Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical silver plating solution for printed circuit board and preparation method of circuit board

A printed circuit board, chemical silver plating technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit secondary treatment, etc., can solve the problem of copper layer over-corrosion, etc., achieve silver layer density, good stability, and avoid strong oxidation The effect of the influence of the sexual environment

Inactive Publication Date: 2020-11-03
广州市豪越新能源设备有限公司
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the phenomenon of silver electron migration is considered, the pH value of the electroless silver plating solution is between 0.5 and 1, and there is still a risk of over-corrosion of the copper layer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical silver plating solution for printed circuit board and preparation method of circuit board
  • Chemical silver plating solution for printed circuit board and preparation method of circuit board
  • Chemical silver plating solution for printed circuit board and preparation method of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] An electroless silver plating solution for printed circuit boards, comprising the following components: 20g / L of silver chloride, 30g / L of acetyl lactol, 4g / L of aqueous ionic liquid corrosion inhibitor, 1g / L of 2,2'-bipyridine , polyoxyethylene sorbitan monopalmitate 0.2g / L, hexadecanoic acid 2g / L, dilute hydrochloric acid 8.9g / L, deionized water balance, pH value 5.9.

[0049] The aqueous ionic liquid corrosion inhibitor is selected from

[0050] Wherein R1, R2, R3, R4 are all methyl groups. C - for chloride ions.

[0051] A method for preparing a printed circuit board, comprising the following steps: (1) providing a ceramic substrate, cleaning and roughening; (2) depositing metallic copper by magnetron sputtering as a seed layer with a thickness of 466nm; wherein process parameters: high-purity metal Copper is used as the target, the flow rate of high-purity argon gas is 160 sccm, the working pressure is 2.3Pa, the substrate temperature is 350°C, the sputtering ...

Embodiment 2

[0053] An electroless silver plating solution for printed circuit boards, comprising the following components: silver sulfamate 25g / L, acetyllide urea 40g / L, aqueous ionic liquid corrosion inhibitor 4.5g / L, 2-mercaptobenzothiazole 1.2g / L, polyoxyethylene (20) sorbitan monolaurate 0.4g / L, oleic acid 4g / L, acetic acid 10.5g / L, deionized water balance, pH value 6.1. The aqueous ionic liquid corrosion inhibitor is selected from

[0054] Wherein R1, R2, R3, R4 are ethyl. C - For the benzenesulfonate ion.

[0055] A method for preparing a printed circuit board, comprising the following steps: (1) providing a ceramic substrate, cleaning and roughening; (2) depositing metal copper by magnetron sputtering as a seed layer, with a thickness of 550nm; wherein process parameters: high-purity metal Copper is used as the target, the flow rate of high-purity argon gas is 250 sccm, the working pressure is 4.8Pa, the substrate temperature is 400°C, the sputtering power is 400W, the distan...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Grain sizeaaaaaaaaaa
Grain sizeaaaaaaaaaa
Resistivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a chemical silver plating solution for a printed circuit board. The chemical silver plating solution comprises the following components including 15-30 g / L of water-soluble silver ions, 20-50 g / L of a copper ion complexing agent, 3.5-5 g / L of a water-based ionic liquid corrosion inhibitor, 0.5-1.5 g / L of a stabilizer, 0.1-0.5 g / L of a grain control agent, 1-5 g / L of a migration inhibitor and 1-20 g / L of a pH regulator, wherein the pH value is 5.5-6.5. The chemical silver plating solution can effectively reduce the tendency of etching a copper wire in the subsequent preparation process of the printed circuit board, can obtain the circuit board with a compact plating layer, uniform grain size and good conductivity and corrosion resistance, can effectively reduce the production cost, and can be widely used for production in the printed circuit industry.

Description

technical field [0001] The invention relates to the field of preparation of printed circuit boards, and more specifically relates to an electroless silver plating solution for printed circuit boards and a preparation method for circuit boards. Background technique [0002] In the manufacture of electronic devices using printed circuits, by soldering a component's leads to vias, surrounding pads, pads and other connection points (collectively referred to as "connection areas"). To facilitate this soldering operation, printed circuit manufacturers are required to arrange vias, pads, lands and other connection points to be receptive to subsequent soldering processes. Therefore, these surfaces must be easily wetted by the solder and allow an integral conductive connection to the leads or surfaces of the electronic component. Due to these demands, printed circuit manufacturers have devised various methods to enhance the solderability of the surface. Among them, the silver-plate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C18/42C23C28/02C25D5/54C25D3/38C25D5/02C23C14/35C23C14/16C23C14/18H05K3/24
CPCC23C14/165C23C14/185C23C14/35C23C18/1653C23C18/42C23C28/023C25D3/38C25D5/022C25D5/54H05K3/24H05K2203/072
Inventor 宋会毫
Owner 广州市豪越新能源设备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com