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Curable resin composition and electronic component device

A hardening resin, composition technology, applied in the direction of electrical components, electrical solid state devices, semiconductor/solid state device parts, etc., can solve the problems of package cracks, poor electrical characteristics, exposure to soldering temperature (reflow temperature), etc. , to achieve the effect of excellent reflow resistance and excellent adhesion

Pending Publication Date: 2021-05-14
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the surface mount type package, the entire electronic component device is processed with a solder bath, reflow equipment, etc., so the package is directly exposed to the soldering temperature (reflow temperature)
As a result, when the package absorbs moisture, the moisture will rapidly expand due to the moisture absorption during soldering, and the generated vapor pressure will act as peeling stress, causing peeling between the interposer such as the element and the lead frame and the sealing material, sometimes becoming Causes of package cracks, poor electrical characteristics, etc.

Method used

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  • Curable resin composition and electronic component device
  • Curable resin composition and electronic component device
  • Curable resin composition and electronic component device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0224] (Method for preparing curable resin composition)

[0225] The method for preparing the curable resin composition is not particularly limited. As a general method, a method of sufficiently mixing components in predetermined amounts with a mixer or the like, melt-kneading with a grinding roll, an extruder, or the like, cooling and pulverizing is mentioned. More specifically, for example, a method of uniformly stirring and mixing predetermined amounts of the above components, kneading and cooling with a kneader, roll, extruder, etc. heated at 70°C to 140°C in advance, smash.

[0226] The curable resin composition is preferably solid at normal temperature and normal pressure (for example, at 25° C. under atmospheric pressure). The shape of the curable resin composition when it is solid is not particularly limited, and examples thereof include powder, granular, and sheet shapes. When the curable resin composition is in the form of a sheet, it is preferable that the dimens...

Embodiment

[0233] Hereinafter, although the said embodiment is demonstrated concretely using an Example, the range of the said embodiment is not limited to these Examples.

[0234] [Preparation of curable resin composition]

[0235] Examples 1 to 1 were prepared by mixing the following materials with the compositions (parts by mass) described in Table 1 and Table 2, and performing roll kneading at a kneading temperature of 80°C and a kneading time of 15 minutes. 15. The curable resin composition of Comparative Example 1 to Comparative Example 8.

[0236] (epoxy resin)

[0237] · Epoxy resin 1: a biphenyl type epoxy resin having an epoxy equivalent of 196 g / eq and a melting point of 106° C. (Mitsubishi Chemical Corporation, trade name “YX-4000H”)

[0238] Epoxy resin 2: Epoxy equivalent 282g / eq, the styrene-modified phenol novolak type epoxy resin of 59 ℃ of softening points (Nippon Steel Sumikin Chemical Co., Ltd., trade name "YDAN-1000-10C")

[0239] Epoxy resin 3: methoxynaphthalene...

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Abstract

Provided is a curable resin composition containing an epoxy resin and a curing agent, wherein the curing agent includes a phenol novolak resin containing a structural unit derived from a phenol compound represented by general formula (1). In general formula (1), R1 represents a hydrogen atom or a methyl group, R2 represents a C10-18 aliphatic hydrocarbon group, and n is an integer of 1 or 2.

Description

technical field [0001] The present invention relates to a curable resin composition and an electronic component device. Background technique [0002] Along with recent miniaturization, weight reduction, performance enhancement, etc. of electronic equipment, the increase in mounting density has been promoted. As a result, the mainstream of electronic component devices has changed from conventional pin insertion type packages to surface mount type packages such as integrated circuits (Integrated Circuit, IC) and large scale integrated circuits (Large Scale Integration, LSI). [0003] The mounting method of the surface mount type package is different from the existing pin insertion type package. That is, when the pins are mounted on the wiring board, the conventional pin insertion type package inserts the pins into the wiring board and solders from the back of the wiring board, so the package is not directly exposed to high temperature. However, in the surface mount type pack...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62H01L23/29H01L23/31
CPCH01L23/29C08G59/62H01L23/31
Inventor 中村真也
Owner RESONAC CORP
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