A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application

A technology of composite thermal conductive material and aluminum-silicon alloy, which is applied in the field of thermal management materials, can solve the problems of unsmooth development of aluminum-based graphite composite materials, difficulty in composite forming of aluminum matrix and graphite sheet, damage to thermal conductivity and strength of composite materials, etc. It is beneficial to the promotion of large-scale industrialization, shortening the preparation time, and improving the fluidity.

A technology of composite thermal conductive material and aluminum-silicon alloy, which is applied in the field of thermal management materials, can solve the problems of unsmooth development of aluminum-based graphite composite materials, difficulty in composite forming of aluminum matrix and graphite sheet, damage to thermal conductivity and strength of composite materials, etc. It is beneficial to the promotion of large-scale industrialization, shortening the preparation time, and improving the fluidity.

CN111636006BActive Publication Date: 2021-09-28HONG KONG PRODUCTIVITY COUNCIL

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application
  • A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application
  • A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment provides an aluminum-silicon alloy graphite composite heat-conducting material, which is made of dried aluminum-silicon alloy powder base material (aluminum-silicon alloy powder produced by Hunan Ningxiang Jiweixin Metal Powder Material Co., Ltd., with a particle size of 2 -8μm, nearly spherical shape) and dried graphite flake reinforcement (Graphite Flakes, abbreviated as GF, which is the high-purity flake graphite No. XF050 produced by Jiangsu Nanjing Xianfeng Nano Material Technology Co., Ltd., the mesh number is 80 mesh, purity is 99.9wt%) after mixing uniformly in the glass;

[0050] The obtained mixture is compacted in a graphite mold, and then prepared by hot pressing and sintering under vacuum conditions. The aluminum-silicon alloy graphite composite heat-conducting material prepared in this example is recorded as material 1#, and in material 1# , flake graphite is evenly distributed in the base material aluminum-silicon alloy powder Al-20% Si, a...

Embodiment 2

[0056] This embodiment provides an aluminum-silicon alloy graphite composite heat-conducting material, which is after mixing aluminum-silicon alloy powder Al-20% Si (same as Example 1) with flake graphite sheet (same as Example 1), and then mixing the obtained mixture Compacted in a graphite mold, and then prepared after hot pressing and sintering under vacuum conditions, wherein, the vacuum hot press used in the hot pressing and sintering process of this embodiment and the graphite mold are the same as in Example 1;

[0057] The aluminum-silicon alloy graphite composite heat-conducting material prepared in this example is recorded as material 2#. In material 2#, flake graphite is evenly distributed in the base material aluminum-silicon alloy powder Al-20% Si, and no bridging phenomenon occurs;

[0058] Wherein, based on the total weight of the mixture as 100%, the content of the graphite flakes is 15 wt%, and the content of the aluminum-silicon alloy powder Al-20% Si is 85 wt%...

Embodiment 3

[0061] This embodiment provides an aluminum-silicon alloy graphite composite heat-conducting material, which is after mixing aluminum-silicon alloy powder Al-20% Si (same as Example 1) with flake graphite sheet (same as Example 1), and then mixing the obtained mixture Compacted in a graphite mold, and then prepared after hot pressing and sintering under vacuum conditions, wherein, the vacuum hot press used in the hot pressing and sintering process of this embodiment and the graphite mold are the same as in Example 1;

[0062] The aluminum-silicon alloy graphite composite heat-conducting material prepared in this example is recorded as material 3#. In material 3#, flake graphite is evenly distributed in the base material aluminum-silicon alloy powder Al-20% Si, and no bridging phenomenon occurs;

[0063] Wherein, based on the total weight of the mixture as 100%, the content of the graphite flakes is 15 wt%, and the content of the aluminum-silicon alloy powder Al-20% Si is 85 wt%...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
bending strengthaaaaaaaaaa
densityaaaaaaaaaa
Login to View More

Abstract

The invention provides an aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application. The aluminum-silicon alloy-graphite composite heat-conducting material is obtained by mixing aluminum-silicon alloy powder and graphite filler, and then subjecting the obtained mixture to It is prepared after hot pressing and sintering; in the said material, the graphite filler is uniformly dispersed in the aluminum-silicon alloy matrix. The material provided by the present invention has higher thermal conductivity, higher compactness, higher effective strength and lower coefficient of thermal expansion, and can be used to make high-power electronic devices to solve the problem of high-power electronic devices. heat conduction problem.

Description

technical field [0001] The invention relates to an aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application, belonging to the technical field of heat management materials. Background technique [0002] With the continuous development of electronic devices in the direction of miniaturization, light weight and high performance, their power density continues to increase and the heat generation per unit volume is increasing. An increase in temperature will increase the thermal stress between the packaging material and the chip, and overheating will seriously affect the performance, reliability and service life of electronic products. Therefore, the heat conduction problem of high-power electronic devices has become an urgent problem to be solved. [0003] Traditional heat conduction methods such as convective heat transfer and forced air cooling have been difficult to meet the heat conduction requirements of high-power electronic de...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
28 Sep 2021
Publication
CN111636006B
IPC
C22C1/05; B22F3/14; C22C21/00; C22C21/02
CPC
B22F3/14; C22C1/05; C22C21/00; C22C21/02
Inventors
黎伟华; 杨浩坤