Method for additive manufacturing of glass substrate PCB and LED display

A glass substrate, PCB board technology, applied in the direction of printed circuit components, metal pattern materials, electrical components to assemble printed circuits, etc., can solve problems such as very high yield challenges, circuit short circuits, and silver paste technology losing cost advantages, etc. Achieve low cost, prevent oxidation, and improve reliability

Pending Publication Date: 2020-06-23
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the additive manufacturing of PCB boards, the cost of silver is nearly 100 times that of copper conductors used in PCB boards. Although the waste of silver during printing is small, if the coverage of silver conductors on printed circuits exceeds 60%, The cost of silver material alone is equivalent to the manufacturing cost of traditional PCB boards, which makes silver paste technology lose its cost advantage in printed circuit manufacturing
In addition, under the action of relatively humid and high electric field, silver paste will produce silver ion migration phenomenon, which is easy t

Method used

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  • Method for additive manufacturing of glass substrate PCB and LED display
  • Method for additive manufacturing of glass substrate PCB and LED display
  • Method for additive manufacturing of glass substrate PCB and LED display

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0045] Example 1

[0046] Double-sided glass substrate PCB board manufacturing, such as figure 1 As shown, the high insulation and high thermal stability of glass can be used to manufacture double-sided glass substrates using copper paste technology to add PCB boards.

[0047] A method for manufacturing a double-sided glass substrate PCB board includes the following steps:

[0048] S01: Punch all through holes 101 on the glass 100 according to the circuit design requirements. Such as Figure 1A As shown, the thickness of the glass substrate 100 is 0.1 to 1 mm. Laser perforation or mechanical perforation is a commonly used glass perforation technology. Using a picosecond ultraviolet laser, a through hole 101 with an aperture of 0.05 to 0.2 mm can be made in the glass 100. Here, laser and chemical etching can also be combined to make finer through holes without micro-cracks.

[0049] S02: Use the vacuum plug hole technology to print the plug hole copper paste 102 in the glass through ...

Example Embodiment

[0057] Example 2

[0058] Embodiment 2 of the present invention uses printing technology to alternately print conductive paste and insulating dielectric paste, additively manufacture multilayer circuits, and manufacture printed circuits for passive driving displays of LEDs on a glass substrate.

[0059] A manufacturing method of additive glass substrate PCB board, such as figure 2 As shown, including the following steps:

[0060] S01: Print conductive copper paste on the glass substrate 200, such as Figure 2A Shown. In the present invention, the copper paste is printed. The positive electrode copper paste 201 of the LED and the negative electrode copper paste 202 (corresponding to the X and Y driving electrodes) are printed first in this step. The distance between the electrodes is determined according to the size of the LED. -In terms of LED, the electrode spacing can be less than 50μm. The copper paste in the present invention can print line widths and line spacings below 50 μm...

Example Embodiment

[0068] Example 3

[0069] Active displays generally require thin film transistors (TFTs) to control the luminescence of each LED and its luminous intensity. The TFTs on the glass substrate can be low-temperature amorphous silicon TFTs or polysilicon TFTs, or indium gallium zinc oxide (IGZO) thin films. TFT, the entire array of these TFTs can be manufactured on a glass substrate first, and then the control and driving circuits are laminated and printed to form an active display PCB board.

[0070] An additive manufacturing method for glass substrate PCB board, such as image 3 As shown, including the following steps:

[0071] S01: Fabricate TFT array 301 on a glass substrate, such as Figure 3A . The TFT can be a low-temperature amorphous silicon TFT or a polysilicon TFT, or an indium gallium zinc oxide (IGZO) thin film TFT.

[0072] S02: Print the conductive copper paste 302 connected to the TFT array, such as Figure 3B As shown, the grays in the figure are all conductive copper pas...

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Abstract

The invention discloses a method for additive manufacturing of a glass substrate PCB and an LED display. The method comprises the steps of printing conductive copper paste on a glass substrate according to the circuit design requirements, and forming a conductive circuit with the controllable line width. According to additive manufacturing of the glass substrate PCB, copper paste can be preciselyprinted on glass through the silk-screen printing technology to form a copper conductive circuit, the characteristic of high heat conduction of the glass substrate can be brought into play. Meanwhile,a conductive circuit with the line width of 50 micrometers or below can be printed, and the paste contains extremely low organic residues after sintering, and good adhesive force (greater than 2N/mm)is achieved.

Description

technical field [0001] The invention belongs to the technical field of PCB boards, in particular to a method for additively manufacturing a glass substrate PCB board and an LED display. Background technique [0002] Printed circuit board PCB (Printed circuit board) is the support body of electronic components, and there are metal conductors on the PCB board as the lines connecting electronic components. The currently used printed circuit boards are actually designed and manufactured with a subtractive etching process. PCB circuit boards can already support the trend of greater density at a lower cost. However, for conductive lines with high resolution below 25 microns, subtraction The etching process becomes very expensive. The biggest problem is that since the subtractive manufacturing of PCB circuit boards requires the use of photolithography, development, stripping, chemical etching, electroplating and other processes, not only the process is complicated, but also the pr...

Claims

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Application Information

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IPC IPC(8): H05K1/09H05K3/32H05K3/34
CPCH05K1/09H05K3/32H05K3/34
Inventor 李运钧郭冉
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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