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Transparent polyimide film and preparation method thereof

A technology of transparent polyimide and polyimide film, which is applied in the field of polymer materials, can solve problems such as damage to the bending resistance of transparent composite films, affecting the stability of film performance, and poor surface adhesion. To achieve the effect of solving the problem of easy falling off or breaking, improving the adhesive force and improving the bonding strength

Inactive Publication Date: 2020-06-05
WUXI CHUANGCAI OPTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface adhesion of polyimide film, especially the fluorine-containing system, is not good, and the compounding with silicon-based coatings brings obvious interface adhesion problems, resulting in the bending resistance of transparent composite films. damage, the surface, especially the interface, is prone to cracks, and micro-cracks will be formed inside, which will affect the performance stability of the film

Method used

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  • Transparent polyimide film and preparation method thereof
  • Transparent polyimide film and preparation method thereof
  • Transparent polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Add 3090g of N,N-dimethylacetamide, 320.23g (1.0mol) of 2,2'-bis(trifluoromethyl)-4,4 '-Diaminobiphenyl, after it dissolves, add 453.12g (1.02mol) of 4,4-hexafluoroisopropylphthalic anhydride, the reaction temperature is 0-30°C, and the reaction is stirred for 12h.

[0035] (2) Continue to add 32.6g (0.05mol) of R to the reaction system 1 , R 2 Diamine (TSi-2) containing ladder-like siloxane structure with methyl group and n value of 2, polyamic acid solution was obtained after stirring and reacting for 4 hours, the resin solid content was about 20wt%, and the viscosity at 25°C was 3.3× 10 5 cP.

[0036](3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 80 minutes, then gradually raise the temperature to 350°C within 30 minutes, dry for 60 minutes, and lower to room temperature to prepare a film with a thickness of 45 μm.

Embodiment 2

[0038] (1) Add 2940g of N,N-dimethylacetamide, 256.18g (0.8mol) of 2,2'-bis(trifluoromethyl)-4,4 '-Diaminobiphenyl, 36.04g (0.18mol) 4,4'-diaminodiphenyl ether, after it dissolves, add 444.24g (1.0mol) 4,4-hexafluoroisopropylphthalic anhydride , the reaction temperature was 0-30°C, and the reaction was stirred for 12h.

[0039] (2) Continue to add 13.04g (0.02mol) of R to the reaction system 1 , R 2 Diamine TSi-2 containing ladder-shaped siloxane structure with methyl group and n value of 2, polyamic acid solution was obtained after stirring for 4 hours, the resin solid content was about 20wt%, and the viscosity at 25°C was 4.7×10 5 cP.

[0040] (3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 80 minutes, then gradually raise the temperature to 350°C within 30 minutes, dry for 60 minutes, and lower to room temperature to prepare a film with a thickness of 45 μm.

Embodiment 3

[0042] (1) Add 2940g of N,N-dimethylacetamide, 256.18g (0.8mol) of 2,2'-bis(trifluoromethyl)-4,4 '-Diaminobiphenyl, 36.04g (0.18mol) 4,4'-diaminodiphenyl ether, after it dissolves, add 444.24g (1.0mol) 4,4-hexafluoroisopropylphthalic anhydride , the reaction temperature was 0-30°C, and the reaction was stirred for 12h.

[0043] (2) Continue to add 0.65g (0.001mol) of R to the reaction system 1 , R 2 Diamine TSi-2 containing ladder-shaped siloxane structure with methyl group and n value of 2, polyamic acid solution was obtained after stirring for 4 hours, the resin solid content was about 20wt%, and the viscosity at 25°C was 5.1×10 5 cP.

[0044] (3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 80 minutes, then gradually raise the temperature to 350°C within 30 minutes, dry for 60 minutes, and lower to room temperature to prepare a film with a thickness of 45 μm.

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Abstract

The invention relates to a transparent polyimide film and a preparation method thereof, wherein the polyimide film has the characteristics of high transparency, low chromaticity, easy surface preparation of a silicon hardened coating and the like, and is characterized in that a polyimide molecular structure contains siloxane units with trapezoidal structures. The diamine structural formula of thesiloxane with the trapezoidal structure is shown in the specification, wherein in the formula, R1 and R2 can be respectively methyl, ethyl, propyl, isopropyl, isobutyl, phenyl and phenoxy, and the n value is 2-20. The siloxane unit with the trapezoidal structure is introduced into the polyimide structure, so that the adhesive force of the transparent film and the silicon hardened coating is effectively improved, and thereby the problems that the surface of the fluorine-containing transparent polyimide film is not easy to harden and the surface hardened coating is easy to fall off or break aresolved; meanwhile, the polyimide film keeps high optical light transmittance and low chromaticity. The polyimide film prepared by the method can be applied to foldable optical displays, flexible electronic devices and the like.

Description

technical field [0001] The invention relates to a transparent polyimide film and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] In future foldable, curved or rollable optical displays and electronic devices, it is inevitable that flexible transparent polymer covering substrate materials will replace glass substrates. In order to protect electronic components, polymer substrate materials are required to have high transparency, high mechanical strength, and high surface scratch resistance. Polyimide material has unique temperature resistance, mechanical properties, insulation properties, solvent resistance, etc., and is the most likely substrate material for flexible display devices. However, the commonly used polyimide film is usually brown or yellow due to its high aromatic structure density, and has low light transmittance in the visible light region, which cannot meet the application requirements. In order to redu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/106C08G73/1075C08G73/1039C08G73/1042C08J5/18C08J2379/08
Inventor 周浪
Owner WUXI CHUANGCAI OPTICAL MATERIALS