Special room temperature cured epoxy resin A/B adhesive for mutual inductor body bonding

Abstract

The invention provides a special room temperature cured epoxy resin A / B adhesive for mutual inductor body bonding, and relates to the field of epoxy resin adhesives. The special room temperature curedepoxy resin A / B adhesive comprises a component A and a component B. The specific components of the component A and component B and parts by weight are: 250-400 parts of bisphenol A epoxy resin, 150-300 parts of high temperature epoxy resin, 20-80 parts of a bifunctional epoxy diluent, and 1-20 parts of a coupling agent, 100-200 parts of calcium carbonate, 150-250 parts of quartz sand, 20-50 partsof silicon dioxide, 3 parts of yellow colorant. The component B comprises 150-300 parts of polyamide, 150-250 parts of alicyclic amine curing agent, 30-100 parts of m-phenylenediamine and 20-80 partsof polyether amine. The viscosity and thixotropy of the A / B glue are adjusted through the silicon dioxide, so that the production operation is facilitated, the thixotropy is high, the flowability isgood, and materials can be conveniently pumped. After being uniformly mixed, the glue is conveyed to a specified position of a mutual inductor, does not flow at normal temperature, and does not collapse during high-temperature curing.

Description

technical field [0001] The invention relates to the field of epoxy resin glue, in particular to room temperature curing epoxy resin A / B glue specially used for bonding transformer bodies. Background technique [0002] At present, there are the following disadvantages: in the process of epoxy resin pouring transformer, the bonding and fixing of the internal coil and the large gap of the metal insert is extremely important, the appropriate distance and the coil cannot fall off during the high temperature pouring process, resulting in waste products. For the bonding and fixing of coils and metal inserts, it is required that the colloid cannot flow, but in the actual operation process, the epoxy resin glue is required to have certain fluidity. At the same time, it is required that the coil and the metal insert cannot be broken or deformed at a temperature of 140°C. [0003] Generally, most epoxy resins are liquid bisphenol A epoxy. This type of epoxy resin has moderate viscosit...

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Problems solved by technology

[0002] At present, there are the following disadvantages: in the process of epoxy resin pouring transformer, the bonding and fixing of the internal coil and the large gap of the metal insert is extremely important, the appropriate distance and the coil cannot fall off during the high temperature pouring process, resulting in waste products

[0003] Generally, most epoxy resins are liquid bisphenol A epoxy. This type of epoxy resin has moderate viscosity and is convenient for construction and operation. Its disadvantage is poor high-temperature bonding performance. Even if alicyclic amine curing agent is used, most of the heat distortion temperature is not higher Around 100°C, it cannot meet the safe use under the condition of 140°C, the bonding point breaks occasionally, and serious quality accidents occur

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