Polycarbonate/polyester alloy and preparation method and application thereof

Abstract

The present invention relates to a polycarbonate / polyester alloy and its preparation method and application. The alloy is prepared from raw materials including the following mass percentages: 60%-85% bisphenol A polycarbonate, 1.5±0.1 refractive index, and 12%-12%-polyester resin with a glass transition temperature of 60°C-100°C 35%, compatibilizer 1%-5%, transesterification inhibitor 0.1%-5%, light diffusing agent with refractive index of 1.35-1.49 0.1%-3%; the polyester resin is selected from PET resin and / or PETG resin. The existence of low Tg polyester chain reduces the thermal deformation temperature of the alloy by 15-45℃, which is beneficial to processing and is not easy to warp; and the addition of transesterification inhibitor and compatibilizer synergistically makes the alloy inherit the transparency of bisphenol A-type PC and maintain high light transmittance; the addition of light diffusing agent can improve the haze of the alloy.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a polycarbonate / polyester alloy and a preparation method and application thereof. Background technique [0002] LED (Light Emitting Diode) is a light-emitting diode. LED light source is favored due to its low energy consumption, low heat, environmental protection and long life. It will replace traditional incandescent lamps and energy-saving lamps and become the fourth-generation lighting source. At the same time, due to its excellent performance, it also has potential application value in many other aspects, including signal indication, green display, special lighting, etc. [0003] However, there are still many areas in the existing LEDs that need to be improved. For example, one of the most fatal shortcomings of LEDs is its point light source characteristics. Specifically, compared with traditional light sources, LED chips emit concentrated and intense light, which will lead ...

AI Technical Summary

Problems solved by technology

It occurs in three stages: before the gate is solidified, the plastic cooling process stage and the free shrinkage of the product after demolding. At present, the warping deformation can be reduced by increasing the mold temperature and rapidly changing the mold temperature (see patent CN208375920U). But doing so will increase the cost

It can be seen that it is difficult to make bisphenol A-based PC take into account the advantages of high light transmittance, high haze, low cost and low warpage

[0013] At present, the LED light diffusion plate adopts the method of combining volume diffusion and surface diffusion, that is, the dual method of light diffusion particles and surface microstructure is used to achieve the purpose of high light transmittance and high haze, and the surface microstructure is mostly complex. Geometric three-dimensional structures, such as pyramids, microlenses, etc. At the same time, the light diffusion plate is developing towards thinner and thinner, which is more likely to cause warping and deformation of the part. The molding technology requires higher and higher requirements. The thermal deformation of the material is reduced by polyester alloy temperature is necessary

Images