High-temperature-resistant ink composition, preparation method and application method

An ink composition and high temperature resistant ink technology are applied in the field of ink to achieve the effects of improving adhesion, good adhesion and high temperature resistance

Active Publication Date: 2020-07-03
DRA JET PRINT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Inks are widely used in industrial products and consumer products. In some applications, inks need to have better high temperature resistance after curing. For example, in some occasions, inks are required to be sprayed direc

Method used

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  • High-temperature-resistant ink composition, preparation method and application method
  • High-temperature-resistant ink composition, preparation method and application method
  • High-temperature-resistant ink composition, preparation method and application method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] Example 1

[0028] According to the formula: 20 parts of polyester modified methyl phenyl silicone resin, 0.5 parts of hydrogen heptaphenyl cage octasilsesquioxane, 15 parts of titanium dioxide, 0.5 parts of polymer type dispersant, 0.5 parts of gas phase method Silica, 0.4 parts of organosilicon defoamer, 1.5 parts of 3-glycidyl ether oxypropyl trimethoxysilane, 10 parts of n-butanol and 25 parts of dipropylene glycol monomethyl ether to prepare raw materials.

[0029] Mix titanium dioxide and polyester modified methyl phenyl silicone resin uniformly and grind to a particle size not exceeding 1000 nm to obtain a mixture;

[0030] The above mixture, hydrogen-based heptaphenyl cage octasilsesquioxane, silicone defoamer, fumed silica, 3-glycidyl ether oxypropyl trimethoxysilane were put into n-butanol and In an organic solvent composed of dipropylene glycol monomethyl ether, stir evenly to obtain an ink slurry;

[0031] The above-mentioned ink slurry is fed into a high-shear dis...

Example Embodiment

[0032] Example 2

[0033] According to formula: 50 parts of polyester modified methyl phenyl silicone resin, 1 part of octahydrogen cage octasilsesquioxane, 2 parts of hydrogen heptaphenyl cage octasilsesquioxane, 35 parts Titanium dioxide, 2 parts polymer dispersant, 1 part organic bentonite, 0.8 parts silicone defoamer, 5 parts 3-aminopropyltrimethoxysilane, 35 parts butyl acetate and 35 parts propylene glycol monomethyl ether, ready raw material.

[0034] Mix titanium dioxide and polyester modified methyl phenyl silicone resin uniformly and grind to a particle size not exceeding 1000 nm to obtain a mixture;

[0035] The above mixture, octahydrocage octasilsesquioxane, hydrogen heptaphenyl cage octasilsesquioxane, organosilicon defoamer, organic bentonite, 3-aminopropyl trimethoxy Silane was sequentially poured into an organic solvent composed of butyl acetate and propylene glycol monomethyl ether, and stirred uniformly to obtain an ink slurry;

[0036] The above-mentioned ink slu...

Example Embodiment

[0037] Example 3

[0038] According to the formula: 30 parts of polyester modified methyl phenyl silicone resin, 0.3 parts of octahydrogen cage octasilsesquioxane, 1.2 parts of hydrogen heptamethyl cage octasilsesquioxane, 25 parts Titanium dioxide, 1 part of polymeric dispersant, 0.8 parts of polyamide wax, 0.5 parts of silicone defoamer, 2 parts of 3-glycidyl ether oxypropyl trimethoxysilane and 50 parts of propylene glycol monomethyl ether are prepared as raw materials.

[0039] Mix titanium dioxide and polyester modified methyl phenyl silicone resin uniformly and grind to a particle size not exceeding 1000 nm to obtain a mixture;

[0040] The above mixture, octahydrocage octasilsesquioxane, hydrogen heptamethyl cage octasilsesquioxane, silicone defoamer, polyamide wax, 3-glycidyl ether oxypropylene Trimethoxysilane was sequentially poured into propylene glycol monomethyl ether, and stirred uniformly to obtain ink slurry;

[0041] The above-mentioned ink slurry is fed into a high-...

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PUM

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Abstract

The invention belongs to the technical field of ink, and specifically relates to a high-temperature-resistant ink composition, a preparation method and an application method. The ink composition comprises, in parts by weight, 20 to 50 parts of polyester modified methyl phenyl silicone resin, 0.5 to 3 parts of hydrogen-containing polyhedral oligomeric silsesquioxane, 15 to 35 parts of titanium dioxide, 0.5 to 2 parts of a dispersant, 0.5 to 1 part of an anti-settling agent, 0.3 to 0.8 part of an antifoaming agent, 1 to 5 parts of an adhesion promoter and 35 to 70 parts of an organic solvent. The high-temperature-resistant ink composition disclosed by the invention has good high-temperature resistance after being cured; a spraying mark is still clear and visible after the high-temperature-resistant ink composition is sprayed onto a steel piece or an iron piece and is cured at 900 DEG C for 5 hours or 1000 DEG C for 2 hours; meanwhile, the adhesive force of the high-temperature-resistantink composition is good.

Description

technical field [0001] The invention belongs to the technical field of ink, and relates to a high-temperature-resistant ink composition, a preparation method and an application method. Background technique [0002] Inks are widely used in industrial products and consumer products. In some applications, inks need to have better high temperature resistance after curing. For example, in some occasions, inks are required to be sprayed directly on iron parts at 300 ° C, and then cured at 800 ~ 900 ° C. ℃ After a certain period of time, the content of the inkjet can still be clearly displayed, but the high temperature resistance of the current ink still needs to be improved. Contents of the invention [0003] An object of the present invention is to overcome the defects of the prior art and provide a high temperature resistant ink composition. [0004] Another object of the present invention is to provide a method for preparing a high temperature resistant ink composition. [...

Claims

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Application Information

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IPC IPC(8): C09D11/30
CPCC09D11/30
Inventor 赵宇晗
Owner DRA JET PRINT TECH
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