A kind of laser welding layer preform and preparation method thereof and aluminum silicon carbide box body

Abstract

The invention discloses a laser welding layer preform and a method for preparing the same and an aluminum silicon carbide box body, comprising steps 1: preparing a laser welding layer preform; step 2: laminating and matching the laser welding layer preform and the silicon carbide preform ; Step 3: vacuum pressure infiltration to prepare an aluminum silicon carbide body with a laser welding layer; Step 4: perform mechanical processing; the laser welding layer preform is pressed from particle-reinforced aluminum alloy powder, specifically the The aluminum alloy powder is placed in a graphite mold, and the graphite mold includes a concave mold and a convex mold, the aluminum alloy powder is spread on the bottom of the concave mold, and the hydraulic press applies 0.5-2MPa to the aluminum alloy powder in the concave mold through the convex mold. The particle size of the particle-enhanced aluminum alloy powder is 10-200 μm, and the laser welding layer is designed on the upper end of the aluminum silicon carbide box to effectively solve the problem of aluminum carbonization. The laser welding problem between the silicon box body and the cover plate ensures the airtightness of the box body after sealing and welding.

Description

technical field [0001] The invention relates to the field of laser welding electronic packaging, in particular to a laser welding layer preform and a preparation method of the aluminum silicon carbide box body. Background technique [0002] With the rapid development of information technology, the integration of IC chips has been continuously improved, resulting in an increasing power density. Therefore, more efficient thermal management materials are needed. However, traditional electronic packaging materials such as Kovar alloy, Inva alloy and W / Cu alloy cannot fully meet the material requirements of modern electronic packaging due to their high price, high density and low thermal conductivity. As a high volume fraction (60% ~ 75%) silicon carbide reinforced aluminum matrix composite material (hereinafter referred to as aluminum silicon carbide), due to its high thermal conductivity and elastic modulus, low density and suitable adjustable expansion coefficient, it is Wid...

AI Technical Summary

Problems solved by technology

There are mainly the following problems: (1) The oxide layer on the surface of silicon powder is thick, which makes the laser welding performance of infiltrated aluminum silicon poor; (2) The composition of the aluminum silicon layer is not uniform, resulting in large deformation of the box during the brazing process; (3) When the port of the box body passes through the aluminum-silicon layer, it is easy to cause cracking at the interface junction

However, aluminum silicon carbide has exposed silicon carbide particles, which can easily cause the gold coating to fall off

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