Transparent polyimide film and preparation method thereof
A technology of transparent polyimide and polyimide film, which is applied in the field of polymer materials, can solve problems such as damage to the bending resistance of transparent composite films, affecting the stability of film performance, and poor surface adhesion. To achieve the effect of solving the problem of easy falling off or breaking, improving the adhesive force and improving the bonding strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0034] (1) Add 3090g of N,N-dimethylacetamide, 320.23g (1.0mol) of 2,2'-bis(trifluoromethyl)-4,4 '-Diaminobiphenyl, after it dissolves, add 453.12g (1.02mol) of 4,4-hexafluoroisopropylphthalic anhydride, the reaction temperature is 0-30°C, and the reaction is stirred for 12h.
[0035] (2) Continue to add 32.6g (0.05mol) of R to the reaction system 1 , R 2 Diamine (TSi-2) containing ladder-like siloxane structure with methyl group and n value of 2, polyamic acid solution was obtained after stirring and reacting for 4 hours, the resin solid content was about 20wt%, and the viscosity at 25°C was 3.3× 10 5 cP.
[0036](3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 80 minutes, then gradually raise the temperature to 350°C within 30 minutes, dry for 60 minutes, and lower to room temperature to prepare a film with a thickness of 45 μm.
Embodiment 2
[0038] (1) Add 2940g of N,N-dimethylacetamide, 256.18g (0.8mol) of 2,2'-bis(trifluoromethyl)-4,4 '-Diaminobiphenyl, 36.04g (0.18mol) 4,4'-diaminodiphenyl ether, after it dissolves, add 444.24g (1.0mol) 4,4-hexafluoroisopropylphthalic anhydride , the reaction temperature was 0-30°C, and the reaction was stirred for 12h.
[0039] (2) Continue to add 13.04g (0.02mol) of R to the reaction system 1 , R 2 Diamine TSi-2 containing ladder-shaped siloxane structure with methyl group and n value of 2, polyamic acid solution was obtained after stirring for 4 hours, the resin solid content was about 20wt%, and the viscosity at 25°C was 4.7×10 5 cP.
[0040] (3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 80 minutes, then gradually raise the temperature to 350°C within 30 minutes, dry for 60 minutes, and lower to room temperature to prepare a film with a thickness of 45 μm.
Embodiment 3
[0042] (1) Add 2940g of N,N-dimethylacetamide, 256.18g (0.8mol) of 2,2'-bis(trifluoromethyl)-4,4 '-Diaminobiphenyl, 36.04g (0.18mol) 4,4'-diaminodiphenyl ether, after it dissolves, add 444.24g (1.0mol) 4,4-hexafluoroisopropylphthalic anhydride , the reaction temperature was 0-30°C, and the reaction was stirred for 12h.
[0043] (2) Continue to add 0.65g (0.001mol) of R to the reaction system 1 , R 2 Diamine TSi-2 containing ladder-shaped siloxane structure with methyl group and n value of 2, polyamic acid solution was obtained after stirring for 4 hours, the resin solid content was about 20wt%, and the viscosity at 25°C was 5.1×10 5 cP.
[0044] (3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 80 minutes, then gradually raise the temperature to 350°C within 30 minutes, dry for 60 minutes, and lower to room temperature to prepare a film with a thickness of 45 μm.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| transmittivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


