Compound for packaging film, organic film packaging material and packaging film

A technology for encapsulating thin films and organic thin films, which is applied in the fields of compounds for encapsulating thin films, organic thin film encapsulating materials and encapsulating films, and can solve the problems of reduced flatness of inorganic films, etching, and poor water vapor barrier effects, etc.

Active Publication Date: 2020-04-17
JILIN OPTICAL & ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The inorganic film used in the existing thin-film packaging structure is evaporated by methods such as sputtering or vapor deposition (CVD) to generate plasma (plasma). When the surface is etched, the flatness of the inorganic film above will be reduced, and the blocking effect on water vapor will also be deteriorated.

Method used

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  • Compound for packaging film, organic film packaging material and packaging film
  • Compound for packaging film, organic film packaging material and packaging film
  • Compound for packaging film, organic film packaging material and packaging film

Examples

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preparation example Construction

[0056] The present invention provides a method for preparing a compound for encapsulating thin films described in the above technical solution, comprising the following steps:

[0057] reacting the compound having the structure of formula II with the compound having the structure of formula III at a molar ratio of 1:(n-1) to obtain a product having the structure of formula IV;

[0058] The R 4 Alkyl groups selected from hydrogen or C1-C30 or aromatic groups of C6-C30;

[0059] The R 1 An alkylene group selected from C1-C30 or an aromatic group of C6-C30;

[0060] 1≤n≤20;

[0061] The product having the structure of formula IV is reacted with the compound to obtain the product having the structure of formula V; the compound has the structure shown in formula 201 or formula 202:

[0062]

[0063] The R 5 Alkyl groups selected from hydrogen or C1-C30 or aromatic groups of C6-C30;

[0064]

[0065] reacting the product having the structure of formula V with the c...

Embodiment 1

[0105] According to the route shown in Reaction Formula 1: Add 85 g of phenyl isocyanate (Puyang Hongda Shengdao New Material Co., Ltd.) and 195 g of N-phenylethanolamine (Shanghai Mairuier Chemical Technology Co., Ltd.) into a 1L reaction bottle, and add two Dibutyltin laurate (DBTDL) catalyst (Shanghai Merrill Chemical Technology Co., Ltd.) 0.1g was added to the reaction system, heated to 120°C and stirred under reflux for 8 hours, after the temperature was lowered to room temperature, the excess components were evaporated to obtain 150g Compound 1:

[0106]

[0107] According to the route shown in Reaction Formula 2: Add 150g of compound 1 to 3.7L toluene (Tianjin Dickel Company), then add 187.2g of 2-bromoethyl acrylate (Alfa Aisha (China) Chemical Co., Ltd.) and After sodium tert-butoxide (Shanghai Merrill Chemical Technology Co., Ltd.), 5.6 g of tris(dibenzylideneacetone) dipalladium and 5.5 g of tri-tert-butylphosphine were added as catalysts, heated to 110° C. and k...

Embodiment 5

[0137] Add 110 g of butyl isocyanate (Shanghai Merrill Chemical Technology Co., Ltd.) and 165 g of 3-hydroxypropionic acid (Shanghai Merrill Chemical Technology Co., Ltd.) into a 500ml reaction bottle, stir at 70°C for 4 hours, add thionyl chloride ( Sinopharm Group) 165ml, continue to react at 70°C for 2h. After cooling down to room temperature, chloroform and water were added for liquid separation, and excess components were evaporated from the organic phase to obtain 140 g of compound 7 in chemical formula 4. Add 140g of compound 7 into a 1L reaction flask, add 173g of butylaminoethanol (TCI), stir at 70°C for 4h, add 165ml of thionyl chloride (Sinopharm Group), and continue the reaction at 70°C for 2h. After cooling down to room temperature, chloroform and water were added for liquid separation, and excess components were evaporated from the organic phase to obtain 170 g of compound 8.

[0138]

[0139] Add 170g of compound 8 to 3.7L toluene (Tianjin Dickel Company), t...

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Abstract

The invention provides a compound for a packaging film, an organic film packaging material and the packaging film. The compound for the packaging film has a structure shown in formula I, the compoundwith the structure shown in the formula I is tolerant to plasmas, when the compound and an inorganic layer are assembled into a packaging film, the surface can be prevented from being etched when inorganic film vapor deposition is carried out, high flatness is maintained, and then the packaging film has low water vapor transmission rate. The organic film prepared from the compound with the structure as shown in the formula I, at least two light-curable or heat-curable allyl compounds and an initiator has relatively high flatness. The WVTR of the packaging film is 2.8 * 10 <-4> g / m<2>*day to 5.5 * 10 <-4> g / m<2>*day; and the maximum etching degree Ra after etching is 14.8 nm.

Description

technical field [0001] The invention belongs to the technical field of encapsulation films, and in particular relates to a compound for encapsulation films, an organic film encapsulation material and an encapsulation film. Background technique [0002] An organic light-emitting display device includes an organic light-emitting device (OLED) composed of a hole-injecting electrode (anode), an organic light-emitting layer, and an electron-injecting electrode (cathode). This organic light-emitting device is usually provided on a glass substrate, and is covered with another substrate in order to prevent deterioration caused by inflow of moisture or oxygen from the outside. Recently, display devices including organic light-emitting display devices are getting thinner due to consumer demand, and organic light-emitting devices also apply Thin Film Encapsulation (TFE) to cover organic light-emitting devices in order to meet this demand. [0003] The thin-film packaging structure is ...

Claims

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Application Information

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IPC IPC(8): C07C269/02C07C269/06C07C271/28C07C271/16C08F220/22C08F222/22C08F220/04C08F222/14C08F220/36C09D133/16C09D133/02C09D135/02H01L51/52
CPCC07C271/28C07C271/16C08F220/22C08F220/04C08F222/1006C09D133/16C09D133/02C09D135/02H10K50/844C08F222/22
Inventor 尹恩心姜晓晨马晓宇于哲杜磊朴凤浩王辉
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
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