Method and device for assisting in drilling tiny deep holes through electromagnetic-acoustic multi-field compounding

Abstract

The invention relates to a method and device for assisting in drilling tiny deep holes through electromagnetic-acoustic multi-field compounding. The device comprises an ultrasonic vibration cutter handle, an ultrasonic generator, a magnetic field auxiliary machining system, a copper electrode, an insulation cushion block and a pulse power source. For the characteristics of drilling of the tiny deep holes, machining is assisted through the coupling function of a pulse electric field, a pulse magnetic field and ultrasonic vibration, the chip breaking and chip discharging performance can be greatly improved, the drilling force and cutter wear can be reduced, the service life of a cutter can be prolonged, the size precision, form and position precision and hole wall quality of the tiny deep holes can be improved, and precision machining of tiny deep holes of difficult-to-machine materials is achieved.

Description

technical field [0001] The invention belongs to the technical field of mechanical processing, and in particular relates to a method and a device for drilling tiny deep holes with electromagnetic-acoustic multi-field compound auxiliary drilling. Background technique [0002] With the rapid development of advanced manufacturing industry, industrial products tend to be miniaturized gradually, and tiny deep-hole parts are more and more widely used in important fields such as aviation, aerospace, electronics, and precision instruments. These small deep hole parts are mostly used in high temperature, high cold, high stress and other occasions, and are generally made of difficult-to-machine materials such as stainless steel, high-strength steel, and titanium alloys. Micro-drilling technology is an effective method for processing tiny deep holes, which has the advantages of a wide range of machinable materials, low processing cost, and high processing quality. However, in the proce...

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Problems solved by technology

However, in the process of micro-deep hole drilling, the rigidity of high-length-to-diameter ratio micro-drilling tools is relatively low, and slippage and deflection are prone to occur during the drilling process, resulting in reduced shape and dimensional accuracy of the processed hole. It is easy to cause bending and twisting of the tool, resulting in tool breakage; in addition, the helical groove of the micro drill bit for processing tiny deep holes is shallow and the chip removal path is long. At the same time, the for

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