Application of PDES in compression-resistant self-repairing three-dimensional sensor, three-dimensional sensor and preparation method and application of three-dimensional sensor

A three-dimensional, sensor technology, applied in the field of sensors, can solve the problems of difficult to meet the construction of high-complex three-dimensional structure, limit the development of sensor space structure, unable to form mechanical strength, etc., to achieve high-efficiency self-healing ability and sensitive strain sensing effect. , the effect of low cost

Active Publication Date: 2020-12-01
SOUTH CHINA UNIV OF TECH
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  • Claims
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Problems solved by technology

[0004] In recent years, the development of 3D printing technology has provided new ideas for the manufacture of sensors. At present, most of the existing sensor technologies are based on three-dimensional structures at the micro-nano level, and macroscopic research is mostly based on simple two-dimensional or one-dimensional assembly, which is a great limitation. Compared with the development of the sensor space structure, there are relatively few explorations in the macroscopic three-dimensional integrated sensing, which are mainly limited by the following aspects: First, the mechanical strength of the material itself cannot be formed, and the three-dimensional sensor based on the assembly type The mechanical stability and structural stability of the three-dimensional sensor have a lot of room for improvement; second, the existing technology is difficult to meet the construction of highly complex three-dimensional structures, and the general formwork casting method is incapable of constructing three-dimensional frames and hollow structures; The third is that 3D printing technology can make up for the shortcomings of the manufacturing process, but if the construction of a three-dimensional sensor is to be achieved, higher requirements are placed on the matching of materials and processes. Sensitive effects, etc. are still the focus of research that needs to be further broken through

Method used

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  • Application of PDES in compression-resistant self-repairing three-dimensional sensor, three-dimensional sensor and preparation method and application of three-dimensional sensor
  • Application of PDES in compression-resistant self-repairing three-dimensional sensor, three-dimensional sensor and preparation method and application of three-dimensional sensor
  • Application of PDES in compression-resistant self-repairing three-dimensional sensor, three-dimensional sensor and preparation method and application of three-dimensional sensor

Examples

Experimental program
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Effect test

Embodiment 1～ Embodiment 4

[0056] The preparation of 3D printing precursor solution, the preparation method is:

[0057] (1) Preparation of PDES: Acrylamide, choline chloride and maleic acid were dried in a vacuum oven at 50 °C for 4 h before using the materials. Choline chloride, maleic acid, and acrylamide were weighed and mixed according to the ratio shown in Table 1, and the mixture was stirred with 2,6-di-tert-butyl-4-methylphenol accounting for 0.2w% of the total mixture, And heated at 70 °C for 2 hours to form a transparent homogeneous solution polymerizable deep eutectic solvent (PDES), the prepared PDES was cooled to room temperature and stored in a dry and cool vacuum desiccator.

[0058] (2) Preparation of 3D printing precursor solution: add choline chloride, maleic acid, acrylamide total amount of 1% cross-linking agent poly(ethylene glycol) diacrylate (PEG(200)) and chloride Choline, maleic acid, acrylamide total amount of 0.5% photoinitiator TPO; then stirred at room temperature of 25°C u...

Embodiment 5～11

[0063] The preparation of 3D printing precursor solution, the preparation method is:

[0064] (1) Preparation of PDES: Acrylamide, choline chloride and maleic acid were dried in a vacuum oven at 50 °C for 4 h before using the materials. Weigh and mix choline chloride, maleic acid, and acrylamide in a molar ratio of 1:1:2, and stir the mixture with 2,6-di-tert-butyl-4-methylphenol accounting for 0.2w% of the total mixture , and heated at 70 °C for 2 hours to form a transparent homogeneous solution of polymerizable deep eutectic solvent (PDES), the prepared PDES was cooled to room temperature, and stored in a dry and cool vacuum desiccator.

[0065] (2) Preparation of 3D printing precursor solution: add crosslinking agent poly(ethylene glycol) diacrylate (PEG(200)) and photoinitiator TPO according to the ratio shown in Table 2, and then stir at room temperature of 25°C until The solution became clear and colorless again. The prepared precursor solution was placed in a black li...

Embodiment 12

[0075] The 3D printing precursor solution was prepared according to the method of Examples 1 to 12, wherein the molar ratio of choline chloride, maleic acid, and acrylamide was 1:1:2, and the mass ratio of photoinitiator to PDES was 0.5%. The mass ratio of the joint agent to PDES is 1%. The digital model of the three-dimensional sensor was designed by Unigraphics software and layered by SparkStudio software to form a thickness of 50 μm. These were then sent to a SLA 3D printer (SparkMaker.USA) with 410nm 24W UV light for printing. The exposure time of each layer is 6s, and the exposure intensity is 255.

[0076] The three-dimensional model designed by the software and the corresponding 3D printed physical picture of the three-dimensional model are as follows: Figures 5 to 8 shown, where Figures 5 to 8 The picture on the left is the three-dimensional model designed by the software. Figures 5 to 8 The picture on the right is the actual picture printed out. By comparing t...

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Abstract

The invention discloses an application of PDES in a compression-resistant self-repairing three-dimensional sensor, the three-dimensional sensor and a preparation method and an application of the three-dimensional sensor. According to the PDES, acrylamide, choline chloride and maleic acid are selected as constituent monomers, the monomers can be copolymerized under ultraviolet excitation of a photocuring 3D printer to form a compact conductive polymer network structure, and the compact conductive polymer network structure can be used for preparing a 3D printing-based super-strong compression-resistant self-repairing three-dimensional sensor. The compression-resistant self-repairing three-dimensional sensor prepared by the invention has a high ultraviolet transparent effect, the flexible cable has excellent distortion effect, stretching effect and compression effect under the action of external force, also has stable mechanical compression performance and electric signal transmission performance and excellent self-repairing function and conductivity, and has wide application value in the fields of unmanned driving, intelligent detection and the like.

Description

technical field [0001] The invention relates to the technical field of sensors, and more specifically, relates to the application of PDES in compression-resistant self-repairing three-dimensional sensors, the three-dimensional sensor, its preparation method and application. Background technique [0002] 3D printing has become a universal tool that penetrates into all walks of life with its advantages of personalized customization, free design of three-dimensional geometric structure, high material utilization rate, and rapid preparation. However, there are still many limitations in the existing 3D printing technology, such as the lack of types of printing materials, especially the lack of flexible conductive printing materials. However, 3D printed flexible conductive materials are indispensable for the application research of intelligent devices such as soft robots, biomedicine, flexible sensors, and human-computer interaction. Looking at the existing research, it is not di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F220/56C08F222/02C08F222/14C08F2/44C08K5/19B33Y70/00G01B7/16G01B7/34G01L1/20G01L5/00
CPCC08F220/56C08F2/44C08K5/19B33Y70/00G01B7/18G01B7/34G01L5/0052G01L1/20C08F222/02C08F222/102
Inventor 何明辉蔡玲苏彬陈广学田君飞
Owner SOUTH CHINA UNIV OF TECH
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