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Light bonding material and preparation method thereof

A bonding material and lightweight technology, applied in the direction of adhesives, adhesive types, non-polymer adhesive additives, etc., can solve the problem that it is difficult to meet the requirements of aircraft light weight, high strength, durability, large specific weight, and unfavorable aircraft lightweight and other problems, to achieve the effect of improving anti-sagging, improving compatibility, and improving thickening thixotropy

Inactive Publication Date: 2020-12-04
河北天启通宇航空器材科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although traditional epoxy resin adhesives can meet the performance requirements in terms of bonding strength, but the specific gravity is between 1.2-1.5, which is relatively large, which is not conducive to the lightweight of the aircraft, and it is difficult to meet the light weight, Requirements for strong, durable materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A lightweight bonding material, comprising the following raw material components in parts by mass: 1000 g of glycidyl ether epoxy resin; 300 g of phenalkamine T31 curing agent; 50 g of fumed silica A200; and bulk density of 0.4 g / cm 3 100g of hollow glass beads; 50g of silane coupling agent KH560; 100g of 10mm long chopped carbon fiber (polyacrylonitrile-based carbon fiber) and 20g of wetting agent BYK-P9920.

[0024] The preparation method of the above-mentioned lightweight bonding material comprises the following steps:

[0025] S1: Mix 50wt% of the above hollow glass microspheres with glycidyl ether epoxy resin, fumed silica A200, silane coupling agent KH560 and wetting agent BYK-P9920, and stir at 600rpm for 20min to obtain a premix;

[0026] S2: Add the above-mentioned phenalkamine T31 curing agent, chopped carbon fibers and the remaining hollow glass microspheres to the premix, and stir at 600 rpm for 15 minutes to obtain a lightweight bonding material.

[0027] ...

Embodiment 2

[0029] A lightweight bonding material, comprising the following raw material components in parts by mass: 950 g of glycidyl ether epoxy resin; 280 g of polyamide curing agent YS-651; 40 g of fumed silica R202; and bulk density of 0.5 g / cm 3 120g of hollow glass microspheres; 30g of silane coupling agent KH550; 80g of 20mm long chopped carbon fiber (polyacrylonitrile-based carbon fiber) and 10g of wetting agent BYK-P9920.

[0030] The preparation method of the above-mentioned lightweight bonding material comprises the following steps:

[0031] S1: Mix 60wt% of the above hollow glass microspheres with glycidyl ether epoxy resin, fumed silica R202, silane coupling agent KH550 and wetting agent BYK-P9920, and stir at 500rpm for 22min to obtain a premix;

[0032] S2: Add the above-mentioned polyamide curing agent YS-651, chopped carbon fibers and remaining hollow glass microspheres to the premix, and stir at 550 rpm for 18 minutes to obtain a light-weight adhesive material.

[0...

Embodiment 3

[0035] A lightweight bonding material, comprising the following raw material components in parts by mass: 1050 g of glycidyl ether epoxy resin; 350 g of alicyclic amine curing agent PACM; 60 g of fumed silica A200; and bulk density of 0.3 g / cm 3 300g of hollow glass microspheres; 50g of silane coupling agent KH560; 50g of 5mm long chopped carbon fiber (polyacrylonitrile-based carbon fiber) and 30g of wetting agent BYK-P9920.

[0036] The preparation method of the above-mentioned lightweight bonding material comprises the following steps:

[0037] S1: Mix 40wt% of the above-mentioned hollow glass microspheres with glycidyl ether epoxy resin, fumed silica A200, silane coupling agent KH560 and wetting agent BYK-P9920, and stir at 700rpm for 18min to obtain a premix;

[0038] S2: Add the above-mentioned alicyclic amine curing agent PACM, chopped carbon fibers and the remaining hollow glass microspheres to the premix, and stir at 650 rpm for 12 minutes to obtain a lightweight bondi...

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Abstract

The invention relates to the technical field of adhesives, and particularly discloses a light bonding material. The light bonding material is prepared from the following raw material components in parts by mass: 95-105 parts of glycidyl ether type epoxy resin; 28-35 parts of an amine curing agent; 4-6 parts of fumed silica; 10-30 parts of hollow glass beads; 3-5 parts of a silane coupling agent; 5-10 parts of chopped carbon fibers and 1-3 parts of a wetting agent. The density of the light bonding material is 0.75-0.85 g / cm<3>, the light bonding material has good thixotropy and is not prone tosagging, the shear strength after bonding is 13-15 Mpa, the compressive strength is 45-46 MPa, and the light bonding material can be used for bonding and gap filling of light aircraft and unmanned aerial vehicle composite materials.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a lightweight adhesive material and a preparation method thereof. Background technique [0002] As a new type of material, composite materials are increasingly used in automobiles, aerospace and other fields due to their light weight and high strength. It is a general trend for composite materials to replace traditional materials such as metals. Especially in the aerospace field, for example, the lighter the weight of the parts used by the aircraft through the composite material lightweight technology, the higher the load of the aircraft, the faster the flight speed, and the longer the aircraft range. [0003] However, composite materials are not suitable for mechanical connection due to their own characteristics, and adhesives are inevitably used in the production process of parts. Especially in the bonding process of the wing skin, the requirements for the viscosity, thixotr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C08G59/62C08G59/50C08G59/44
CPCC08G59/44C08G59/5026C08G59/623C09J11/04C09J11/06C09J163/00C08K13/04C08K7/28C08K3/36C08K7/06C08K5/5435C08K5/544
Inventor 宋梓涵张江涛杨海龙
Owner 河北天启通宇航空器材科技发展有限公司