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A preparation method of substrate material for high thermal conductivity electronic packaging

A technology of electronic packaging and high thermal conductivity, applied in the field of preparation of substrate materials for high thermal conductivity electronic packaging, can solve the problems of insignificant increase in thermal conductivity and large thermal expansion coefficient, and achieve the effects of low cost, high thermal conductivity, and simple and easy process

Active Publication Date: 2021-10-29
NANJING ZHONGJIANG NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned problems in the prior art, the purpose of the present invention is to solve the technical problems in the prior art that the thermal conductivity of the substrate material for electronic packaging is not significantly improved and the thermal expansion coefficient is large at a low filler doping amount; the novel high thermal conductivity electronics of the present invention The substrate material for packaging is different from the traditional doping of powder directly. First, the organic polyurethane foam impregnation method is used to sinter the mesh porous alumina ceramics as the thermal conductive skeleton of the epoxy resin-based material, and then the surface is modified by the silane coupling agent to fill the ring. Oxygen resin potting, after high temperature curing, a ceramic / resin composite substrate material with good thermal conductivity is formed. At the same time, the invention provides a new type of interpenetrating network structure of substrate materials for electronic packaging. The ceramic skeleton formed by sintering greatly improves The interfacial thermal resistance between powders is reduced and the thermal conductivity is rapidly improved at a lower filling amount. Therefore, the special three-dimensional network porous structure prepared by the present invention is beneficial to Form a continuous heat conduction network, enhance the heat dissipation capacity of electronic component packaging materials and limit the free expansion of polymers

Method used

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  • A preparation method of substrate material for high thermal conductivity electronic packaging
  • A preparation method of substrate material for high thermal conductivity electronic packaging
  • A preparation method of substrate material for high thermal conductivity electronic packaging

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Experimental program
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Embodiment 1

[0027] 1) Preparatory steps: prepare ceramic slurry; polyurethane foam sponge, size is 48cm*48cm*20cm, volume density is 0.0286g / cm 3 ;PT-7016 type epoxy resin (A) and curing agent (B), the viscosity after mixing is 600cps, the curing time is 6h at 25°C, 1h at 50°C, and the volume resistivity (50HZ) is 1.6×10 15 Ω·cm; other preparation materials include epoxy resin defoamer XYS-6201 (foam breaking polyorganosiloxane), silicone mold, etc.

[0028]2) To make a mesh porous ceramic skeleton: use w(NaOH)=20% NaOH solution to treat the polyurethane foam for 3 hours, then wash and dry it with water, and use w(PVA)=5% PVA solution to the surface modified, and then the α-Al 2 o 3 The ceramic slurry prepared with powder as the main raw material is coated on the surface of the pretreated polyurethane foam, and then the reticular porous ceramic skeleton is prepared by extrusion, drying and calcination. The porosity of the prepared reticular porous ceramic skeleton is 92.5%. , bulk dens...

Embodiment 2

[0032] 1) Preparatory steps: prepare ceramic slurry; polyurethane foam sponge, size is 48cm*48cm*20cm, volume density is 0.0597g / cm 3 ;PT-7016 type epoxy resin (A) and curing agent (B), the viscosity after mixing is 600cps, the curing time is 6h at 25°C, 1h at 50°C, and the volume resistivity (50HZ) is 1.6×10 15 Ω·cm; other preparation materials include epoxy resin defoamer XYS-6201 (foam breaking polyorganosiloxane), silicone mold, etc.

[0033] 2) To make a mesh porous ceramic skeleton: use w(NaOH)=20% NaOH solution to treat the polyurethane foam for 3 hours, then wash and dry it with water, and use w(PVA)=5% PVA solution to the surface modified, and then the α-Al 2 o 3 The ceramic slurry prepared with powder as the main raw material is coated on the surface of the pretreated polyurethane foam, and then the reticular porous ceramic skeleton is prepared by extrusion, drying and calcination. The porosity of the prepared reticular porous ceramic skeleton is 88.3%. , bulk den...

Embodiment 3

[0037] 1) Preparatory steps: prepare ceramic slurry; polyurethane foam sponge, the size is 48cm*48cm*20cm; PT-7016 epoxy resin (A) and curing agent (B), the viscosity after mixing is 600cps, and the curing time is 25°C 6h, 1h at 50°C, volume resistivity (50HZ) 1.6×10 15 Ω·cm; silane coupling agent KH-560; other preparation materials include epoxy resin defoamer XYS-6201 (foam breaking polyorganosiloxane), silicone mold, etc.

[0038] 2) To make a mesh porous ceramic skeleton: use w(NaOH)=20% NaOH solution to treat the polyurethane foam for 3 hours, then wash and dry it with water, and use w(PVA)=5% PVA solution to the surface modified, and then the α-Al 2 o 3 The ceramic slurry prepared with powder as the main raw material is coated on the surface of the pretreated polyurethane foam, and then the reticular porous ceramic skeleton is prepared by extrusion, drying and calcination. The porosity of the prepared reticular porous ceramic skeleton is 88.3%. , bulk density 0.78g / cm...

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Abstract

The invention discloses a preparation method of a substrate material for electronic packaging with high thermal conductivity, which uses an organic polyurethane foam impregnation method to sinter to form a mesh-like porous alumina ceramic as a thermally conductive skeleton of an epoxy resin-based material, and then undergoes surface modification with a silane coupling agent. It is filled with epoxy resin and sealed at high temperature to form a ceramic / resin composite substrate material with good thermal conductivity. The invention belongs to the field of substrate materials for electronic packaging. Aiming at the problem that the current ceramic / resin composite materials cannot form a heat conduction network under low filler content, the organic foam impregnation method is used to construct a network porous structure, and then the surface is modified. Lightweight composite substrate materials are prepared by techniques such as pressure impregnation, which achieves the purpose of improving the thermal conductivity of the composite material and greatly reducing the coefficient of thermal expansion under the condition of a low ceramic volume fraction. The invention is simple in operation and low in cost. It has excellent performance and is suitable for large-scale promotion.

Description

technical field [0001] The invention belongs to the field of substrate materials for electronic packaging, and specifically refers to a preparation method of a substrate material for electronic packaging with high thermal conductivity. Background technique [0002] In recent years, with the rapid development of electronic integration technology and the continuous increase in assembly density, electronic components have developed in the direction of lightness, thinness, and smallness, resulting in a large amount of heat accumulation in electronic components within a small volume range. High temperature will affect the performance of electronic components and lead to their failure, so it is particularly important to develop high thermal conductivity materials to reduce the operating temperature of electronic components. Polymers have been widely used in electronic device packaging due to their low cost, electrical insulation, corrosion resistance, and strong operability. Howe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K9/00C08K9/06C08K7/24
CPCC08K7/24C08K9/00C08K9/06C08L63/00
Inventor 傅仁利吴彬勇黄义炼邹燕清刘后宝
Owner NANJING ZHONGJIANG NEW MATERIAL TECH