High-power low-frequency intermittent ultrasonic-assisted electroforming system and method
An ultrasonic-assisted, high-power technology, applied in the field of precision device processing, can solve problems such as surface quality deterioration, mold deformation or damage, and achieve the effects of low cost, easy control, and high dimensional accuracy
Active Publication Date: 2022-04-22
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology
However, studies on ultrasonic-assisted UV-LIGA electroforming have shown that the cavitation energy generated by the transient collapse of bubbles under continuous ultrasonication may deform or damage the mold of the photoresist, and even deteriorate the deposited surface quality (especially in at high power and low frequency)
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example 1
[0023] Step 1: First configure the iron-nickel alloy electroforming solution, the formula is: NiSO 4 ·6H 2 O 130g / L, FeSO 4 ·7H 2 O 80g / L, H 3 BO 3 45g / L, NiCl 2 15g / L, saccharin 4g / L, wetting agent 0.3g / L. The temperature of the liquid iron-nickel alloy electroforming solution is 55°C and the pH is 3.
[0024] Step 2: Turn on the relay and set the relay working time T on 80s, closing time T off for 60s. Turn on the power switch and set the current density to 1A / dm 2 , turn on the ultrasonic generator and ultrasonic transducer, set the ultrasonic frequency to 40KHz, and set the power of the ultrasonic generator to 120W.
[0025] Step 3: Turn on the power, and obtain an iron-nickel alloy mask with a thickness of 20um after electrodeposition for 3 hours. After the electrodeposition is completed, the photoresist cathode is placed in an acetone solution for ultrasonic treatment to remove the photoresist on the cathode and release the mold.
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The invention relates to a high-power low-frequency intermittent ultrasonic-assisted electroforming system and method, belonging to the technical field of precision device processing. By applying high-power low-frequency intermittent ultrasound during the electroforming process, the deformation caused by keeping the photoresist under the action of high-power ultrasound is solved, and at the same time, the erosion and damage to the surface of the deposited layer by continuous ultrasound is avoided. In relay T on When the ultrasonic transducer and the power supply work at the same time, the metal cations in the solution are quickly deposited on the surface of the photoresist cathode under the action of the electric field force and ultrasonic waves, and at the same time, the hydrogen bubbles generated on the surface of the photoresist cathode can quickly leave the surface ; at relay T off , the ultrasonic transducer stops working, and the power supply continues to work. There is no ultrasonic auxiliary effect on the photoresist cathode surface, and the metal cations in the solution are only deposited on the photoresist cathode surface under the action of electric field force. Relay T on and T off The infinite cycle realizes the ultrasonic-assisted intermittent action on the photoresist cathode surface. The electrodeposited layer prepared by the invention has relatively smooth surface, small friction coefficient and high dimensional accuracy.
Description
technical field [0001] The invention belongs to the technical field of precision device processing, and in particular relates to a high-power low-frequency intermittent ultrasonic-assisted electroforming system and method. Background technique [0002] UV-LIGA technology derived from LIGA technology is an important processing method in the field of microfabrication. Various MEMS metal microstructures can be produced by using its electrodeposition method. SU-8 photoresist is a commonly used processing material for UV-LIGA technology. It is a near-UV, negative-tone epoxy photoresist. It has low absorption of light energy in the near-ultraviolet range, and the consistency of the exposure of the entire photoresist layer is good, so that the sidewall of the thick film pattern is almost vertical after development and has a high aspect ratio. In addition, the thermal stability, chemical corrosion resistance and mechanical properties of SU-8 glue are relatively good, and its non-...
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IPC IPC(8): C25D1/00
CPCC25D1/00
Inventor 李安心朱增伟
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS