Composite film and preparation method and application thereof
A composite membrane and porous membrane technology, applied in the field of composite membranes, can solve the problems of poor biofouling resistance of composite membranes
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Embodiment 1
[0061] Contact the upper surface of the polysulfone support layer with an aqueous solution of m-phenylenediamine with a concentration of 2% by weight, and discharge the liquid after contacting it for 10 seconds at 25°C; then, contact the upper surface of the support layer with a solution containing 0.1% by weight of trimesoyl chloride. Isopar E solution, after contacting for 10s at 25°C, drained; then, the film was put into an oven and heated at 70°C for 3min to obtain a composite film; Amino acid and 0.2% by weight of 4-dimethylaminopyridine aqueous solution were contacted for 1 min, drained, the film was put into an oven, and heated at 60°C for 5 min to obtain a surface-modified film N1, wherein the thickness of the surface-modified layer was 0.014 μm, the thickness of the support layer is 115 μm, the thickness of the polyamide separation layer is 0.20 μm, and the thickness of the reinforcement layer is 75 μm.
[0062] After immersing the obtained composite membrane N1 in wa...
Embodiment 2
[0064] Contact the upper surface of the polysulfone support layer with an aqueous solution of m-phenylenediamine with a concentration of 2% by weight, and discharge the liquid after contacting it for 10 seconds at 25°C; then, contact the upper surface of the support layer with a solution containing 0.1% by weight of trimesoyl chloride. Isopar E solution, discharge after contacting at 25°C for 10s; then, put the film into an oven and heat at 70°C for 3min to obtain a composite film; mix the polyamide surface of the obtained composite film with 5% by weight of N'- (4-Methoxy-2,3,6-trimethylbenzenesulfonyl)-L-arginine and 0.5% by weight pyridine aqueous solution were contacted for 1 min, drained, and the film was put into an oven at 60° C. The surface modified membrane N2 was obtained by heating for 5 minutes, wherein the thickness of the surface modification layer was 0.022 μm, the thickness of the support layer was 115 μm, the thickness of the polyamide separation layer was 0.22...
Embodiment 3
[0067]Contact the upper surface of the polysulfone support layer with an aqueous solution of m-phenylenediamine with a concentration of 2% by weight, and discharge the liquid after contacting it for 10 seconds at 25°C; then, contact the upper surface of the support layer with a solution containing 0.1% by weight of trimesoyl chloride. Isopar E solution, after contacting at 25°C for 10s, drained; then, the film was put into an oven and heated at 70°C for 3min to obtain a composite film; After contacting the aqueous solution of methyl-L-arginine monoacetate and 1% by weight 2-picoline for 1 min, drain the liquid, put the film into an oven, and heat at 60°C for 5 min to obtain the surface-modified film N3. Among them, the thickness of the surface modification layer is 0.03 μm, the thickness of the support layer is 115 μm, the thickness of the polyamide separation layer is 0.19 μm, and the thickness of the reinforcement layer is 75 μm.
[0068] After immersing the obtained composi...
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