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Epoxy SMC resin composition and preparation method thereof

A resin composition and epoxy resin technology, applied in the field of SMC resin composite materials, can solve the problems of low structural strength and modulus, poor heat resistance, SMC material pollution, etc., and achieve high structural strength and modulus, heat resistance and other problems. Good, prevent powder agglomeration effect

Inactive Publication Date: 2020-12-01
ADESSO ADVANCED MATERIALS WUXI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention: aiming at the pollution, temperature resistance, poor heat resistance, low structural strength and modulus of existing SMC materials, the present invention provides a kind of epoxy SMC composition and preparation method thereof. Solve the above problems and defects

Method used

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  • Epoxy SMC resin composition and preparation method thereof
  • Epoxy SMC resin composition and preparation method thereof
  • Epoxy SMC resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Put 83g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 6g of internal release agent, 0.75g of defoamer, and 0.75g of sizing agent into the reactor and start stirring. After the resin is melted and mixed evenly, add fillers to the reaction and stirring at a high speed to ensure that the material temperature is lower than 120°C, and mix uniformly to obtain material 1; 17g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 7g of dicyandiamide, 1.5g of organic urea, composed of Mix the grinding material and stir in the reaction kettle. The stirring temperature does not exceed 45°C. After mixing evenly, perform three-roll grinding. After grinding, the particle size of the mixture is less than 10 μm to obtain material 2; reduce the temperature of material 1 to below 50°C, Add material 2 to material 1, stir for 0.5h, and vacuum defoam to obtain SMC resin; finally add 4.4g of alicyclic amine and stir evenly to obtain epoxy SMC resin paste; impregnat...

Embodiment 2

[0037] Put 78g bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 5g alicyclic glycidyl ester epoxy resin TDE-85, 6g internal mold release agent, 0.75g defoamer, 0.75g sizing agent in the reactor Start stirring in the middle, and after the resin is melted and mixed evenly, add the filler in the reaction kettle and carry out high-speed stirring to ensure that the temperature of the material is lower than 120°C, and mix evenly to obtain material 1; 17g of bisphenol A glycidyl ether type liquid epoxy resin NPEL- 128. The mixed abrasive composed of 7g dicyandiamide and 1.5g organic urea is stirred in a reaction kettle at a temperature not exceeding 45°C. After mixing evenly, three-roll grinding is carried out. After grinding, the particle size of the mixture is less than 10 μm to obtain a material 2. Lower the material temperature of material 1 to 45°C, add material 2 into material 1, stir for 1 hour, and vacuum defoam to obtain SMC resin; finally add 5g of alicyclic amin...

Embodiment 3

[0039] Put 81g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 2g of cycloaliphatic epoxy resin TTA-21, 6g of internal mold release agent, 0.75g of defoamer, and 0.75g of wetting agent in the reactor and start stirring , after the resin is melted and mixed evenly, add the filler in the reaction kettle and stir at a high speed to ensure that the temperature of the material is lower than 120°C, and mix evenly to obtain material 1; 17g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 7g Dicyandiamide, 1.5g of organic urea, and a mixed abrasive composed of dicyandiamide, 1.5g of organic urea, are stirred in a reaction kettle, and the stirring temperature does not exceed 45°C. After mixing evenly, three-roll grinding is carried out. After grinding, the particle size of the mixture is less than 10 μm to obtain material 2; The material temperature of material 1 is lowered to 49°C, and material 2 is added to material 1, stirred for 45 minutes, and vacuum ...

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Abstract

The invention discloses an epoxy SMC resin composition and a preparation method thereof. The SMC epoxy composition prepared by the method is low in initial viscosity and beneficial to infiltration ofreinforced fiber materials, an epoxy resin system is modified and thickened by adopting a polyamine compound containing amino groups, the viscosity is greatly increased after curing, and the compression molding process of sheet molding compounds is met. The epoxy composition does not contain volatile substances such as solvents, meets the low-VOC environment-friendly requirements of automobile part materials, has the characteristics of quick molding at 140-160 DEG C for 3-10 minutes and the like, and has the characteristics of high mechanical strength, good heat resistance and the like after molding.

Description

technical field [0001] The invention relates to the field of SMC resin composite materials, in particular to an epoxy SMC resin composition and a preparation method thereof. Background technique [0002] SMC molding process is an advanced molding method for composite materials. SMC sheet molding compound is cheap, easy to use, and can be rapidly molded to press products of different sizes and shapes, which is increasingly recognized by the market. At present, SMC is mainly based on unsaturated polyester resin and vinyl resin. However, this unsaturated polyester resin and vinyl resin SMC have disadvantages such as poor temperature resistance and heat resistance, and low structural strength and modulus. Since a large amount of diluent styrene is added to the unsaturated polyester resin system, the diluent styrene volatilizes a large amount of pungent odor during molding. Not only long-term exposure will affect the health of the human body, but also cause great pollution to the...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L63/00C08K7/14C08J5/24C08J5/18C08G59/40
CPCC08J5/24C08J5/18C08G59/4021C08J2363/02C08J2463/00C08K7/14
Inventor 阮长杰南江琨白灵梁振鹏杨涛
Owner ADESSO ADVANCED MATERIALS WUXI CO LTD
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