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Conductive adhesive with high adhesive strength and low contact resistance and heterojunction imbricated solar module prepared therefrom

A low-contact resistance, solar module technology, used in electrical components, conductive adhesives, semiconductor devices, etc., can solve the problem of only the adhesion of conductive adhesives, and achieve the effect of high adhesion

Active Publication Date: 2020-05-08
苏州瑞力博新材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent application number authorization announcement number CN109439268A, the invention patent published on March 08, 2019 provides a multifunctional polybutadiene polyurethane acrylate and multifunctional VTBN as the base resin, and peroxide as the initiator The acrylic of the agent is used for the conductive adhesive of the shingled components, but the adhesive force of the conductive adhesive is only 4Mpa

Method used

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  • Conductive adhesive with high adhesive strength and low contact resistance and heterojunction imbricated solar module prepared therefrom
  • Conductive adhesive with high adhesive strength and low contact resistance and heterojunction imbricated solar module prepared therefrom

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The preparation method of the low-density, high-adhesive, low-contact-resistance conductive adhesive of the present embodiment is to accurately weigh 350 grams of bisphenol A epoxy resin and 20 grams of alkyl polyester dimethyl siloxane and fully mix them. Continue to add 620 grams of flaky silver powder under the condition of double planetary stirring at 0-30° C., with an average particle size of 10 μm and a bulk density of 2.5 grams per cubic centimeter. Stir for 60 minutes to ensure that the silver powder is evenly dispersed in the epoxy resin, then add 20 grams of 1,3-diisopropylimidazolium tetrafluoroborate and stir for 10 minutes, vacuum defoaming to obtain epoxy resin for shingled solar modules Conductive adhesive, the specific characteristics are as follows:

[0020] Viscosity: 209,800mPa.s

[0021] Adhesive strength: 13MPa (adhesive substrate is aluminum)

[0022] Density: 2.1 g / cm3

[0023] Curing speed: 25 seconds (150°C)

[0024] Volume resistivity: 4.4×...

Embodiment 2

[0032] The preparation method of the low-density, high-adhesion, low-contact resistance conductive adhesive of this embodiment is to accurately weigh 160 grams of bisphenol F type epoxy resin and 4 grams of polyether-modified polysiloxane and fully mix them. Continue to add 330 grams of spherical silver powder under the condition of double planetary stirring at 30° C., with an average particle size of 7 μm and a bulk density of 3.3 grams per cubic centimeter. Stir for 60 minutes to ensure that the silver powder is evenly dispersed in the epoxy resin, then add 8 grams of 1,3-diisopropylimidazolium tetrafluoroborate and stir for 10 minutes, vacuum degassing to obtain epoxy resin for shingled solar modules Conductive adhesive, the specific characteristics are as follows:

[0033] Viscosity: 168,800mPa.s

[0034] Adhesive strength: 16MPa (adhesive substrate is aluminum)

[0035] Density: 2.9 g / cm3

[0036] Curing speed: 30 seconds (150°C)

[0037] Volume resistivity: 6.6×10 -4 ...

Embodiment 3

[0045] The preparation method of the low-density, high-adhesive, low-contact-resistance conductive adhesive of this embodiment is to accurately weigh 700 grams of epoxy-type epoxy resin and 30 grams of alkyl dimethyl siloxane and mix them thoroughly. Continue to add 1200 grams of flake silver powder under the condition of double planetary stirring at ℃, the average particle size is 3um, and the bulk density is 1.5 grams per cubic centimeter. Stir for 60 minutes to ensure that the silver powder is evenly dispersed in the epoxy resin, then add 50 grams of 1,3-diisopropylimidazolium tetrafluoroborate and stir for 10 minutes, vacuum defoaming to obtain epoxy resin for shingled solar modules Conductive adhesive, the specific characteristics are as follows:

[0046] Viscosity: 176,500mPa.s

[0047] Adhesive strength: 12MPa (adhesive substrate is aluminum)

[0048] Density: 1.4 g / cm3

[0049] Curing speed: 20 seconds (150°C)

[0050] Volume resistivity: 3.2×10 -4 Ω.cm

[0051] ...

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Abstract

The invention relates to a conductive adhesive with high adhesive strength and low contact resistance and a heterojunction imbricated solar module prepared therefrom. The conductive adhesive comprisesan epoxy resin monomer, silver powder, a thixotropic agent and a latent curing agent, wherein the weight percentage of the epoxy resin monomer in the conductive adhesive with high bonding force and low contact resistance is 20-60%; the weight percentage of the silver powder in the conductive adhesive with high bonding force and low contact resistance is 40-80%; the weight percentage of a curing initiator in the conductive adhesive with high bonding force and low contact resistance is 0.1-3%; and the weight percentage of the thixotropic agent in the conductive adhesive with high bonding forceand low contact resistance is 0.01-4%. The conductive adhesive provided by the invention has the following beneficial effects: an epoxy conductive adhesive with high adhesive strength is prepared by innovatively using a tetrafluoroboric acid latent curing agent; meanwhile, the thixotropic agent with a special structure is selected to improve the contact characteristic of the conductive adhesive and the surface of a heterojunction solar cell, so the contact resistance of the conductive adhesive and the heterojunction solar cell is greatly reduced.

Description

technical field [0001] The invention relates to the field of polymer-based conductive materials, in particular to a high-adhesive, low-contact-resistance conductive adhesive and a heterojunction shingled solar module prepared therefrom. Background technique [0002] Heterojunction solar cells are a new type of high-efficiency solar power generation technology. Heterojunction cells have been setting new world records for the conversion efficiency of mass-produced solar cells. The process temperature of the battery is low, the structure of the upper and lower surfaces is symmetrical, there is no mechanical stress, and the thinning can be smoothly realized, which has great potential in the future solar industry. However, the surface of the heterojunction solar cell is coated with an amorphous silicon layer, and the amorphous silicon layer cannot withstand high temperatures, so it is difficult to use conventional welding processes to complete the heterojunction solar cell when p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02H01L31/05
CPCC08K2003/0806C08K2201/001C08K2201/003C09J9/02C09J163/00H01L31/0512C08K7/00C08K3/08C08K7/18Y02E10/50
Inventor 孙玉海宋艳李宇婷
Owner 苏州瑞力博新材科技有限公司