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Conductive silver paste for inner electrode of low-dielectric-constant LTCC ceramic body

A low dielectric constant, conductive silver paste technology, applied in conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of no ceramic powder and electrode paste, hinder industrial upgrading and progress, and achieve excellent flow performance , sharpness improvement, the effect of reducing internal friction

Active Publication Date: 2020-06-12
成都银盛新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Foreign companies control the basic raw materials, such as porcelain powder, silver powder required for electrode paste, etc., and keep secret the manufacturing process, restrict equipment exports, etc., which seriously hinder the upgrading and progress of my country's industry
[0004] With the development of 5G in recent years, the market demand for LTCC with low dielectric constant has expanded rapidly, but there is almost no corresponding porcelain powder and electrode paste in China.

Method used

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  • Conductive silver paste for inner electrode of low-dielectric-constant LTCC ceramic body
  • Conductive silver paste for inner electrode of low-dielectric-constant LTCC ceramic body
  • Conductive silver paste for inner electrode of low-dielectric-constant LTCC ceramic body

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preparation example Construction

[0026] A kind of preparation method of the conductive silver paste that is used for the inner electrode of low dielectric constant LTCC porcelain mainly comprises the following steps:

[0027] 1. First, mix the polymer resin with the solvent in proportion, and heat until completely dissolved to make an organic carrier; use ethyl cellulose (Dow Chemical), which is commonly used for making silver paste, as the polymer resin; use silver paste as a general-purpose solvent for making Butyl carbitol acetate is mixed with terpineol 1:1 (Dow Chemical);

[0028] 2. Fully mix the organic carrier, silver powder, and additives in the mixer; for the mixed silver powder system, the additives further promote the uniform mixing of different silver powders through the principle of surface throttling and same-sex charge repulsion, and at the same time prevent the agglomeration of nano-silver powder;

[0029] 3. Fully disperse the mixture on a three-roll mill to obtain a uniform conductive silve...

Embodiment 1

[0033]A kind of conductive silver paste for low dielectric constant LTCC porcelain inner electrode, as shown in table 1, comprises 86% silver powder A, 13% carrier, 1% auxiliary agent A, and described silver powder A is prepared by the nanometer The silver powder and the monodisperse crystalline silver powder prepared by the chemical method are composed according to the mass ratio of 3:1, and are mixed and prepared by using a V-type powder mixer. The D50 particle diameter of the nano-silver powder is 500nm, and the D50 particle diameter of the monodisperse crystalline silver powder is 2.5um. The auxiliary agent A is prepared by adding 1 part of long-chain fatty acid to 1 part of butyl carbitol, and fully dissolving at 80° C. for 12 hours.

Embodiment 2

[0035] A kind of conductive silver paste for low dielectric constant LTCC porcelain inner electrode, as shown in table 1, comprises 86% silver powder B, 13% carrier, 1% auxiliary agent A, and described silver powder B is prepared by the nanometer of physical method Silver powder, monodisperse crystalline silver powder prepared by chemical method, and monodisperse nano-silver powder prepared by chemical method are composed according to the mass ratio of 30:10:1, and are mixed and prepared by using a V-type powder mixer. The D50 particle diameter of the nano silver powder is 500nm, and the D50 particle diameter of the monodisperse crystalline silver powder is 2.5um, and the D50 particle diameter of the monodisperse nano silver powder is 120nm. The auxiliary agent A is prepared by adding 1 part of long-chain fatty acid to 1 part of butyl carbitol, and fully dissolving at 80° C. for 12 hours.

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Abstract

The invention discloses conductive silver paste for an inner electrode of a low-dielectric-constant LTCC ceramic body. The silver paste contains silver powder, and the silver powder comprises nanometer silver powder prepared through a physical method and monodisperse crystalline silver powder prepared through a chemical method, wherein the mass percent of the nanometer silver powder is 50%-80%, and the mass percent of the monodisperse crystalline silver powder is 20%-50%. The conductive silver paste has excellent process performances and can achieve 25-micron fine circuit design. According tothe invention, various LTCC raw ceramic tapes can be well matched, and the ceramic tape can be perfectly combined with an LTCC body with a low dielectric constant, does not react, is high in flatness,and does not crack or layer after being stacked in multiple layers. Through the arrangement of the silver powder, a large shrinkage rate range is achieved, and meanwhile, the conductive silver pastehas excellent conductivity.

Description

technical field [0001] The invention belongs to the technical field of conductive paste, in particular to a conductive silver paste used for electrodes in low dielectric constant LTCC ceramic bodies. Background technique [0002] LTCC (Low Temperature Co-fired Ceramic) technology is an advanced passive integration and hybrid circuit packaging technology. Using LTCC technology, the three major passive devices and various passive components (filters, amplifiers, etc.) can be packaged in a multilayer wiring substrate, and a complete circuit system can be integrated with active devices. Under the demand of miniaturization, precision and low power consumption of electronic products, LTCC has great application value in a large field. [0003] At present, most of the ceramic body and electrode paste required by LTCC technology are monopolized by Ferro, Dupond, Murata and other international companies. Foreign companies control the basic raw materials, such as porcelain powder, si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
CPCH01B1/22
Inventor 包卫锋
Owner 成都银盛新材料有限公司
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