Method for additive manufacturing of glass substrate PCB and LED display

Abstract

The invention discloses a method for additive manufacturing of a glass substrate PCB and an LED display. The method comprises the steps of printing conductive copper paste on a glass substrate according to the circuit design requirements, and forming a conductive circuit with the controllable line width. According to additive manufacturing of the glass substrate PCB, copper paste can be preciselyprinted on glass through the silk-screen printing technology to form a copper conductive circuit, the characteristic of high heat conduction of the glass substrate can be brought into play. Meanwhile,a conductive circuit with the line width of 50 micrometers or below can be printed, and the paste contains extremely low organic residues after sintering, and good adhesive force (greater than 2N / mm)is achieved.

Description

technical field [0001] The invention belongs to the technical field of PCB boards, in particular to a method for additively manufacturing a glass substrate PCB board and an LED display. Background technique [0002] Printed circuit board PCB (Printed circuit board) is the support body of electronic components, and there are metal conductors on the PCB board as the lines connecting electronic components. The currently used printed circuit boards are actually designed and manufactured with a subtractive etching process. PCB circuit boards can already support the trend of greater density at a lower cost. However, for conductive lines with high resolution below 25 microns, subtraction The etching process becomes very expensive. The biggest problem is that since the subtractive manufacturing of PCB circuit boards requires the use of photolithography, development, stripping, chemical etching, electroplating and other processes, not only the process is complicated, but also the pr...

AI Technical Summary

Problems solved by technology

In the additive manufacturing of PCB boards, the cost of silver is nearly 100 times that of copper conductors used in PCB boards. Although the waste of silver during printing is small, if the coverage of silver conductors on printed circuits exceeds 60%, The cost of silver material alone is equivalent to the manufacturing cost of traditional PCB boards, which makes silver paste technology lose its cost advantage in printed circuit manufacturing

In addition, under the action of relatively humid and high electric field, silver paste will produce silver ion migration phenomenon, which is easy to cause short circuit of circuit and reliability of long-term use, and also prevents large-scale application of silver on PCB board One of the reasons is that additive printed circuit boards are applied to small-pitch or Mini-LED display backplanes. The size of Mini LEDs is below 100 microns, requiring electrodes to have a resolution of 50 microns / 50 microns, so the multilayer PCB board Manufacturing puts forward higher requirements for the resolution of copper wires below 50 microns and the process of conductive vias with a diameter of 50 microns, and the challenge of yield is very great.

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