Copper-nickel core-shell type nano powder, conductive film, preparation method of copper-nickel core-shell type nano powder, preparation method of conductive film and application of copper-nickel core-shell type nano powder

Abstract

The invention belongs to the field of application of electronic materials and metal powder, and relates to copper-nickel core-shell type nano powder, a conductive film, a preparation method of the copper-nickel core-shell type nano powder, a preparation method of the conductive film and application of the copper-nickel core-shell type nano powder. The preparation method of the copper-nickel core-shell type nano powder comprises the following steps that a polyhydric alcohol solution in which a copper precursor is dissolved and a polyhydric alcohol solution in which ascorbic acid is dissolved are simultaneously injected into a polyhydric alcohol solution in which a macromolecular coating agent is dissolved, and heat preservation reaction is carried out to form a copper core; a polyhydric alcohol solution in which a nickel precursor is dissolved and a polyhydric alcohol solution in which a reducing agent is dissolved are simultaneously injected into a solution containing the copper core,and heat preservation reaction is carried out; and through the induction effect of the copper core, a nickel shell layer is epitaxially grown on a copper crystal face, and then the copper-nickel core-shell type nano powder with a completely closed shell layer is obtained. The copper-nickel core-shell type nano powder obtained through the method has the good oxidation resistance, and can be appliedto the fields of conductive slurry, conductive films, metal electrodes, magnetic shielding materials or catalysts and the like.

Description

technical field [0001] The invention belongs to the application field of electronic materials and metal powders, and in particular relates to a copper-nickel core-shell nanometer powder and a conductive film and a preparation method and application thereof. Background technique [0002] With the rapid development of the electronics and information industries, the research and development of high-performance electronic components has put forward higher requirements for metal conductive materials. At present, precious metals such as gold, silver, and palladium, and base metal materials such as copper, nickel, and aluminum are mainly used to prepare electrode materials. Because of the high cost of precious metals, it is more desirable to replace precious metals with base metals to reduce production costs. As a relatively inexpensive base metal, copper has been widely used to prepare metal electrodes for electronic components. However, their applications are limited due to the...

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Problems solved by technology

Secondly, the uniformity of the powder size is poor, which is not conducive to the formation of a uniform thin film electrode layer

In addition, it is often difficult for nickel to tightly cover the copper core, and an effective heterogeneous bonding interface is not formed between copper and nickel, which will lead to a decrease in the oxidation resistance of powder and layered electrodes.

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