Flip-chip soldering process method for ball planting on metal substrate
A technology of metal substrates and process methods, which is applied in the direction of metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems that all metal substrates cannot be ball-planted and flip-chip soldering cannot be realized, and achieve high consistency and good results
Active Publication Date: 2022-03-11
NO 24 RES INST OF CETC
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Problems solved by technology
[0004] In order to solve the problem that the all-metal substrate without the solder resist layer cannot be ball-planted and flip-chip soldering cannot be realized, the present invention proposes a flip-chip soldering process method for ball-planting on the metal substrate, including:
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Embodiment 1
[0036] In this embodiment, implement as figure 1 The steps in, specifically include:
[0037] (101) Editing the etching pattern on the laser engraving machine;
[0038] (102) performing laser etching on the substrate according to the edited pattern;
[0039] (103) Apply a small amount of soldering flux to the corresponding position of the ball planting on the etched substrate;
[0040] (104) Solder balls are placed at the center of the circle where the flux is applied;
[0041] (105) reflowing the substrate after ball planting in a reflow furnace with a set temperature;
[0042] (106) cleaning and drying the flux;
[0043] (107) Use flip-chip bonding equipment to perform thermocompression flip-chip bonding on chips without solder balls.
[0044] In this embodiment, an integrated laser etching machine with editable graphics and controllable laser light source intensity and its carrying platform are used for etching. The minimum size of the etching graphics is 0.05mm, the e...
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Abstract
The invention relates to the ball planting process in the integrated circuit packaging process, in particular to a flip-chip welding process method for ball planting on a metal substrate, which includes editing patterns on a laser etching machine and etching the edited patterns on the metal substrate out; spot-coat flux on each etched pattern position on the etched substrate; place a solder ball at the center of the fluxed etched pattern; place the metal substrate in a reflow oven for reflow, and Clean and dry the reflowed flux; the invention solves the problem that the all-metal substrate without the solder resist layer cannot be ball-planted and flip-chip soldering cannot be realized. When the ball is planted and reflowed, the solder ball is in the etching circle It has a self-alignment effect, and automatically aligns with the center of the substrate etching circle after melting. When the reflow is completed, the solder ball has no displacement, no collapse, the surface of the solder ball is bright and oxidation-free, and the height of the solder ball is consistent.
Description
technical field [0001] The invention relates to the ball planting process in the integrated circuit packaging process, in particular to a flip-chip soldering process for ball planting on a metal substrate. Background technique [0002] Chip flip-chip bonding technology has a wide range of applications in high-density packaging technology. The main method is to flip-chip-bond a chip with solder balls on a substrate by thermocompression bonding. However, in the case of some large-area single-electrode chips that do not have solder balls, do not have chip pads, and cannot be ball-planted on a single chip, in order to achieve point contact interconnection between the large-area single electrode of the chip and the substrate, and make the chip When a certain gap must be maintained between the substrate and the substrate, it is difficult to achieve interconnection. The common process method is to plant balls on the surface of the chip, and then perform subsequent flip-chip weldi...
Claims
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IPC IPC(8): B23K31/02B23K37/00B23K26/362
CPCB23K31/02B23K37/00B23K26/362
Inventor 李金龙熊化兵王旭光江凯张文峰
Owner NO 24 RES INST OF CETC