Microchip capacitor and manufacturing method thereof

Abstract

The invention discloses a microchip capacitor and a manufacturing method thereof. The chip capacitor comprises a prefabricated solder tin layer, a prefabricated solder gold layer, a barrier layer, analuminum-silicon alloy substrate, a bonding layer, a conductive layer, a dielectric layer and an electrode layer which are stacked in sequence. The manufacturing method comprises the following steps:S1, providing an aluminum-silicon alloy substrate and carrying out pretreatment; S2, preparing a barrier layer on the first surface of the aluminum-silicon alloy substrate, and preparing a bonding layer on the second surface of the aluminum-silicon alloy substrate; S3, plating gold on the barrier layer to form a prefabricated solder gold layer, and plating a conductive layer on the bonding layer;S4, sputtering a dielectric layer and an electrode layer on the conductive layer; S5, forming a prefabricated solder tin layer on the prefabricated solder gold layer through tin electro-deposition; and S6, scribing to obtain the independent microchip capacitor. According to the invention, the aluminum-silicon alloy is used as the substrate, the substrate does not need to be polished or sputtered with a priming coat, the capacitor area is large, the manufacturing period is short, and the assembling difficulty of the microchip capacitor is reduced.

Description

technical field [0001] The invention relates to the packaging field of aluminum-silicon microwave components, in particular to a microchip capacitor and a manufacturing method thereof. Background technique [0002] With the continuous development of high frequency and miniaturization of electronic products, the requirements for components are getting higher and higher. As a common passive device in electronic circuits, capacitors have developed various device forms suitable for different occasions. In the microwave field, capacitors are mainly used for impedance matching, coupling DC blocking, bypass decoupling, etc. Compared with other forms of capacitors, chip capacitors have the following characteristics: ① high strength, high temperature resistance; ② MIM capacitor structure is simple, stable and reliable performance; ③ gold as the surface metal electrode, suitable for micro-assembly process; ④ low temperature change rate, low loss and high Q. Therefore, chip capacito...

AI Technical Summary

Problems solved by technology

Chip capacitors are generally manufactured by thin-film circuit technology. The processing technology of conventional-sized chip capacitors is relatively mature, but the processing and assembly process of micro-sized capacitors is relatively difficult.

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