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Black polyimide film comprising fluororesin, and preparation method therefor

The technology of polyimide film and polyimide resin is applied in the field of black polyimide film and its preparation, which can solve the problems of reduced function of cover film, black color tone, reduced concealment, reduced thickness, etc. The effect of excellent gloss, excellent alkali resistance index

Active Publication Date: 2020-07-24
PI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010]Therefore, black tone and concealment may be reduced in the cover film, and the thickness is reduced due to falling of carbon black particles, making the function as the cover film may be greatly reduced

Method used

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  • Black polyimide film comprising fluororesin, and preparation method therefor
  • Black polyimide film comprising fluororesin, and preparation method therefor
  • Black polyimide film comprising fluororesin, and preparation method therefor

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0092] Preparation Example 1: Polymerization of Polyamic Acid

[0093] As a polyamic acid solution polymerization process, 407.5 g of dimethylformamide (DMF) was added as a solvent in a 500 mL reactor under a nitrogen atmosphere.

[0094] After setting the temperature to 25°C, add 35.90 g of 4,4'-diphenylamine oxide as a diamine monomer, and stir for about 30 minutes. After confirming that the monomer is dissolved, add 35.90 g of pyromellitic dianhydride as a diamine monomer. Dianhydride monomer, and added after adjusting the final addition amount so that the final viscosity is 2,500,000 to 2,800,000 cps.

[0095] After the addition was complete, the temperature was maintained while stirring for 1 hour to polymerize the amic acid solution to a final viscosity of 2800 million centipoise.

preparation example 2

[0096] Preparation Example 2: Preparation of Composition Containing Fluorine Resin and Carbon Black

[0097] After mixing 70 g of DMF as the first organic solvent and 30 g of PFA resin as the fluororesin, a first composition having a solid content of 30% was prepared.

[0098] After mixing 89 g of DMF as the second organic solvent, 10 g of carbon black, and 1 g of dispersant BYK-430, a second composition containing carbon black with an average particle diameter of 0.5 μm was prepared using a grinder.

[0099] After mixing 100 g of the first composition with 100 g of the second composition, a third composition was prepared.

preparation example 3

[0100] Preparation Example 3: Preparation of Polyimide Film

[0101] The 30g polyamic acid solution prepared in the preparation example 1 is mixed with the third composition of 5g prepared in the preparation example 2, and 4.76g of isoquinoline (IQ), 26.36g of acetic anhydride (AA), And after the DMF of 18.87g is used as catalyst, mix evenly, use scraper knife to cast on stainless steel (SUS) plate (100SA, Sweden Sandvik (Sandvik) company produces) to 70 μm, and then in the temperature range of 100 ℃ to 200 ℃ to dry.

[0102] Then, the film was peeled from the SUS sheet and fixed on a pin-type frame, and then transferred to a high-temperature tenter.

[0103] After the film was heated from 200°C to 600°C on a high-temperature tenter, cooled at 25°C, and then separated from the pin frame, a polyimide film with a thickness of 7.5 μm was prepared. The total weight of the film, the film comprises 90% by weight of polyimide resin, 5% by weight of carbon black and 5% by weight of ...

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Abstract

The present invention provides a polyimide film comprising, on the basis of the total weight of the polyimide film, 75-95 wt% of a polyimide resin, 2-15 wt% of a fluororesin and 3-10 wt% of carbon black having an average diameter of 0.1-5 [mu]m, wherein the fluororesin contains oxygen (O) in the molecular structure thereof, has a thickness of 8.0 [mu]m or less and has an alkali resistance index, evaluated on the basis of the thickness of the polyimide film, of 70% or more.

Description

technical field [0001] The present invention relates to a black polyimide film containing fluororesin and a preparation method thereof. Background technique [0002] Generally, polyimide (PI) resin refers to the solution polymerization of aromatic dianhydride and aromatic diamine or aromatic diisocyanate to prepare polyamic acid derivatives, dehydration by ring closure at high temperature, and acyl High temperature resistant resin made by imidization. [0003] Polyimide resins are usually composed of aromatic dianhydrides, such as pyromellitic dianhydride (PMDA) or biphenyltetracarboxylic dianhydride (BPDA), and aromatic diamine components, such as 4,4'-diphenylamine oxide (ODA), 3,4'-oxidized diphenylamine, p-phenylenediamine (p-PDA), m-phenylenediamine (m-PDA), methylene dianiline (MDA), bisaminophenylhexafluoro Propane (HFDA) etc. polymerized. [0004] Polyimide resin is an insoluble and non-melting super heat-resistant resin, and has excellent characteristics such as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08L27/18C08L29/10C08K3/04C08J3/20C08G73/10
CPCC08G73/10C08J3/20C08J5/18C08K3/04C08L27/18C08L29/10C08L79/08C08G73/1032
Inventor 金纪勋李吉男林铉才
Owner PI ADVANCED MATERIALS CO LTD
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