Laser directly moulded resin composition with improved impact resistance, and preparation method and application thereof

A technology of laser direct molding and resin composition, applied in the field of laser direct molding resin composition and its preparation, can solve the problems of low impact strength and toughness, and achieve the effects of improving impact toughness, good technical effect, and improved impact resistance.

Inactive Publication Date: 2020-05-01
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] One of the technical problems to be solved by the present invention is the low impact strength and toughness of polymer composite materials that can be used for laser direct structuring in the prior art after adding laser activators, and a laser direct structuring with improved impact resistance is provided. resin composition

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0043] The preparation of the laser direct structuring resin composition of impact resistance improvement: polyamide 6 chips (PA6, 250 ℃, 2160g melt index 9.3g / 10min) and ethylene-propylene copolymer graft maleic anhydride copolymer ( EPGM, ethylene content 82.0%, propylene content 18.0%, grafting rate 1.2%) total 93 parts, silicone powder 2 parts, basic copper phosphate 5 parts, tetrakis[β-(3,5-di-tert-butyl-4 0.8 parts of -hydroxyphenyl)propionic acid] pentaerythritol ester and 1 part of white oil were put into a high mixer for blending treatment, and the mixing time was 1 minute. The mixed materials were introduced into a LABTECH co-rotating twin-screw extruder (screw diameter 16 mm, aspect ratio 40), and laser direct structuring resin compositions I-III were obtained through melt kneading and extrusion granulation. The processing parameters are shown in Table 1.

[0044] Table 1

[0045] Example combination PA6 / copy EPGM / part Processing temperature / ℃ Scr...

Embodiment 4-6

[0054] Preparation of laser direct structuring resin composition with improved impact resistance: 84 parts of dry-treated polyamide 6 chips (PA6, 250°C, 2160g melt index 9.3g / 10min), ethylene-vinyl acetate copolymer grafted with maleate Anhydride copolymer (EVGM, ethylene content 80.0%, vinyl acetate content 20.0%, grafting rate 1.3%) or ethylene-octene copolymer grafted maleic anhydride copolymer (OEGM, ethylene content 87.0%, octene content 13.0 %, grafting rate 0.8%) or polyethylene grafted maleic anhydride copolymer (PEGM, grafting rate 0.8%) 9 parts, silicone powder 2 parts, basic copper phosphate 5 parts, four [β-(3, 0.8 parts of 5-di-tert-butyl-4-hydroxyphenyl)propionic acid] pentaerythritol ester and 1 part of white oil were put into a high-mixer for blending treatment, and the mixing time was 1 minute. The mixed materials were introduced into a LABTECH co-rotating twin-screw extruder (screw diameter: 16 mm, aspect ratio: 40), and laser direct structuring resin composi...

Embodiment 7-8

[0065] Preparation of laser direct structuring resin composition with improved impact resistance: 84 parts of dry-treated polyamide 6 chips (PA6, 250°C, 2160g melt index 9.3g / 10min), ethylene-methyl acrylate-maleic anhydride copolymer (EAM, 84.0% ethylene content, 15.0% methyl acrylate content, 1.0% maleic anhydride content) or ethylene-glycidyl acrylate-maleic anhydride copolymer (EGM, 89.0% ethylene content, 10.2% glycidyl acrylate content , maleic anhydride content 0.8%) 9 parts, silicone powder 2 parts, basic copper phosphate 5 parts, tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester 0.8 1 part, 1 part of white oil, put into a high-mixer for blending treatment, and the mixing time is 1 minute. The mixed materials were introduced into a LABTECH co-rotating twin-screw extruder (screw diameter: 16 mm, aspect ratio: 40), and laser direct structuring resin compositions VII-VIII were obtained through melt kneading and granulation. The processing ...

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Abstract

The invention relates to a laser directly moulded resin composition with improved impact resistance as well as a preparation method and application thereof, and mainly solves the problems of low impact strength and low toughness of a polymer composite material capable of being used for laser direct moulding in the prior art. The laser directly moulded resin composition comprises the following components in parts by weight: 50-90 parts of thermoplastic resin; 1-15 parts of a laser activator; 3-15 parts of a toughening compatilizer; 0.1 to 5 parts of a surface modifier; and 1-20 parts of an auxiliary agent; wherein the toughening compatilizer is selected from at least one of a maleic anhydride grafted copolymer, an ethylene-maleic anhydride copolymer, an ethylene-propylene-maleic anhydride copolymer, an ethylene-octene-maleic anhydride copolymer, an ethylene-vinyl acetate-maleic anhydride copolymer and an ethylene-acrylate-maleic anhydride copolymer. The problems are well solved, and thecomposition can be applied to fields such as communication, electronics, automobiles, medicines, spaceflight, and the like.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and relates to a laser direct molding resin composition with improved impact resistance and a preparation method thereof. The laser direct molding resin composition with improved impact resistance is suitable for components such as communications, electronics, automobiles, medical treatment, and aerospace. Background technique [0002] Laser Direct Structuring is a 3D molded interconnect device production technology that combines processing modification, injection molding, laser laser and chemical plating process. The principle is to endow general-purpose plastic components, circuit boards, etc. with electrical interconnection functions, so that in addition to supporting and protecting functions, plastic shells and structural devices also have functions such as shielding and antennas produced by combining conductive circuits. [0003] Laser direct structuring materials are mainly plast...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/02C08L51/06C08L77/06C08L23/08C08K3/32
CPCC08L77/02C08K2003/328C08L51/06C08K3/32C08L77/06C08L23/0853
Inventor 于志省白瑜王洪学
Owner CHINA PETROLEUM & CHEM CORP
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