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Preparation method of epoxy silver conductive adhesive containing graphene/silver heat conduction network

A technology of graphene and conductive adhesives, which is applied in the direction of epoxy resin adhesives, conductive adhesives, adhesives, etc., can solve problems such as delamination failure, achieve improved strength and stability, long service life, and improved electrical and thermal conductivity Effect

Inactive Publication Date: 2021-01-05
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the technical problem that existing conductive adhesives are prone to delamination failure when applied in high-power devices, and provides a preparation method of epoxy silver conductive adhesive containing graphene / silver thermal conduction network

Method used

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  • Preparation method of epoxy silver conductive adhesive containing graphene/silver heat conduction network
  • Preparation method of epoxy silver conductive adhesive containing graphene/silver heat conduction network
  • Preparation method of epoxy silver conductive adhesive containing graphene/silver heat conduction network

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Embodiment 1: add linear nano-silver powder in the network component in this embodiment, preparation step is specifically as follows:

[0039] (1) Preparation of graphene oxide: at room temperature, prepare graphene oxide according to the components specified in Example 2 in Table 1 respectively.

[0040] (2) Networking of graphene: disperse the above-mentioned graphene oxide in deionized water, and sonicate for 1 hour to obtain a graphene oxide / water dispersion. Add linear nano-silver powder (2g) and silver nitrate (80ml) and heat and stir for 10h. Then add p-phenylenediamine, stir at 80°C for 24h, wash and remove excess modifier molecules, and dry to prepare a three-dimensional network graphene / silver composite graphene hydrogel, and then freeze-dry to obtain a three-dimensional Graphene aerogels with networked graphene / silver composites.

[0041] (3) Bisphenol A type, bisphenol F type epoxy resin and 1,4-cyclohexanediol glycidyl ether epoxy diluent were mixed at ro...

Embodiment 2

[0044] Embodiment 2: add linear nano-silver powder in the network component in this embodiment, preparation step is specifically as follows:

[0045] (1) Preparation of graphene oxide: at room temperature, prepare graphene oxide according to the components specified in Example 2 in Table 1 respectively.

[0046] (2) Networking of graphene: disperse the above-mentioned graphene oxide in deionized water, and sonicate for 1 hour to obtain a graphene oxide / water dispersion. Add linear nano-silver powder (3g) and silver nitrate (80ml) and heat and stir for 10h. Then add p-phenylenediamine, stir at 80°C for 24h, wash and remove excess modifier molecules, and dry to prepare a three-dimensional network graphene / silver composite graphene hydrogel, and then freeze-dry to obtain a three-dimensional Graphene aerogels with networked graphene / silver composites.

[0047] (3) Bisphenol A type, bisphenol F type epoxy resin and polyethylene glycol diglycidyl ether, 1,4-cyclohexanediol glycidy...

Embodiment 3

[0050] Embodiment 3: add linear nano-silver powder in the network component in this embodiment, preparation step is specifically as follows:

[0051] (1) Preparation of graphene oxide: at room temperature, prepare graphene oxide according to the components specified in Example 4 in Table 1 respectively.

[0052] (2) Networking of graphene: disperse the above-mentioned graphene oxide in deionized water, and sonicate for 1 hour to obtain a graphene oxide / water dispersion. Add linear nano-silver powder (5g) and silver nitrate (80ml) and heat and stir for 10h. Then add p-phenylenediamine, stir at 80°C for 24h, wash and remove excess modifier molecules, and dry to prepare a three-dimensional network graphene / silver composite graphene hydrogel, and then freeze-dry to obtain a three-dimensional Graphene aerogels with networked graphene / silver composites.

[0053] (3) Bisphenol A type, bisphenol F type epoxy resin and 1,4-cyclohexanediol glycidyl ether, diethylene glycol glycidyl et...

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Abstract

The invention discloses a preparation method of an epoxy silver conductive adhesive containing a graphene / silver heat conduction network, belongs to the technical field of electronic materials, and isparticularly suitable for the field of IC and LED packaging. The conductive adhesive is composed of the following components in percentage by weight: 1-25% of graphene oxide, 50%-80% of linear nano silver powder, 10%-20% of epoxy resin, 3%-10% of epoxy diluent, 1%-5% of curing agent, 1%-5% of curing accelerator and 0.5%-2% of coupling agent. By introducing graphene / silver, the thermal conductivity and the mechanical property of a resin network in the conductive adhesive are realized, so that the material has relatively long service life; in addition, the graphene and conductive metal powder are added and mixed for use, so that the conductivity and thermal conductivity of the conductive adhesive are greatly improved, and the epoxy silver conductive adhesive with excellent comprehensive performance is prepared.

Description

Technical field: [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a method for preparing an epoxy-silver conductive adhesive containing a graphene / silver heat-conducting network. The epoxy-silver conductive adhesive prepared by the invention is particularly suitable for IC and LED packaging fields. Background technique: [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It is mainly composed of resin matrix and its conductive particles. The commonly used resin matrix includes epoxy resin, acrylic resin, polyurethane resin, cyanate resin, etc. The conductive particles mainly include: Silver, copper, silver-coated copper, nickel, carbon nanotubes, graphene, etc. [0003] Conductive adhesives are mainly used as interconnect materials in the fields of microelectronic packaging and LED packaging, which play the role of heat conduction and conduction. However, with the high integrat...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J9/02
CPCC09J163/00C09J9/02C08L2205/025C08K2201/011C08K2201/014C08L63/00C08K13/04C08K7/24
Inventor 高宏吴俊杰王苗苗金玲张奎夏友谊
Owner ANHUI UNIVERSITY OF TECHNOLOGY