Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polyimide, polyimide film and preparation method thereof

A polyimide film and polyimide technology, applied in the field of film materials, can solve the problems of backward commercialization of polyimide, high melting temperature, and high technical threshold, and achieve significant charge transfer, uniform arrangement, and increase in The effect of a large degree of coloration

Pending Publication Date: 2020-05-29
JILIN OPTICAL & ELECTRONICS MATERIALS
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the high melting temperature, high melt viscosity, and high technical threshold of most polyimide materials, the commercialization of polyimide is relatively backward. Therefore, in order to overcome the technical difficulties of polyimide, provide a A polyimide with superior synthesis method and excellent performance is a problem urgently needed by those skilled in the art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide, polyimide film and preparation method thereof
  • Polyimide, polyimide film and preparation method thereof
  • Polyimide, polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] This embodiment provides a kind of polyimide and film thereof, and the chemical structural formula of polyimide is as follows (formula 1 in the summary of the invention):

[0045]

[0046] The preparation method of this polyimide film comprises the following steps:

[0047] (1) Under nitrogen protection, in the mixed solution of p-phenylenediamine (p-PDA, 10.81g, 0.10mol) and N-methylpyrrolidone (200mL) which is stirring, according to 1(4.66g):2( 9.32g): 3 (13.97g) monomer mass ratio Add 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA, 27.95g, 0.095mol) three times for condensation reaction, wherein, The reaction temperature was 30° C., the stirring rate was 200 rpm, and the reaction time was 8 hours to obtain a polyamic acid solution.

[0048] (2) Take 20 mL of the polyamic acid solution obtained above and apply it evenly on a glass plate, place it on a hot plate at 100° C. for drying for 1 hour, and then peel it off from the glass plate to obtain a self-supp...

Embodiment 2

[0051] This embodiment provides a kind of polyimide and film thereof, and the chemical structural formula of polyimide is as follows (formula 1 in the summary of the invention):

[0052]

[0053] The preparation method of this polyimide film comprises the following steps:

[0054] (1) Under nitrogen protection, in a stirred mixed solution of p-phenylenediamine (p-PDA, 10.81g, 0.10mol) and N,N-dimethylacetamide (200mL), according to 1 (4.66g ):2(9.32g):3(13.97g) monomer mass ratio Add 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA, 27.95g, 0.095mol) three times for condensation Reaction, wherein, the reaction temperature is 30°C, the stirring rate is 300rmp, and the reaction time is 8h to obtain a polyamic acid solution.

[0055] (2) Take 20 mL of the polyamic acid solution obtained above and apply it evenly on a glass plate, place it on a hot plate at 100° C. for drying for 1 hour, and then peel it off from the glass plate to obtain a self-supporting film.

[0056] (...

Embodiment 3

[0058] This embodiment provides a kind of polyimide and film thereof, and the chemical structural formula of polyimide is as follows (formula 1 in the summary of the invention):

[0059]

[0060] The preparation method of this polyimide film comprises the following steps:

[0061] (1) Under nitrogen protection, in the mixed solution of p-phenylenediamine (p-PDA, 10.81g, 0.10mol) and dimethylformamide (200mL) which is stirring, according to 1(4.66g):2( 9.32g): 3 (13.97g) monomer mass ratio Add 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA, 27.95g, 0.095mol) three times for condensation reaction, wherein, The reaction temperature was 30° C., the stirring rate was 500 rpm, and the reaction time was 8 hours to obtain a polyamic acid solution.

[0062] (2) Take 20 mL of the polyamic acid solution obtained above and apply it evenly on a glass plate, place it on a hot plate at 100° C. for drying for 1 hour, and then peel it off from the glass plate to obtain a self-suppor...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thermal expansion coefficientaaaaaaaaaa
Login to View More

Abstract

The invention discloses polyimide, a polyimide film and a preparation method thereof, and belongs to the technical field of film materials. The structural general formula of the polyimide is shown inthe specification, wherein Ar1 represents a tetravalent organic group with a C10-C64 aromatic ring group or alicyclic group; Ar2 represents a divalent organic group having a C6-C60 aromatic ring group. According to the polyimide disclosed in the embodiment of the invention, a coplanar rigid structure and a twisted non-coplanar rigid structure are introduced into a main chain structure; compared with the prior art, the advantages are that the intermolecular acting force of polyimide can be improved, the intermolecular conjugation effect is obvious, intramolecular and intermolecular charge transfer is obvious, meanwhile, molecular chains are uniformly arranged, and the rigidity effect of the polyimide molecular chains and the coloring degree of the film are improved, so that the polyimide film with excellent heat resistance and mechanical strength can be prepared.

Description

technical field [0001] The invention relates to the technical field of film materials, in particular to a polyimide, a polyimide film and a preparation method thereof. Background technique [0002] Polyimides obtained from tetracarboxylic dianhydrides and diamines, especially aromatic polyimides obtained from aromatic tetracarboxylic dianhydrides and aromatic diamines, have excellent mechanical properties and thermal properties, fully satisfying The demand for high-performance engineering plastics in the fields of aerospace, electronics, machinery, and automobiles has received more and more attention and applications. [0003] Generally, polyimide is formed polyimide film by applying polyamic acid solution on, for example, the surface of a substrate, and then heating the polyamic acid solution composition at high temperature to perform dehydration / ring closure (imidization). . [0004] However, due to the high melting temperature, high melt viscosity, and high technical th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1067C08G73/1007C08G73/1071C08G73/105C08J5/18C08J2379/08
Inventor 马晓宇贺金新王钊张婷汪康赵贺王辉
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com