness of solder joints, However, the problem of storage stability of solder paste has not been solved

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  • A kind of high stability solder paste and preparation method thereof

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[0023] In some embodiments, the carbon nanotubes are modified carbon nanotubes, and the preparation method thereof includes the following steps: adding the carbon nanotubes into an ethanol solvent, adding a modifying agent under stirring, and heating the carbon nanotubes in a nitrogen atmosphere at 70 to 80 The modified carbon nanotubes are obtained by reacting at ℃ for 12-24 hours, filtering, washing and drying.

[0024] In some embodiments, the mass ratio of the modifying agent to carbon nanotubes is (0.15˜0.2):1; preferably, the mass ratio of the modifying agent to carbon nanotubes is 0.18:1.

[0025] In some embodiments, the modifying agent is a C12-C18 alkylsilane coupling agent. Examples of C12-C18 alkylsilane coupling agents include dodecyltrimethoxysilane (CAS No.: 3069-21-4), dodecyltriethoxysilane (CAS No.: 18536 -91-9), hexadecyltrimethoxysilane (CAS No.: 16415-12-6), hexadecyltriethoxysilane (CAS No.: 16415-13-7), octadecyltrimethylsilane Oxysilane (CAS No.: 3069...

Embodiment 1

[0046] This embodiment provides a high-stable solder paste. According to weight percentage, the raw materials of the high-stable solder paste include 84% solder and 16% solder paste;

[0047] Wherein, solder comprises 99.99wt% Sn42Bi58 alloy powder, 0.01wt% modified carbon nanotube, the preparation method of modified carbon nanotube comprises the following steps: carbon nanotube is added in ethanol solvent, according to modifier and carbon nanotube The mass ratio is 0.15:1, add hexadecyltrimethoxysilane as a modifier under stirring, react in a nitrogen atmosphere at 70°C for 18 hours, filter, wash, and dry to obtain the modified Carbon nanotubes, the carbon nanotubes were purchased from Nanjing Xianfeng Nano Material Technology Co., Ltd., the article number is 100222;

[0048] According to parts by weight, the solder paste includes 20 parts of rosin, 20 parts of solvent, 5 parts of active agent, 5 parts of thickener, and 1 part of auxiliary agent, wherein the rosin is hydrogen...

Embodiment 2

[0050] This embodiment provides a high-stable solder paste. According to weight percentage, the raw materials of the high-stable solder paste include 87% solder and 13% solder paste;

[0051] Wherein, solder comprises 99wt% Sn42Bi58 alloy powder, 1wt% modified carbon nanotube, the preparation method of modified carbon nanotube comprises the following steps: carbon nanotube is added in ethanol solvent, according to the mass ratio of modifying agent and carbon nanotube 0.2:1, add hexadecyltrimethoxysilane as a modifier under stirring, react for 18 hours under nitrogen atmosphere and 70°C, filter, wash, and dry to obtain the modified carbon nanometer The carbon nanotubes were purchased from Nanjing Xianfeng Nano Material Technology Co., Ltd., the article number is 100222;

[0052] According to parts by weight, the solder paste includes 50 parts of rosin, 40 parts of solvent, 15 parts of active agent, 10 parts of thickener, and 5 parts of auxiliary agent, wherein the rosin is hydr...

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Abstract

The invention relates to the technical field of electronic welding, in particular to a high-stable solder paste and a preparation method thereof. A kind of high stability solder paste, according to weight percentage, the raw material of described high stability solder paste comprises solder 84~87%, solder paste 13~16%; Described solder comprises tin-bismuth series alloy and carbon nanotube; The paste is used as a reference, and in parts by weight, the soldering flux includes 20-50 parts of rosin, 20-40 parts of solvent, 5-15 parts of active agent, 5-10 parts of thickener, and 1-5 parts of auxiliary agent. The present invention modifies the carbon nanotubes through the C12-C18 alkyl silane coupling agent, improves the dispersion and compatibility of the carbon nanotubes in the solder paste, avoids agglomeration and agglomeration, and enhances the storage of the solder paste Stability, and further enhance the storage stability of solder through specific solvents and activators, and improve the printing performance of solder paste, bright and full solder joints, good spreadability, and no residue.

Description

technical field [0001] The invention relates to the technical field of electronic welding, in particular to a high-stable solder paste and a preparation method thereof. Background technique [0002] With the development of electronic information products towards ultra-large-scale integration and miniaturization, solder paste has become the most important process material in surface mount technology (SMT). Traditional solder paste generally uses SAC series alloys (tin-silver-copper series alloys) as welding materials, and the welding temperature usually needs to be higher than 240°C. Problems such as device deformation are easy to occur during the welding process of highly integrated microelectronic devices. Solder paste with tin-bismuth series alloy as low-temperature solder is used. [0003] However, since this type of solder paste contains a large amount of bismuth metal components, the toughness of solder joints is low. Carbon nanotubes are developing into an excellent ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/14
CPCB23K35/025B23K35/262B23K35/264B23K35/3613B23K35/362
Inventor 陈钦宫梦奇梁少杰陈旭徐华侨张阳张义宾翁若伟
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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