Light bonding material and preparation method thereof
A bonding material and lightweight technology, applied in the direction of adhesives, adhesive types, non-polymer adhesive additives, etc., can solve the problem that it is difficult to meet the requirements of aircraft light weight, high strength, durability, large specific weight, and unfavorable aircraft lightweight and other problems, to achieve the effect of improving anti-sagging, improving compatibility, and improving thickening thixotropy
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Embodiment 1
[0023] A lightweight bonding material, comprising the following raw material components in parts by mass: 1000 g of glycidyl ether epoxy resin; 300 g of phenalkamine T31 curing agent; 50 g of fumed silica A200; and bulk density of 0.4 g / cm 3 100g of hollow glass beads; 50g of silane coupling agent KH560; 100g of 10mm long chopped carbon fiber (polyacrylonitrile-based carbon fiber) and 20g of wetting agent BYK-P9920.
[0024] The preparation method of the above-mentioned lightweight bonding material comprises the following steps:
[0025] S1: Mix 50wt% of the above hollow glass microspheres with glycidyl ether epoxy resin, fumed silica A200, silane coupling agent KH560 and wetting agent BYK-P9920, and stir at 600rpm for 20min to obtain a premix;
[0026] S2: Add the above-mentioned phenalkamine T31 curing agent, chopped carbon fibers and the remaining hollow glass microspheres to the premix, and stir at 600 rpm for 15 minutes to obtain a lightweight bonding material.
[0027] ...
Embodiment 2
[0029] A lightweight bonding material, comprising the following raw material components in parts by mass: 950 g of glycidyl ether epoxy resin; 280 g of polyamide curing agent YS-651; 40 g of fumed silica R202; and bulk density of 0.5 g / cm 3 120g of hollow glass microspheres; 30g of silane coupling agent KH550; 80g of 20mm long chopped carbon fiber (polyacrylonitrile-based carbon fiber) and 10g of wetting agent BYK-P9920.
[0030] The preparation method of the above-mentioned lightweight bonding material comprises the following steps:
[0031] S1: Mix 60wt% of the above hollow glass microspheres with glycidyl ether epoxy resin, fumed silica R202, silane coupling agent KH550 and wetting agent BYK-P9920, and stir at 500rpm for 22min to obtain a premix;
[0032] S2: Add the above-mentioned polyamide curing agent YS-651, chopped carbon fibers and remaining hollow glass microspheres to the premix, and stir at 550 rpm for 18 minutes to obtain a light-weight adhesive material.
[0...
Embodiment 3
[0035] A lightweight bonding material, comprising the following raw material components in parts by mass: 1050 g of glycidyl ether epoxy resin; 350 g of alicyclic amine curing agent PACM; 60 g of fumed silica A200; and bulk density of 0.3 g / cm 3 300g of hollow glass microspheres; 50g of silane coupling agent KH560; 50g of 5mm long chopped carbon fiber (polyacrylonitrile-based carbon fiber) and 30g of wetting agent BYK-P9920.
[0036] The preparation method of the above-mentioned lightweight bonding material comprises the following steps:
[0037] S1: Mix 40wt% of the above-mentioned hollow glass microspheres with glycidyl ether epoxy resin, fumed silica A200, silane coupling agent KH560 and wetting agent BYK-P9920, and stir at 700rpm for 18min to obtain a premix;
[0038] S2: Add the above-mentioned alicyclic amine curing agent PACM, chopped carbon fibers and the remaining hollow glass microspheres to the premix, and stir at 650 rpm for 12 minutes to obtain a lightweight bondi...
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