Electrode slurry in contact with p+ emitter of N-type solar cell

Abstract

The invention discloses electrode slurry in contact with a p+ emitter of an N-type solar cell, and relates to the technical field of photovoltaic cells. The electrode slurry comprises the following components in parts by weight: 80-90 parts of conductive silver powder, 0.5-3 part of aluminum powder, 3-8 parts of glass powder, 0.1-2 part of lanthanum-aluminum alloy powder or lanthanum-ytterbium-aluminum alloy powder, 6-10 parts of an organic carrier and 0-2 parts of an auxiliary agent. According to the electrode slurry, an applicant selects the components and the proportion, so that the conversion efficiency can exceed 23.5% after the prepared slurry is applied to the N-type solar cell.

Description

technical field [0001] The invention relates to the technical field of photovoltaic cells, in particular to an electrode paste in contact with a p+ emitter of an N-type solar cell. Background technique [0002] At present, the mainstream solar cell in the photovoltaic market is the p-type PERC (Passivated Emitter and RearCell) cell, that is, the passivated emitter and the back cell. The back surface of the PERC cell is passivated by a dielectric film, and the local metal Contact, greatly reducing the recombination rate of the back surface, while improving the light reflection of the back surface. The PERC battery is a p-type battery, and the front surface is a phosphorus-doped n+ emitter structure, and the conversion efficiency is about 23%. [0003] At present, p-type batteries occupy the absolute share of the crystalline silicon battery market, but with the sharp increase in market demand for high-efficiency batteries and high-power components, n-type batteries have the a...

AI Technical Summary

Problems solved by technology

However, in order to reduce metal recombination, battery manufacturers currently use low-temperature sintering processes to produce n-PERT batteries and TOPCon batteries. This patent only adds aluminum-silicon alloy powder. During sintering, enough silver-aluminum-silicon contact points cannot be formed, and it is difficult to form ohmic contact with the p+ emitter. A large amount of addition will also cause poor printing when the grid lines are thin (<30 microns)

[0005] The problem of low-temperature sintering can be solved by increasing the corrosiveness of the glass, but it is easy to cause the silver-aluminum contact point to grow too large, burn through the PN junction, and cause the metal composite at the contact position to be too large. How to balance the pair of ohmic contact and metal composite The seesaw is also a big problem

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