Unlock instant, AI-driven research and patent intelligence for your innovation.

A high modulus and high hardness polyimide film

A technology of polyimide film and polyimide, which is applied in the field of polyimide, and can solve problems such as nanoparticle agglomeration, high viscosity of polyamic acid solution, and damage to product performance.

Active Publication Date: 2022-05-20
ZHEJIANG OCAS NEW MATERIALS CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese patent CN101289542A provides a method of bulk polymerization modification using spherical powder silica and polyimide, but in this method, the viscosity of the polyamic acid solution is relatively high, and in the state of high viscosity, the method of physical dispersion cannot solve the problem of nano The serious defect of particle agglomeration, which makes the prepared silica composite polyimide film, the inorganic particle size is large, the dispersion scale is not good, and the performance of the product is greatly damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high modulus and high hardness polyimide film
  • A high modulus and high hardness polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A kind of high modulus high hardness polyimide film, its preparation method comprises:

[0021] S1. Add 2.0mL of ammonia water (25%) into 30mL of ethanol water solution with a volume ratio of 4:1 and stir evenly, then add 30mL of absolute ethanol dissolved in 1.1mL of tetraethyl orthosilicate, and stir for 5 hours to obtain di Silica microsphere sol, washed, filtered, and dried at 60°C for 12 hours to obtain silica microspheres;

[0022] Add 1g of silica microspheres to 10mL of sodium hydroxide aqueous solution (10wt%), stir in a water bath at 80°C for 2h, cool to room temperature after the reaction, filter, wash with water, and dry at 60°C for 12h to obtain surface hydroxylated modified Non-toxic silica microspheres;

[0023] S2. Under a nitrogen atmosphere, add 12.6g (100mmol) of 2,5-diaminopyrimidin-4(3H)-one into 200mL of anhydrous N,N-dimethylacetamide (DMAc) and stir evenly, then add 44.4g (100mol) 4,4'-(hexafluoroisopropylene) diphthalic anhydride, stirred and ...

Embodiment 2

[0026] A kind of high modulus high hardness polyimide film, its preparation method comprises:

[0027] S1. Add 2.0mL of ammonia water (25%) into 30mL of ethanol water solution with a volume ratio of 4:1 and stir evenly, then add 30mL of absolute ethanol dissolved in 1.1mL of tetraethyl orthosilicate, and stir for 5 hours to obtain di Silica microsphere sol, washed, filtered, and dried at 60°C for 12 hours to obtain silica microspheres;

[0028] Add 1g of silica microspheres to 10mL of sodium hydroxide aqueous solution (10wt%), stir in a water bath at 80°C for 2h, cool to room temperature after the reaction, filter, wash with water, and dry at 60°C for 12h to obtain surface hydroxylated modified Non-toxic silica microspheres;

[0029] S2. Under nitrogen atmosphere, add 5.04g (40mmol) 2,5-diaminopyrimidin-4(3H)-one and 12.0g (60mmol) 4,4'-diaminodiphenyl ether into 200mL anhydrous N,N- Stir evenly in dimethylacetamide (DMAc), then add 44.4g (100mol) 4,4'-(hexafluoroisopropylen...

Embodiment 3

[0032] A kind of high modulus high hardness polyimide film, its preparation method comprises:

[0033] S1. Add 2.0mL of ammonia water (25%) into 30mL of ethanol water solution with a volume ratio of 4:1 and stir evenly, then add 30mL of absolute ethanol dissolved in 1.1mL of tetraethyl orthosilicate, and stir for 5 hours to obtain di Silica microsphere sol, washed, filtered, and dried at 60°C for 12 hours to obtain silica microspheres;

[0034] Add 1g of silica microspheres to 10mL of sodium hydroxide aqueous solution (10wt%), stir in a water bath at 80°C for 2h, cool to room temperature after the reaction, filter, wash with water, and dry at 60°C for 12h to obtain surface hydroxylated modified Non-toxic silica microspheres;

[0035] S2. Under nitrogen atmosphere, add 5.04g (40mmol) 2,5-diaminopyrimidin-4(3H)-one and 12.0g (60mmol) 4,4'-diaminodiphenyl ether into 200mL anhydrous N,N- Stir evenly in dimethylacetamide (DMAc), then add 44.4g (100mol) 4,4'-(hexafluoroisopropylen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention proposes a polyimide film with high modulus and high hardness, comprising a matrix of polyimide and silicon dioxide microspheres dispersed in the matrix of polyimide; the polyimide is The diamine monomer including pyrimidinone diamine is obtained by polycondensation reaction with tetracarboxylic dianhydride, and the silica microsphere is a silica microsphere modified by surface hydroxylation. The invention proposes a polyimide film with high modulus and high hardness. The polyimide film can simultaneously have the performance advantages of high modulus and high hardness.

Description

technical field [0001] The invention relates to the technical field of polyimide, in particular to a polyimide film with high modulus and high hardness. Background technique [0002] In recent years, with the thinning of smartphones and tablet computers, high computing power and high storage capacity, the requirements for polyimide film materials have become higher and higher, such as higher modulus, lower shrinkage, and more Excellent three-dimensional dimensional stability, more excellent thermal conductivity, etc. The acquisition of these properties depends on the compounding and modification of organic materials by inorganic nanomaterials. [0003] Chinese patent CN101289542A provides a method of bulk polymerization modification using spherical powder silica and polyimide, but in this method, the viscosity of the polyamic acid solution is relatively high, and in the state of high viscosity, the method of physical dispersion cannot solve the problem of nano Particle agg...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K9/02C08K7/18C08J5/18C08G73/10
Inventor 金文斌张明松阙新红
Owner ZHEJIANG OCAS NEW MATERIALS CO LTD