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Application of pdes in compression-resistant self-healing three-dimensional stereo sensor, three-dimensional stereo sensor and its preparation method and application

A three-dimensional, sensor technology, applied in the field of sensors, can solve the problems that it is difficult to meet the construction of high-complexity three-dimensional structure, limit the development of sensor space structure, and the mechanical strength cannot be formed, so as to achieve high-efficiency self-repair ability and sensitive strain sensing effect , low cost effect

Active Publication Date: 2022-01-18
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In recent years, the development of 3D printing technology has provided new ideas for the manufacture of sensors. At present, most of the existing sensor technologies are based on three-dimensional structures at the micro-nano level, and macroscopic research is mostly based on simple two-dimensional or one-dimensional assembly, which is a great limitation. Compared with the development of the sensor space structure, there are relatively few explorations in the macroscopic three-dimensional integrated sensing, which are mainly limited by the following aspects: First, the mechanical strength of the material itself cannot be formed, and the three-dimensional sensor based on the assembly type The mechanical stability and structural stability of the three-dimensional sensor have a lot of room for improvement; second, the existing technology is difficult to meet the construction of highly complex three-dimensional structures, and the general formwork casting method is incapable of constructing three-dimensional frames and hollow structures; The third is that 3D printing technology can make up for the shortcomings of the manufacturing process, but if the construction of a three-dimensional sensor is to be achieved, higher requirements are placed on the matching of materials and processes. Sensitive effects, etc. are still the focus of research that needs to be further broken through

Method used

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  • Application of pdes in compression-resistant self-healing three-dimensional stereo sensor, three-dimensional stereo sensor and its preparation method and application
  • Application of pdes in compression-resistant self-healing three-dimensional stereo sensor, three-dimensional stereo sensor and its preparation method and application
  • Application of pdes in compression-resistant self-healing three-dimensional stereo sensor, three-dimensional stereo sensor and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~ Embodiment 4

[0056] The preparation of 3D printing precursor solution, the preparation method is:

[0057] (1) Preparation of PDES: Acrylamide, choline chloride and maleic acid were dried in a vacuum oven at 50 °C for 4 h before using the materials. Choline chloride, maleic acid, and acrylamide were weighed and mixed according to the ratio shown in Table 1, and the mixture was stirred with 2,6-di-tert-butyl-4-methylphenol accounting for 0.2w% of the total mixture, And heated at 70 °C for 2 hours to form a transparent homogeneous solution polymerizable deep eutectic solvent (PDES), the prepared PDES was cooled to room temperature and stored in a dry and cool vacuum desiccator.

[0058] (2) Preparation of 3D printing precursor solution: add choline chloride, maleic acid, acrylamide total amount of 1% cross-linking agent poly(ethylene glycol) diacrylate (PEG(200)) and chloride Choline, maleic acid, acrylamide total amount of 0.5% photoinitiator TPO; then stirred at room temperature of 25°C u...

Embodiment 5~11

[0063] The preparation of 3D printing precursor solution, the preparation method is:

[0064] (1) Preparation of PDES: Acrylamide, choline chloride and maleic acid were dried in a vacuum oven at 50 °C for 4 h before using the materials. Weigh and mix choline chloride, maleic acid, and acrylamide in a molar ratio of 1:1:2, and stir the mixture with 2,6-di-tert-butyl-4-methylphenol accounting for 0.2w% of the total mixture , and heated at 70 °C for 2 hours to form a transparent homogeneous solution of polymerizable deep eutectic solvent (PDES), the prepared PDES was cooled to room temperature, and stored in a dry and cool vacuum desiccator.

[0065] (2) Preparation of 3D printing precursor solution: add crosslinking agent poly(ethylene glycol) diacrylate (PEG(200)) and photoinitiator TPO according to the ratio shown in Table 2, and then stir at room temperature of 25°C until The solution became clear and colorless again. The prepared precursor solution was placed in a black li...

Embodiment 12

[0075] The 3D printing precursor solution was prepared according to the method of Examples 1 to 12, wherein the molar ratio of choline chloride, maleic acid, and acrylamide was 1:1:2, and the mass ratio of photoinitiator to PDES was 0.5%. The mass ratio of the joint agent to PDES is 1%. The digital model of the three-dimensional sensor was designed by Unigraphics software and layered by SparkStudio software to form a thickness of 50 μm. These were then sent to a SLA 3D printer (SparkMaker.USA) with 410nm 24W UV light for printing. The exposure time of each layer is 6s, and the exposure intensity is 255.

[0076] The three-dimensional model designed by the software and the corresponding 3D printed physical picture of the three-dimensional model are as follows: Figures 5 to 8 shown, where Figures 5 to 8 The picture on the left is the three-dimensional model designed by the software. Figures 5 to 8 The picture on the right is the actual picture printed out. By comparing t...

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Abstract

The invention discloses the application of PDES in a compression-resistant self-repairing three-dimensional sensor, the three-dimensional sensor and its preparation method and application. The PDES described in the invention selects acrylamide, choline chloride, and maleic acid as constituent monomers. These monomers can be copolymerized under the excitation of ultraviolet light in a photocurable 3D printer to form a dense conductive polymer network structure, which can be used to prepare a super-compression-resistant self-healing three-dimensional sensor based on 3D printing. The compression-resistant self-repairing three-dimensional sensor prepared by the present invention has a high ultraviolet transparency effect, excellent distortion effect, stretching effect and compression effect under the action of external force, and also has stable mechanical compression performance and electrical signal transmission performance and excellent The self-healing function and electrical conductivity have a wide range of application values ​​in the fields of unmanned driving and intelligent detection.

Description

technical field [0001] The invention relates to the technical field of sensors, and more specifically, relates to the application of PDES in compression-resistant self-repairing three-dimensional sensors, the three-dimensional sensor, its preparation method and application. Background technique [0002] 3D printing has become a universal tool that penetrates into all walks of life with its advantages of personalized customization, free design of three-dimensional geometric structure, high material utilization rate, and rapid preparation. However, there are still many limitations in the existing 3D printing technology, such as the lack of types of printing materials, especially the lack of flexible conductive printing materials. However, 3D printed flexible conductive materials are indispensable for the application research of intelligent devices such as soft robots, biomedicine, flexible sensors, and human-computer interaction. Looking at the existing research, it is not di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/56C08F222/02C08F222/14C08F2/44C08K5/19B33Y70/10G01B7/16G01B7/34G01L1/20G01L5/00
CPCC08F220/56C08F2/44C08K5/19B33Y70/00G01B7/18G01B7/34G01L5/0052G01L1/20C08F222/02C08F222/102
Inventor 何明辉蔡玲苏彬陈广学田君飞
Owner SOUTH CHINA UNIV OF TECH
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