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Thermosetting resin composition and printed circuit board including the same

A resin composition, thermosetting technology, applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., can solve the problems of poor line filling effect and poor fluidity

Inactive Publication Date: 2020-10-23
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its disadvantage is that when it is hardened by heat, its fluidity is poor
Especially when it is applied to the lamination process of thick copper (above 2OZ) multi-layer boards, it often leads to poor line filling effect due to poor fluidity

Method used

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  • Thermosetting resin composition and printed circuit board including the same
  • Thermosetting resin composition and printed circuit board including the same
  • Thermosetting resin composition and printed circuit board including the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 9

[0130] [Examples 1 to 9, Comparative Examples 1 to 6]

[0131] The resin composition shown in Table 2 is mixed with toluene to form the varnish (Varnish) of the thermosetting resin composition, and the above-mentioned varnish is impregnated with Nanya glass fiber cloth (Nanya Plastic Company, cloth type 7628) at room temperature, and then heated at 110 ℃ (impregnation machine) after drying for a few minutes to obtain a prepreg with a resin content of 43 wt%. Finally, four prepregs are stacked between two 35μm thick copper foils, at 25kg / cm 2 At a pressure and temperature of 85°C, keep the constant temperature for 20 minutes, then heat up to 185°C at a heating rate of 3°C / min, then keep the constant temperature for 120 minutes, and then slowly cool to 130°C to obtain 0.8mm thick copper foil substrate.

[0132] The physical properties of the prepared copper foil substrate were tested, and the results are shown in Table 2.

[0133] Result description:

Embodiment 9

[0139] Example 9 is that only SiO2 is used in the formula, the Dk value is 3.57, and Df<0.003. It can be seen that adding other ceramic powders can further improve the electrical properties of the plate.

[0140] In Comparative Example 3-4, if the solid content of the ceramic powder is increased to 75wt%, the physical properties of the plate will be affected, resulting in a low glass transition temperature (Tg) after hardening, poor heat resistance, and low peel strength of the substrate. Low, high water absorption, poor line filling characteristics and other problems.

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Abstract

The invention discloses a thermosetting resin composition and a printed circuit board containing the same. The thermosetting resin composition comprises thermosetting polyphenyl ether resin, ceramic powder, a flame retardant, a cross-linking agent and a composite cross-linking initiator. The composition adopts a thermosetting polyphenylene ether resin whose terminal functional group is a styrene and an acrylic. The thermosetting polyphenylene ether resin has an appropriate hydroxyl value to be easily cured, and the ratio of two different functional groups is between 0.5 and 1.5, for adjustingheat resistance, fluidity, and filling property. A particle diameter of 1 [mu]m to 40 [mu]m is added to control a dielectric constant, and after curing characteristics of high dielectric constant, lowdielectric loss, high Tg, high rigidity, high flame resistance and low moisture absorption rate can be achieved.

Description

technical field [0001] The present invention relates to a thermosetting resin composition and a printed circuit board containing the same, in particular to a thermosetting resin composition with good glue filling properties, cutting properties and rigidity and a printed circuit board containing the same. Background technique [0002] The insulating material used in traditional printed circuit boards is mainly epoxy resin, which has good insulation and chemical resistance after curing, and has cost advantages. Therefore, epoxy resin has been widely used as the main material for the insulating layer of circuit boards. However, in recent years, high-frequency and broadband communication devices and equipment have developed rapidly, signal transmission speed and data processing capacity have doubled, and electronic equipment and electronic assembly tend to be high-density, and the development of printed circuit boards is also moving towards thinner line width. Due to the develop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08K5/5313C08K3/22C08K3/36C08K3/24H05K1/03
CPCC08L71/12H05K1/0353C08L2205/025C08L2203/20C08L2201/02C08K2201/014C08K2003/2241C08K2003/2227C08K2201/003C08J5/244C08J5/249C08K5/5313C08K3/22C08K3/24C08K3/36C08K5/14C08J2371/12H05K1/0373H05K2201/0209H05K2201/0257H05K2201/012H05K1/0326C08L71/126C08K7/18H05K2201/0242C08K5/03C08K5/3417C08K2003/2206C08J2351/08
Inventor 廖德超陈豪昇张宏毅刘家霖张智凯
Owner NANYA PLASTICS CORP
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