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Fluorine-containing epoxy resin composite material and applications thereof

A technology of epoxy resin and composite materials, which is applied in the field of composite materials, can solve the problems of limited application, low polarity of resin structure, poor dielectric properties of epoxy resin, etc., and achieve excellent dielectric properties, low signal loss, good durability thermal effect

Pending Publication Date: 2020-05-01
GUANGDONG HINNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dielectric properties of epoxy resin are relatively poor, and the signal attenuation characteristics at high frequencies can no longer meet the strict high-frequency transmission requirements, and cannot meet the high-end applications, especially the requirements of high-frequency printed circuit boards, making it Applications are subject to certain limitations
[0004] The fluorine-containing modified epoxy resin is introduced into the resin structure by F, which reduces the polarity of the resin structure, effectively reduces the dielectric constant of the material, and makes it have excellent dielectric properties; however, the fluorine-containing modified epoxy resin The mechanical properties are poor, and the cost is high. The commercially available fluorine-containing epoxy resin is much more expensive than epoxy resin, and the high one reaches several hundred yuan / kg, or even thousands of yuan / kg, which limits its application.

Method used

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  • Fluorine-containing epoxy resin composite material and applications thereof
  • Fluorine-containing epoxy resin composite material and applications thereof
  • Fluorine-containing epoxy resin composite material and applications thereof

Examples

Experimental program
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preparation example Construction

[0041] The preparation method of above-mentioned fluorine-containing epoxy resin is as follows:

[0042] The molar ratio of hexafluorobisphenol A to epichlorohydrin is 1:1 to 1:10, the amount of phase transfer catalyst added is 0.5 to 2% of the mole of hexafluorobisphenol A, bisphenol AF, epichlorohydrin Put the phase transfer catalyst into the reaction container, mix and stir, and react in the temperature range of 65-75° C. for 65-70 hours to obtain the crude product of fluorine-containing epoxy resin (DGEBF).

[0043] Add hot distilled water (water temperature is 20°C to 80°C) to the crude product of DGEBF for washing, that is, washing with water, extracting and stratifying, removing the phase transfer catalyst, and then distilling under reduced pressure in a vacuum of 400Pa to 1000Pa to remove the extra amount of epichlorohydrin. Solvent, and finally add a sufficient amount of desiccant to obtain fluorine-containing epoxy resin after drying.

[0044] Described phase transf...

Embodiment 1

[0080] This embodiment provides a fluorine-containing epoxy resin composite material, a prepreg, a laminate and a metal-clad copper foil laminate.

[0081] (1) Preparation of fluorine-containing epoxy resin: Take 7.6 parts of hexafluorobisphenol A, 42.3 parts of epichlorohydrin, and 0.1 part of benzyltrimethylammonium chloride. Wherein, the molar ratio of hexafluorobisphenol A to epichlorohydrin is 1:10, and the added amount of benzyltrimethylammonium chloride is 1% of the hexafluorobisphenol A mole.

[0082] Mix the three raw materials, stir, raise the temperature to 65-75° C., and react in this temperature range for 65-70 hours to obtain a crude product of fluorine-containing epoxy resin (DGEBF). Add hot distilled water with a water temperature of 20°C to 80°C to the crude product of DGEBF for water washing, extraction and stratification, remove the phase transfer catalyst, then distill under reduced pressure to remove the extra solvent of epichlorohydrin, and finally add a ...

Embodiment 2

[0088] This embodiment provides a fluorine-containing epoxy resin composite material, a prepreg, a laminate and a metal-clad copper foil laminate.

[0089] (1) The fluorine-containing epoxy resin obtained in Example 1 is directly used as the fluorine-containing epoxy resin of this embodiment.

[0090] (2) Preparation of fluorine-containing epoxy resin composite material: Mix cyclohexanone and propylene glycol methyl ether at a volume ratio of 1:1 to obtain a mixed solvent, stir, and add 40 parts of fluorine-containing epoxy resin and 40 parts of DCPD DCPD to the mixed solvent Epoxy resin, 65 parts of anhydride curing agent, 0.8 part of 2-methylimidazole accelerator and 150 parts of silicon micropowder were stirred evenly to prepare a glue solution, and fluorine-containing epoxy resin composite material 2 was obtained.

[0091] (3) Preparation of prepreg: After the above-mentioned fluorine-containing epoxy resin composite material 2 is stirred evenly, 2116 glass fiber cloth (ba...

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Abstract

The invention relates to a fluorine-containing epoxy resin composite material and applications thereof. The fluorine-containing epoxy resin composite material is prepared from the following raw materials in parts by weight: 40-120 parts of a fluorine-containing epoxy resin, 40-100 parts of a functional epoxy resin, 60-200 parts of a curing agent, 0.1-3 parts of a curing accelerator, and 5-300 parts of a filler, wherein the structural general formula of the fluorine-containing epoxy resin is represented by a formula (1), and n is an integer and is greater than or equal to 1. According to the invention, a fluorine-containing epoxy resin and a functional epoxy resin are used at the same time, and the characteristics of the epoxy resin and the fluorine-containing modified epoxy resin are integrated, so that the dielectric property of the fluorine-containing epoxy resin composite material can be remarkably improved, the cohesiveness, the water resistance, the heat resistance and the like ofthe fluorine-containing epoxy resin composite material can be synergistically improved, and the prepared fluorine-containing epoxy resin composite material is low in dielectric constant, low in waterabsorption and good in cohesiveness.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a fluorine-containing epoxy resin composite material and its application. Background technique [0002] With the development of wireless transmission products and high-frequency transmission technology, electronic products are required to maintain good transmission quality and avoid signal attenuation, reflection and delay. The dielectric constant of the material of the insulating layer in contact with the conductive lines in the circuit board is an important factor affecting the matching of high-frequency transmission impedance. In order to achieve high-frequency signal transmission impedance matching, the material of the insulating layer in contact with the conductive lines in the circuit board needs Materials with a low dielectric constant. [0003] As a material with excellent comprehensive properties, epoxy resin has the advantages of excellent physical and mechanical pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/00C08K3/36C08K7/28C08J5/24B32B15/20B32B15/14B32B17/04B32B17/02B32B17/06B32B33/00B32B37/10B32B37/06
CPCC08L63/00C08J5/24B32B15/20B32B15/14B32B5/02B32B17/061B32B37/10B32B37/06C08J2363/02C08J2463/00C08J2463/02C08J2363/00C08L2205/025C08L2201/08B32B2260/021B32B2260/046B32B2255/02B32B2255/26B32B2262/101B32B2307/204B32B2307/306B32B2457/00B32B2457/08C08K3/36C08K7/28
Inventor 漆小龙胡志辉布施健明梁荣强
Owner GUANGDONG HINNO TECH CO LTD