Homogeneous dispersion liquid of cross-linkable hydrocarbon resin composition, prepreg prepared from homogeneous dispersion liquid, and high-thermal-conductivity thermosetting copper-clad plate

A hydrocarbon resin, uniformly dispersed technology, applied in the field of communication materials, can solve the problems of limited thermal conductivity improvement of copper clad laminates, influence on the dielectric constant of copper clad laminates, limited addition of thermal conductive fillers, etc., to achieve uniform toughness and viscosity, good industrialization Proper base, toughness and stickiness are produced

Active Publication Date: 2020-12-22
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the compounding of various types of thermosetting resins and thermally conductive fillers mentioned above is often realized through the steps of solution mixing, gluing-baking-curing, etc. In this process, the amount of thermally conductive fillers added is very limited, resulting in The improvement of the thermal conductivity of the copper plate is also very limited; at the same time, the high thermal conductivity filler with a high filling amount will seriously affect the dielectric constant of the copper clad laminate; more importantly, the hexagonal crystal represented by boron nitride and aluminum nitride Type high thermal conductivity filler, because of its anisotropy, the thermal conductivity of the copper clad laminate in the thickness direction is much smaller than the thermal conductivity in the plane direction, and the comprehensive performance is difficult to meet the current high-speed, high-frequency, lossless and large-capacity information transmission. needs

Method used

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  • Homogeneous dispersion liquid of cross-linkable hydrocarbon resin composition, prepreg prepared from homogeneous dispersion liquid, and high-thermal-conductivity thermosetting copper-clad plate
  • Homogeneous dispersion liquid of cross-linkable hydrocarbon resin composition, prepreg prepared from homogeneous dispersion liquid, and high-thermal-conductivity thermosetting copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Take 18 parts of hexagonal AlN (D50=20um) and 60 parts of vinyl-terminated polyphenylene ether (Sabic SA9000) and disperse them in 600 parts of THF, take them out after ball milling for 12 hours, add excess deionized water to the system and The system was precipitated, and THF was fully removed by washing and filtering several times, and then the system was redispersed in water, and the water was removed by lyophilization to obtain a complex; then the complex was added to toluene, and 4 parts of hexagonal crystals were added at the same time Type BN (D50=1um), 3 parts of BN fiber (2~10um in diameter, 10~100um in length), 8 parts of alumina, 380 parts of silicon oxide, 60 parts of polybutadiene (Kray Willy Ricon130), 30 parts of polybutadiene (Craigville Ricon154), 15 parts of polydiene-styrene-divinylbenzene terpolymer (Craigville Ricon257), 5 parts of polybutadiene-maleic anhydride copolymer (Kray Willy Ricon130MA8), 5 parts of polystyrene-maleic anhydride copolymer (K...

Embodiment 2

[0030] Take 20 parts of hexagonal BN (D50=20um) and 25 parts of vinyl-terminated polyphenylene ether (Sabic SA9000) and disperse them in 800 parts of THF, take them out after ball milling for 12 hours, add excess deionized water to the system and The system was precipitated, and THF was fully removed by washing and filtering several times, and then the system was redispersed in water, and the water was removed by lyophilization to obtain a complex; then the complex was added to toluene, and 5 parts of hexagonal crystals were added at the same time Type BN (D50=1um), 7 parts of BN fiber (diameter 2~10um, length 10~100um), 12 parts of alumina, 120 parts of magnesium hydroxide, 35 parts of polybutadiene (Craig Willy Ricon130) , 10 parts polybutadiene (Crayville Ricon154), 6 parts polydiene-styrene-divinylbenzene terpolymer (Crayville Ricon257) and 5 parts polybutadiene-maleic anhydride Copolymer (Craig Willy Ricon130MA8), stirred at 50°C for 24 hours to fully dissolve and evenly ...

Embodiment 3

[0032] Take 10 parts of hexagonal BN (D50=30um), 5 parts of hexagonal BN (D50=10um), 5 parts of hexagonal AlN (D50=20um) and 25 parts of vinyl-terminated polyphenylene ether (Sabic SA9000) was dispersed in 600 parts of THF, taken out after ball milling for 12 hours, and excessive deionized water was added to the system to precipitate the system, and then THF was fully removed by repeated washing and filtration, and then the system was redispersed in water , the complex was obtained by lyophilization to remove water; then the complex was added to toluene, and at the same time, 3 parts of hexagonal BN (D50=1um), 5 parts of BN fiber (diameter 2~10um, length 10~100um ), 4 parts of AlN fiber (diameter 1~5um, length 10~50um), 12 parts of alumina, 100 parts of magnesium hydroxide, 15 parts of silicon oxide, 30 parts of polybutadiene (Kray Willy Ricon130), 15 parts Parts polybutadiene (Cray Willy Ricon 154), 6 parts polydiene-styrene-divinylbenzene terpolymer (Cray Willy Ricon 257), a...

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Abstract

The invention relates to a homogeneous dispersion liquid of a cross-linkable hydrocarbon resin composition, a prepreg prepared from the homogeneous dispersion liquid, and a high-thermal-conductivity thermosetting copper-clad plate. According to the invention, a high-thermal-conductivity filler is well dispersed in a plate substrate through a ball milling method, then a relatively small high-thermal-conductivity filler is selected to fill gaps, a long-fiber-shaped high-thermal-conductivity filler is used for further assisting the lap joint between the high-thermal-conductivity fillers, and finally through adhesive overflow flowing of a resin system in a prepreg pressing process, the orientation arrangement of the high-thermal-conductivity filler with the two-dimensional lamellar structure in the plane direction of the plate is restrained to a certain degree, so that the formation of a high-thermal-conductivity filler percolation network in the thickness direction of a copper-clad plateis effectively improved, the thermal conductivity of the plate is improved, other comprehensive properties of the plate are also considered, and the plate is ensured to have excellent dielectric property, thermal mechanical strength, dimensional stability and high copper foil peel strength.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a cross-linkable hydrocarbon resin composition and a prepreg and a high-thermal-conductivity thermosetting copper-clad laminate prepared therefrom. Background technique [0002] Electronic products are rapidly developing in the direction of miniaturization, light weight, thinner and multi-functional. As the main carrier of electronic components, the copper clad laminate has higher and higher integration and finer circuit layout. Therefore, in addition to excellent insulation and thermal-mechanical properties, copper clad laminates should also have good thermal conductivity and heat dissipation functions. Although metal-based CCL has the best heat dissipation capability, its manufacturing cost remains high and production is difficult, and it is mostly used in high-current modules. Ceramic substrates such as alumina-based, aluminum-nitride-based, and silicon-nitr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/09C08J5/24C08L71/12C08L9/00C08K13/04C08K3/28C08K3/38C08K7/04C08K5/03C08K3/22C08K3/36B32B9/00B32B9/02B32B27/02B32B27/04B32B27/28B32B27/32B32B27/34B32B17/04B32B15/08B32B15/20B32B37/06B32B37/08B32B38/18B32B38/16
CPCC08J3/096C08J3/092C08J5/24B32B5/02B32B5/26B32B15/08B32B15/20B32B37/06B32B37/08B32B38/1808B32B38/164C08J2371/12C08J2409/00C08J2309/00C08J2471/12C08K13/04C08K2003/385C08K7/04C08K2201/003C08K2201/004C08K5/03C08K3/2279C08K3/36C08K2003/282C08K2003/2227C08K2003/2224B32B2260/023B32B2260/046B32B2262/14B32B2262/10B32B2262/101B32B2262/106B32B2262/02B32B2262/0253B32B2262/0276B32B2262/0261B32B2270/00B32B2457/08B32B2307/302
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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