Homogeneous dispersion liquid of cross-linkable hydrocarbon resin composition, prepreg prepared from homogeneous dispersion liquid, and high-thermal-conductivity thermosetting copper-clad plate

Abstract

The invention relates to a homogeneous dispersion liquid of a cross-linkable hydrocarbon resin composition, a prepreg prepared from the homogeneous dispersion liquid, and a high-thermal-conductivity thermosetting copper-clad plate. According to the invention, a high-thermal-conductivity filler is well dispersed in a plate substrate through a ball milling method, then a relatively small high-thermal-conductivity filler is selected to fill gaps, a long-fiber-shaped high-thermal-conductivity filler is used for further assisting the lap joint between the high-thermal-conductivity fillers, and finally through adhesive overflow flowing of a resin system in a prepreg pressing process, the orientation arrangement of the high-thermal-conductivity filler with the two-dimensional lamellar structure in the plane direction of the plate is restrained to a certain degree, so that the formation of a high-thermal-conductivity filler percolation network in the thickness direction of a copper-clad plateis effectively improved, the thermal conductivity of the plate is improved, other comprehensive properties of the plate are also considered, and the plate is ensured to have excellent dielectric property, thermal mechanical strength, dimensional stability and high copper foil peel strength.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a cross-linkable hydrocarbon resin composition and a prepreg and a high-thermal-conductivity thermosetting copper-clad laminate prepared therefrom. Background technique [0002] Electronic products are rapidly developing in the direction of miniaturization, light weight, thinner and multi-functional. As the main carrier of electronic components, the copper clad laminate has higher and higher integration and finer circuit layout. Therefore, in addition to excellent insulation and thermal-mechanical properties, copper clad laminates should also have good thermal conductivity and heat dissipation functions. Although metal-based CCL has the best heat dissipation capability, its manufacturing cost remains high and production is difficult, and it is mostly used in high-current modules. Ceramic substrates such as alumina-based, aluminum-nitride-based, and silicon-nitr...

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Problems solved by technology

[0003] However, the compounding of various types of thermosetting resins and thermally conductive fillers mentioned above is often realized through the steps of solution mixing, gluing-baking-curing, etc. In this process, the amount of thermally conductive fillers added is very limited, resulting in The improvement of the thermal conductivity of the copper plate is also very limited; at the same time, the high thermal conductivity filler with a high filling amount will seriously affect the dielectric constant of the copper clad laminate; more importantly, the hexagonal crystal represented by boron nitride and aluminum nitride Type high thermal conductivity filler, because of its anisotropy, the thermal conductivity of the copper clad laminate in the thickness direction is much smaller than the thermal conductivity in the plane direction, and the comprehensive performance is difficult to meet the current high-speed, high-frequency, lossless and large-capacity information transmission. needs

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