Electrolytic copper foil antioxidant

An anti-oxidant, electrolytic copper foil technology, applied in the electrolysis process, electroforming, etc., can solve the problems of not being environmentally friendly, containing heavy metals, and copper is easily oxidized, so as to achieve the effect of eliminating water pollution, preventing oxidation, and improving roughness

Pending Publication Date: 2020-12-18
HUBEI ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper does not react with oxygen at room temperature and is a relatively stable metal. However, in the presence of oxygen, carbon dioxide, and water at the same time, copper is easily oxidized. Some copper foil antioxidants in the prior art contain heavy metals. Some are not environmentally friendly enough

Method used

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  • Electrolytic copper foil antioxidant
  • Electrolytic copper foil antioxidant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Stir and mix 10 g of citric acid, 10 g of sodium metaaluminate, 1 g of fatty alcohol polyoxyethylene ether, 9 g of sodium dodecylbenzenesulfonate, and 10 g of glucose to obtain an antioxidant.

Embodiment 2

[0021] Stir and mix 1kg of tartaric acid, 1kg of sodium tungstate, 100g of fatty alcohol polyoxyethylene ether, 900g of octylphenol polyoxyethylene ether, and 1kg of maltose to obtain an antioxidant.

Embodiment 3

[0023] Stir and mix 10 g of citric acid, 10 g of 3-aminopropyltriethoxysilane, 1 g of polyethylene glycol, 9 g of propylene glycol block polyether, and 10 g of glucose to obtain an antioxidant.

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PUM

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Abstract

The invention relates to an electrolytic copper foil antioxidant. The electrolytic copper foil antioxidant comprises the following components, by mass, 0.1-10 parts of carboxylic acid, 0.1-5 parts ofinorganic salt or a silane coupling agent, 0.1-10 parts of a surfactant mixture and 0.1-10 parts of a film-forming agent. The surfactant mixture comprises at least one surfactant having an HLB value less than 14 and at least one surfactant having an HLB value greater than 14. According to the provided electrolytic copper foil antioxidant, the antioxidant does not contain heavy metals, does not need to be electrified and does not need to be washed with water, is safe and environment-friendly, and is a new generation of electrolytic copper foil antioxidant.

Description

technical field [0001] The invention relates to an anti-oxidant, in particular to an anti-oxidant for electrolytic copper foil, and belongs to the technical field of surface treatment of electrolytic copper foil. Background technique [0002] Copper foil is a negative electrolytic material, a thin, continuous layer of metal foil deposited on the base layer of the circuit board, which acts as a conductor for the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after etching. Copper does not react with oxygen at room temperature and is a relatively stable metal. However, in the presence of oxygen, carbon dioxide, and water at the same time, copper is easily oxidized. Some copper foil antioxidants in the prior art contain heavy metals. Some are not environmentally friendly enough. Contents of the invention [0003] In order to solve the shortcomings of the existing technology, the present invention provides an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F11/02C25D1/04
CPCC23F11/02C25D1/04
Inventor 王锋丁瑜
Owner HUBEI ENG UNIV
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