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Synergistic Silicon Modified Phenolic Resin Adhesive and Preparation of Reconstituted Wood

A phenolic resin, silicon modification technology, used in adhesives, aldehyde/ketone condensation polymer adhesives, wood compression and other directions, can solve problems such as cracking, improve bonding strength, rich raw material sources, reduce saturated water absorption Effect

Active Publication Date: 2022-04-08
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The great challenge faced by recombined wood comes from serious problems such as bond strength and water swelling and cracking after recombination

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The preparation process of silicon-modified phenolic resin is: 100 parts of phenol, 140 parts of 36.7% formaldehyde solution, 6 parts of 32% sodium hydroxide solution, 30 parts of water, in a 500ml four-necked flask equipped with a spherical condenser, a thermometer and a stirring device Add metered phenol and sodium hydroxide solution, stir at 40°C for 40 minutes, then add formaldehyde dropwise, raise the temperature to 50°C and stir for 100 minutes, continue to raise the temperature to 70°C and stir for 100 minutes, and finally raise the temperature to 80°C and stir for 60 minutes , add water and 2 parts of sodium methyl silicate, and cool to room temperature to obtain a silicon-modified phenolic resin; the viscosity range of the silicon-modified phenolic resin is 1 cps, the free formaldehyde is 0.25%, and the content of free phenol is 2.5%.

[0027] Synergistic silicon-modified phenolic resin: 100 parts of phenolic resin, adhesive controllable introduction agent (fatt...

Embodiment 2

[0031] The preparation process of silicon-modified phenolic resin is: 100 parts of phenol, 150 parts of 36.7% formaldehyde solution, 18 parts of 32% sodium hydroxide solution, 30 parts of water, in a 500ml four-necked flask equipped with a spherical condenser, a thermometer and a stirring device Add metered phenol and sodium hydroxide solution, stir at 40°C for 60 minutes, then add formaldehyde dropwise, raise the temperature to 50°C and stir for 140 minutes, continue to raise the temperature to 70°C and stir for 150 minutes, and finally raise the temperature to 80°C and stir for 120 minutes , add water and 5 parts of sodium methyl silicate, 5 parts of potassium methyl silicate, cool to room temperature, obtain silicon-modified phenolic resin; the viscosity of silicon-modified phenolic resin is 12cps, free formaldehyde 0.12%, the content of free phenol 1.2 %.

[0032] Synergistic silicon-modified phenolic resin: 100 parts of phenolic resin, 3 parts of adhesive controllable int...

Embodiment 3

[0036]The preparation process of silicon-modified phenolic resin is: 100 parts of phenol, 145 parts of 36.7% formaldehyde solution, 12 parts of 32% sodium hydroxide solution, 30 parts of water, in a 500ml four-necked flask equipped with a spherical condenser, a thermometer and a stirring device Add metered phenol and sodium hydroxide solution, stir at 40°C for 50 minutes, then add formaldehyde dropwise, raise the temperature to 50°C and stir for 120 minutes, continue to heat up to 70°C and stir for 120 minutes, and finally raise the temperature to 80°C and stir for 100 minutes , add water and 4 parts of sodium methyl silicate, 2 parts of potassium methyl silicate, cool to room temperature, obtain silicon-modified phenolic resin; The viscosity of phenolic resin I is 8cps, free formaldehyde 0.18%, the content of free phenol 2.0%.

[0037] Synergistic silicon-modified phenolic resin: 100 parts of phenolic resin, 2 parts of adhesive controllable introduction agent (sodium diisobuty...

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Abstract

The invention relates to a silicon-modified phenolic resin adhesive and the preparation of recombined wood by using the adhesive. Silicon-modified phenolic resin is modified with methyl silicic acid. In order to improve the bonding effect of silicon-modified phenolic resin, a controllable adhesive introduction agent is added, and the controllable introduction of adhesive technology is used to greatly improve the silicon-modified phenolic resin. Modified phenolic resin prepared the bond strength and water repellency of recombined wood, and reduced the saturated water absorption of recombined wood.

Description

technical field [0001] The invention relates to the preparation of a synergistic silicon-modified phenolic resin adhesive and recombined wood, which belongs to one of the hot spots in the field of natural polymer materials. Background technique [0002] High-performance recombinant wood is a new type of high-performance natural polymer composite material made of plantation wood as raw material, with cells as the basic unit, through directional recombination and resin compounding, which can overcome the small diameter of plantation wood, soft material, Defects such as low strength and uneven material have the characteristics of controllable performance, designable structure, and adjustable specifications. It is one of the effective ways to use small materials and make better use of inferior materials. One of the hot spots. [0003] The great challenge faced by recombined wood comes from serious problems such as bond strength and water swelling and cracking after recombinatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J161/14C09J4/06C09J11/06C09J11/08C08G8/32C08G8/10B27K3/36B27K3/32B27M1/02
CPCC09J161/14C09J4/06C09J11/06C09J11/08C08G8/32C08G8/10B27K3/36B27K3/32B27M1/02C08L71/02C08K5/42
Inventor 马凤国向靖宇刘春霞
Owner QINGDAO UNIV OF SCI & TECH
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