Electrode leading-out method and packaging method of tantalum electrolytic capacitor

A tantalum electrolytic capacitor and electrode lead-out technology, applied in the direction of electrolytic capacitors, capacitor electrodes, solid electrolytic capacitors, etc., can solve the problems of limiting product miniaturization, thinning, and low space utilization, and achieve increased reliability design margin, Improved space utilization and the effect of preventing short circuits

Active Publication Date: 2021-04-30
东莞顺络钽电容电子有限公司
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Problems solved by technology

[0003] The main purpose of the present invention is to overcome the deficiencies of the prior art and propose a method for drawing out electrodes of tantalum electrolytic capacitors to solve the problems of low space utilization and limited miniaturization and thinning of products in the existing way of drawing out electrodes of electrolytic capacitors

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  • Electrode leading-out method and packaging method of tantalum electrolytic capacitor
  • Electrode leading-out method and packaging method of tantalum electrolytic capacitor
  • Electrode leading-out method and packaging method of tantalum electrolytic capacitor

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Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0027] A specific embodiment of the present invention provides a method for leading out electrodes of a tantalum electrolytic capacitor, the method comprising the following steps S1-S4:

[0028] S1. Make an insulating protective layer outside the electrode body of the tantalum electrolytic capacitor. refer to figure 2 , Figure 4 or Figure 8 , the electrode body includes an anode tantalum core 10, a cathode layer 20 (the main body of the cathode layer is a conductive polymer layer, a graphite layer and a silver layer) and the terminal 11 (or 12, 13) of the tantalum core 10. It should be noted that, The dielectric layer (tantalum pentoxide) between the tantalum core 10 and the cathode layer 20 is not shown in the figure, that is to say, there is a dielectric layer between the tantalum core 10 and the cathode layer 20 shown in the drawings, ...

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Abstract

The invention discloses an electrode leading-out method and a packaging method of a tantalum electrolytic capacitor. The electrode leading-out method comprises the following steps of S1, manufacturing an insulating protective layer outside an electrode body of the tantalum electrolytic capacitor; S2, exposing a cathode leading-out part at a cathode pre-leading-out part, and exposing a tantalum core leading-out end in an area where the tantalum core terminal is located; S3, respectively depositing metal layers on the exposed cathode leading-out part and the tantalum core leading-out end; and S4, respectively manufacturing external electrodes for surface mounting on the metal layer of the cathode leading-out part and the metal layer of the tantalum core leading-out end so as to respectively lead out the cathode and the anode. According to the method, the space utilization rate in a product is improved, the miniaturization and thinning of the product are facilitated, and meanwhile the electrical performance of the product can be improved.

Description

technical field [0001] The invention relates to the technical field of processing technology of electronic components, in particular to an electrode lead-out method and a packaging method of a tantalum electrolytic capacitor. Background technique [0002] Traditional chip electrolytic capacitors have two protruding anode leads and cathode leads bent toward the bottom surface of the encapsulating resin body. The anode and cathode leads are used to meet the SMD mounting requirements of printed circuit boards. For the electrode lead-out method of traditional chip electrolytic capacitors, refer to figure 1 , so that the product is assembled on the lead frame, the cathode 80 of the capacitor element is bonded to the cathode lead frame 81 through the conductive silver paste 82, and the cathode of the product is drawn out; the anode is welded by resistance welding, and the anode is drawn out; and then encapsulated by epoxy resin injection form a capacitor. Capacitors formed by tr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/008H01G9/048H01G9/08H01G13/00
CPCH01G9/008H01G9/048H01G9/08H01G13/006H01G13/003H01G9/012H01G9/052H01G9/10H01G9/15H01G2009/05
Inventor 齐兆雄李有云曾台彪
Owner 东莞顺络钽电容电子有限公司
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