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Insulating coating and preparation method thereof, metal substrate and semiconductor device

A technology for metal substrates and insulating coatings, which is applied to semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., can solve the problems of bubbles, delamination, and easy cracks, so as to achieve no bubbles and simple process steps. , The effect of not easy to fall off

Inactive Publication Date: 2020-07-24
童孝俊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some insulating coatings that are prone to cracks, delamination, and bubbles in use at present, and there is still room for improvement.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0015] The present embodiment provides a semiconductor device and a metal substrate provided with an insulating coating made of the insulating paint of the present invention on a part of the semiconductor device and the metal substrate.

[0016] The method for setting the insulating coating on the above-mentioned metal substrate is:

[0017] Take the following raw materials and weigh them by weight: 20 parts of epoxy resin, 10 parts of calcium carbonate powder, 9 parts of ceramic microbeads, 9 parts of silicon nitride, 10 parts of acrylic emulsion, 4 parts of alcohol ester twelve, 3 parts of triethanolamine, 3 parts of emu...

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PUM

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Abstract

The invention relates to an insulating coating which is prepared from the following components: 18-26 parts of epoxy resin; 8-12 parts of calcium carbonate powder; 8 to 10 parts of ceramic microbeads;8 to 10 parts of silicon nitride; 8 to 10 parts of acrylic emulsion; 2-4 parts of texanol; 1 to 3 parts of triethanolamine; 1-3 parts of emulsified silicone oil and 30-40 parts of water. The insulating coating provided by the invention is good in insulating property; the process steps for preparing the insulating coating are simple; implementation is easy, the prepared insulating coating is moderate in viscosity, not prone to layering, free of bubbles and convenient to spray, all the components are fully combined, the comprehensive performance is good, the insulating coating can form a good coating film after construction, cracks are not prone to being generated, the film forming effect is good, and the prepared insulating coating has good insulating, waterproof and anti-aging performanceand is good in adhesiveness and not prone to falling off.

Description

technical field [0001] The invention relates to the technical field of insulating materials, in particular to an insulating coating and a preparation method thereof, and also to a metal substrate and a semiconductor device containing the insulating coating prepared by using the insulating coating. Background technique [0002] Insulating coating is a coating with excellent electrical insulation; the coating can form a layer of ceramic coating with high volume resistivity on the surface of the coated object, which can withstand a strong electric field without being broken down. The coating has high mechanical strength and good chemical stability, and is resistant to aging, water, and chemical corrosion; it also has mechanical and thermal shock resistance, and the coating can work continuously at the corresponding working temperature. However, there are some insulating coatings that are prone to cracks, delamination, and bubbles in use at present, and there is still room for i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D133/04C09D183/04C09D5/25C09D7/61C09D7/80H01L23/29
CPCC08K2003/265C08L2205/03C09D5/00C09D163/00C09D7/61C09D7/70C09D7/80H01L23/29H01L23/295C08L33/04C08L83/04C08K13/04C08K3/26C08K7/18C08K3/34
Inventor 童孝俊
Owner 童孝俊
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