Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Laser additive-polishing integrated machining method and device

A technology of laser additive and additive forming, which is applied in the direction of additive processing, laser welding equipment, metal processing equipment, etc., to achieve the effect of improving surface accuracy, improving surface mechanical properties, and reducing processing costs

Pending Publication Date: 2021-04-09
SHANDONG JIANZHU UNIV
View PDF1 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide an additive-polishing integrated processing method and device for improving processing efficiency, effectively improving the surface accuracy of laser additive parts, and improving the mechanical properties of the parts surface, so as to solve the problems existing in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser additive-polishing integrated machining method and device
  • Laser additive-polishing integrated machining method and device
  • Laser additive-polishing integrated machining method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] refer to image 3 , Figure 4 , Figure 5 , the reflector 22 and the holographic optical element 31 are sequentially installed inside the cylinder 19, and the circular incident laser beam 20 from figure 2 The light entrance 21 shown is incident on the reflector 22, and the reflector 22 reflects the circular incident beam 20 to the surface of the holographic optical element 31, and forms two focused beams through diffraction by the holographic optical element 31: focused beam I30, focused beam II29, The focused beam I30 and the alloy wire fed by the wire feed tube 27 are additively manufactured on the substrate, and the focused beam II29 is simultaneously laser polished.

[0032] During operation, the circular incident laser beam 20 is reflected to the surface of the holographic optical element 31 by the reflector 22, and is diffracted by the holographic optical element 31 to form two focused beams: focused beam I30 and focused beam II29. At this time, the wire feedin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a laser additive-polishing integrated machining method and device. The method can be used for surface polishing of laser additive-manufactured parts, in the additive-manufacturing process, additive manufacturing and polishing are conducted synchronously, laser polishing is utilized, and a flat and smooth surface is quickly obtained, so that the integration of additive machining and polishing machining is realized. The device mainly comprises a mechanical arm, a barrel, a reflector, a holographic optical element, a cooling system and a wire feeding pipe, and is characterized in that a circular incident laser beam is reflected to the surface of the holographic optical element through the reflector and diffracted into two focused beams by the holographic optical element, and the focused beams I and an alloy wire are used for additive forming; and the focused beam II is used for additive forming subsequent polishing. The method and the device have the advantages that (1) the surface quality of the material can be effectively improved, and the mechanical property of the material surface is improved; and (2) the device adopts alloy wires for additive manufacturing, so that the problems of powder splashing and the like are avoided.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a laser additive-polishing integrated processing method and a device thereof. Background technique [0002] Laser additive manufacturing technology is one of the most potential advanced manufacturing technologies at present. This technology is based on the principle of discrete / stacking forming. The three-dimensional CAD model of the workpiece is sliced ​​and layered to convert it into a two-dimensional plane model with a thin thickness. Using a high-power laser, the CNC system controls the workbench according to the layered software. The specified path is scanned point-by-point, line-by-line, and layer-by-layer, so that the material is melted and stacked layer by layer, so as to realize the rapid and fully dense forming of parts with complex structures. It has not only been widely used in aerospace, biomedical and other fields, Moreover, it has very important strategic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/342B23K26/352B23K26/064B33Y30/00
CPCB23K26/0643B33Y30/00B23K26/064B23K26/342B23K26/3576
Inventor 赵彦华杜传彬孟伟王家明田文浩路来骁
Owner SHANDONG JIANZHU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com