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High-thermal-conductivity silver paste for bonding high-power component and preparation method of high-thermal-conductivity silver paste

A high-power component, high thermal conductivity technology, used in adhesives, adhesive types, conductive adhesives, etc. Bond strength and thermal stability, and the effect of ensuring bond stability and service life

Inactive Publication Date: 2021-03-26
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of poor thermal conductivity, poor electrical conductivity, low bonding strength of the existing silver paste, and the reduction of thermal conductivity caused by increasing the bonding strength

Method used

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  • High-thermal-conductivity silver paste for bonding high-power component and preparation method of high-thermal-conductivity silver paste
  • High-thermal-conductivity silver paste for bonding high-power component and preparation method of high-thermal-conductivity silver paste
  • High-thermal-conductivity silver paste for bonding high-power component and preparation method of high-thermal-conductivity silver paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Embodiment 1: the preparation of flaky silver powder

[0067] 1) Preparation of silver nitrate (AgNO 3 ) solution: place a 2L beaker in a water bath at 40°C, inject 600mL deionized water into the beaker, and then add 200g AgNO 3 , turn on the mechanical stirring, wait for the AgNO 3 After complete dissolution, add dispersant and continue stirring for 10 minutes to obtain AgNO 3 aqueous solution;

[0068] 2) Preparation of Ag 2 CO 3 Suspension: Dissolve Na with 480mL deionized water 2 CO 3 Dissolved, and slowly added to the solution obtained in step 1), after the addition, continued to stir for 15 minutes to obtain dark gray Ag 2 CO 3 suspension;

[0069] 3) After raising the temperature of the water bath to 45°C, turn off the heating, and slowly add 60mL of formaldehyde to the suspension obtained in step 2). grayish-yellow earth color;

[0070] 4) After the reaction is over, let it stand still, and after the water powder is completely separated, remove the up...

Embodiment 2

[0076] Embodiment 2: the preparation of spherical silver powder

[0077] 1) Preparation of silver nitrate (AgNO 3 ) solution: place a 2L beaker in a water bath at 40°C, inject 600mL deionized water into the beaker, and then add 200g AgNO 3 , turn on the mechanical stirring, wait for the AgNO 3 After complete dissolution, add dispersant and continue stirring for 10 minutes to obtain AgNO 3 aqueous solution;

[0078] 2) Preparation of Ag 2 CO 3 Suspension: Dissolve Na with 480mL deionized water 2 CO 3 Dissolved, and slowly added to the solution obtained in step 1), after the addition, continued to stir for 15 minutes to obtain dark gray Ag 2 CO 3 suspension;

[0079] 3) After heating the water bath to 45°C, turn off the heating, and slowly add 60mL of formaldehyde to the suspension obtained in step 2). grayish-yellow earth color;

[0080] 4) After the reaction is over, let it stand still, and after the water powder is completely separated, remove the upper clear layer...

Embodiment 3

[0085] Embodiment 3: the preparation of part flaky silver powder

[0086] 1) Preparation of silver nitrate (AgNO 3 ) solution: place a 5L beaker in a water bath at 40°C, inject 1.5L deionized water into the beaker, and then add 200g AgNO 3 , turn on the mechanical stirring, wait for the AgNO 3 After complete dissolution, add dispersant and continue stirring for 10 minutes to obtain AgNO 3 aqueous solution;

[0087] 2) Preparation of Ag 2O suspension: Dissolve NaOH with 200mL deionized water, turn on the heating, and raise the temperature of the water bath to 55°C, then slowly add the NaOH solution to the solution obtained in step 1), as the reaction progresses, the color deepens, after the addition, continue Stir for 15min to get gray-black Ag 2 O suspension;

[0088] 3) Turn off the heating, slowly add 450g of triethanolamine to the suspension obtained in step 2), after the addition is complete, stir until the water and powder are separated, continue stirring for 15 min...

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Abstract

The invention discloses high-thermal-conductivity silver paste for bonding a high-power component and a preparation method of the high-thermal-conductivity silver paste. The high-thermal-conductivitysilver paste comprises epoxy resin, a modifier, a curing agent and silver powder, the epoxy resin is one or a mixture of more of bisphenol A epoxy resin, alicyclic epoxy resin and bisphenol F epoxy resin; the modifier is formed by mixing one or more of thermoplastic phenolic resin, gamma butyrolactone, bisphenol A diallyl ether and bisphenol A glycidyl methacrylate; the curing agent is formed by mixing one or more of a latent curing agent 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, methylhexahydrophthalic anhydride and dicyandiamide; and the silver powder is formed by mixing one or more of flake silver powder, sphere-like silver powder and part of flake silver powder. The invention also provides a preparation method and a test method of the silver paste. The problemsthat existing silver paste is poor in thermoelectricity and bonding performance, and the bonding strength and the heat conduction performance contradict with each other are solved. The method is widely applied to the bonding process of the power device.

Description

technical field [0001] The invention belongs to the field of electronic components, specifically, to the field of power devices, and more specifically, to the field of adhesive materials for power devices. Background technique [0002] With the continuous development of electronic science and technology, the high performance and miniaturization of electronic equipment put forward higher requirements for the thermal management efficiency of the equipment. Therefore, improving and optimizing the heat dissipation of electronic equipment is an important research topic in the field of microelectronics , especially for some high-power components, the quality of heat dissipation directly affects the components, and even the normal operation and service life of the equipment. Adhesive, as an important interface material, not only plays a role in connecting different electronic components, providing certain mechanical bonding performance, but also the main current path and heat condu...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02C09J11/06C09J4/06
CPCC09J163/00C09J9/02C09J11/06C09J4/06C08K2003/0806C08L2201/08C08K7/00C08K3/08C08K5/1535C08K7/18
Inventor 罗廷福杨岚琼蔡园园陈思纤韩玉成
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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