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Cooling disc body and preparation method thereof

A cooling plate and cooling water technology, which is used in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problem of inconvenient installation and tightening of bolts and water pipe joints, uneven cooling of the wafer surface, and the inner wall of the cooling water channel is easily damaged. Corrosion and other problems, to achieve the effect of reducing the risk of water leakage, small resistance, and improving the instructions for use

Active Publication Date: 2020-07-10
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. Adopting a single sealing ring sealing structure, the sealing between the grooves on the bottom surface of the cooling plate is not good, and it is easy to leak water between the grooves, which makes the mixing of cold and hot water reduce the cooling efficiency;
[0008] 2. In order to obtain a better sealing effect, the diameter of the sealing ring needs to be larger, so that the distribution area of ​​the water tank is more concentrated in the middle of the cooling plate, resulting in slow cooling at the edge of the cooling plate and uneven cooling of the wafer surface;
[0009] 3. The upper cooling plate adopts a concave structure, which is inconvenient to process. The connecting bolts and the position of the water inlet and outlet are all located in the concave part, which is not convenient for the installation and fastening of bolts, water pipe joints and other components.
[0011] CN 110405474 A discloses a method for surface treatment of the water channel in the cooling plate and a method for manufacturing the cooling plate, which relates to the technical field of water channel surface treatment, so as to alleviate the problem that the inner wall of the cooling water channel in the water cooling plate in the prior art is easily damaged. Corrosion Technical Issues

Method used

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  • Cooling disc body and preparation method thereof
  • Cooling disc body and preparation method thereof
  • Cooling disc body and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0041] This embodiment provides a cooling plate body, the structure of which is as follows: Figure 1-3 As shown, the cooling plate body includes a main board 2 and a cover plate 1 , and the water channel is located inside the main board 2 .

[0042] The water channel inside the cooling plate is a combined shape of a circular water channel and a rice-shaped water channel. The rice-shaped water channel is inside the circular water channel, and each branch of the rice-shaped water channel is independently connected to the The circular waterway is connected. The ends of three adjacent branch waterways of the rice-shaped waterway are connected to form a first waterway group, and the ends of the remaining three branch waterways are connected to form a second waterway group, and the first waterway group and the second waterway group pass through The circular water channels are connected.

[0043]A cooling water inlet pipeline and a cooling water outlet pipeline are arranged on the...

Embodiment 2

[0045] This embodiment provides a method for preparing the cooling disc body described in Embodiment 1, the method comprising the following steps:

[0046] (1) Vacuum brazing after polar processing turning, milling, polishing and assembly of the main board and the cover plate machine in turn to obtain the base material of the cooling disc;

[0047] (2) After the cooling water inlet pipeline and the cooling water outlet pipeline are assembled, they are laser welded to the base material of the cooling plate, and the cooling plate is obtained after dimensional inspection and helium leakage detection.

[0048] Its specific processing size is as Figure 4 and 5 shown.

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Abstract

The invention provides a cooling disc body and a preparation method thereof, a water channel in the cooling disc body is in a combined shape of an annular water channel and a *-shaped water channel, the *-shaped water channel is in the annular water channel, and each branch of the *-shaped water channel is independently communicated with the annular water channel. According to the cooling disc body, the structure of the internal water tank is optimized, so that the circulating speed of cooling water is increased, and the cooling speed of the cooling disc body is increased.

Description

technical field [0001] The invention belongs to the field of cooling equipment, and relates to a cooling plate body and a preparation method thereof. Background technique [0002] In the manufacturing process of integrated circuits, etching is the process of selectively removing unwanted materials from the surface of silicon wafers by chemical or physical methods. In terms of process, etching can be divided into wet etching and dry etching. The main feature of the former is isotropic etching; the latter uses plasma for anisotropic etching, which can strictly control vertical and lateral etching. [0003] In the semiconductor dry etching process, according to the different materials to be etched, it can be divided into metal etching, dielectric etching and silicon etching. Metal etching can be divided into metal aluminum etching, metal tungsten etching and titanium nitride etching. At present, metal aluminum, as a wiring material, is still widely used in memories such as D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67109H01L21/67126
Inventor 姚力军潘杰边逸军王学泽章丽娜
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD