Silicon-based three-dimensional integrated microwave frequency conversion assembly

Abstract

The invention discloses a silicon-based three-dimensional integrated microwave frequency conversion assembly. The frequency conversion assembly comprises a pre-selection filtering gain control assembly arranged on the lower layer and a frequency mixing digital sampling assembly arranged on the upper layer, the pre-selection filtering gain control assembly is an independent module of a silicon-based packaging structure, a chip is arranged in a cavity in a silicon substrate, and BGA array bonding pads are arranged at the bottom and the top of the silicon substrate. The pre-selection filtering gain control assembly is used for carrying out pre-selection filtering, gain control and phase adjustment on an externally input signal and providing a radio frequency channel for transmitting to an upper layer; and the frequency mixing digital sampling assembly is an independent silicon-based self-sealing module, a chip is arranged in a cavity in the silicon substrate, and a high-temperature BGA array solder ball is arranged at the bottom of the chip. The frequency mixing digital sampling assembly converts an input high-frequency signal into a low-frequency signal, then samples and shapes the signal, and outputs a digital signal to the outside. According to the invention, the transmission quality of microwave and millimeter wave signals is improved, and the silicon-based three-dimensional integrated microwave frequency conversion assembly has the advantages of the small size, low power consumption and high precision and stability.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a silicon-based three-dimensional integrated microwave frequency conversion component. Background technique [0002] With the advancement of monolithic integrated circuit technology, new electronic materials and assembly and interconnection technology, solid-state active phased array technology and high-sensitivity superheterodyne receivers have been more and more widely used in military and civilian electronic equipment. , a large number of miniaturized, lightweight, highly reliable, multi-functional and low-cost microwave front-end components have become an urgent need. [0003] The traditional assembly process has been relatively mature, but in the face of the demand for high-density integration of micro-systems, shortcomings have gradually been exposed, which is reflected in the fact that almost all processes are heated as a whole, overly dependent on tempera...

AI Technical Summary

Problems solved by technology

[0003] The traditional assembly process has been relatively mature, but in the face of the demand for high-density integration of microsystems, its shortcomings are gradually exposed, which is reflected in the fact that almost all processes are heated as a whole, overly dependent on temperature gradients, insufficient process compatibility, and manufacturing accuracy. low level problem

For example, if the substrate designed and manufactured by LTCC process is uneven in circuit design or sintering temperature, different degrees of board surface warping will occur, which greatly limits the application of LTCC process. In a phased array frequency conversion system, it is difficult to guarantee the amplitude and phase consistency between components

For example, the substrate made by Rogers 4350 hybrid lamination technology, the precision of standard printing process can only reach 0.1mm, and the structural design of the blind hole between the layers needs to be gold-plated at the end of the whole plate, so the reliability of gold-plating in the hole is difficult to guarantee. In the application of specialized frequency conversion components, it often leads to low yield rate in mass production

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