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Formaldehyde-free adhesive, method for preparing composite artificial board by using formaldehyde-free adhesive and prepared composite artificial board

A technology for adhesives and wood-based panels, which is used in the joining of wooden veneers, adhesive types, polyurea/polyurethane adhesives, etc. problem, to achieve the effect of high bonding strength and good water resistance

Active Publication Date: 2021-05-21
WANHUA CHEM GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reaction process of the inorganic salt sealing agent sodium bisulfite or potassium bisulfite and organic polyisocyanate is not easy to control, and if the hot pressing is too long, a large amount of sulfur dioxide gas will be released, polluting the environment; the hot pressing time is prolonged, reducing production efficiency
[0009] Patent CN101524857A discloses a method for preparing plywood by isocyanate spraying, which has the advantages of low cost, short hot-pressing time, and low moisture content requirements of the veneer, but too long spraying will cause environmental pollution and harm to the human body. The board has no initial tack, which is inconvenient for the hot pressing process

Method used

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  • Formaldehyde-free adhesive, method for preparing composite artificial board by using formaldehyde-free adhesive and prepared composite artificial board
  • Formaldehyde-free adhesive, method for preparing composite artificial board by using formaldehyde-free adhesive and prepared composite artificial board
  • Formaldehyde-free adhesive, method for preparing composite artificial board by using formaldehyde-free adhesive and prepared composite artificial board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7

[0074] The plywood adhesive was compounded according to the formula in Table 1, and the panel test was carried out directly without aging after the compounding.

[0075] Table 1 embodiment 1-7 glue formula

[0076] PMDI MPEG water HPMC wheat flour calcium carbonate boehmite HAP Example 1 100 1 300 2 20 15 2 10 Example 2 100 15 300 2 20 15 2 10 Example 3 100 1 300 10 20 15 2 10 Example 4 100 1 300 2 50 15 2 10 Example 5 100 1 300 2 20 15 10 10 Example 6 100 1 300 2 20 5 2 10 Example 7 100 1 300 2 20 15 2 50

[0077] Table 2 embodiment 1-7 plate test result

[0078]

[0079] It can be obtained from Examples 1-7 that if the dosage of the substances in the formula is adjusted within the scope of the present invention, the boards can meet the requirements of Class I plywood, and the performance fluctuation of the boards is small.

Embodiment 8-12

[0088] Compared with Example 1, in Examples 8-12, the step of aging the glue solution is added, that is, after the glue solution is prepared, the glue solution is placed in an oven at 35°C for 0.5-8 hours and then taken out, and the viscosity test is carried out with a viscometer, and the plate is made at the same time evaluate.

[0089] Examples 8-12 The dosage of the components and the plate making steps are the same as those in Example 1, and the test results of the bond strength of the plates are shown in Table 4.

Embodiment 1

[0099] In Example 13, porous silica powder was used for component (d) in an amount of 10 parts by mass, and the amounts of other components and the plate making steps were the same as in Example 1. The test results of the bond strength of the plates are shown in Table 5.

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Abstract

The invention discloses a formaldehyde-free adhesive, a method for preparing a composite artificial board by using the formaldehyde-free adhesive and the prepared composite artificial board. The formaldehyde-free adhesive comprises the following components: (a) 100 parts by mass of modified isocyanate; (b) 10-90 parts by mass of a powder filler; (c) 1-15 parts by mass of a thickening agent; (d) 2-80 parts by mass of a porous powder; and (e) 1-15 parts by mass of boehmite. The formaldehyde-free adhesive has the advantage of long pot life. The composite artificial board prepared by using the formaldehyde-free adhesive has the characteristics of high bonding strength, high qualification rate, good water resistance, no formaldehyde and environment friendliness.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a formaldehyde-free adhesive for composite wood-based panels. Background technique [0002] Wood-based panels are boards or molded products made of wood or other non-wood plants as raw materials, which are separated into various unit materials after certain mechanical processing, and then recombined and hot-pressed after applying adhesives. From the perspective of the production scale of wood-based panels and the total output of wood-based panels, my country is a big country in the production of wood-based panels. In 2018, the total output of wood-based panels was 299 million cubic meters, an increase of about 1.4% over 2017. The output of China's wood-based panel products accounted for 50%-60% of the world's total wood-based panel production. In 2018, my country's plywood output was 178.98 million cubic meters, a year-on-year increase of 4.1%. In the past 10 years, the average annual ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J11/04C09J11/08B27D1/04B27G11/00B32B37/06B32B37/08B32B37/10B32B37/12B32B38/00B32B21/14B32B21/13B32B7/12
CPCC09J175/08C09J11/04C09J11/08B27D1/04B27G11/00B32B37/06B32B37/08B32B37/10B32B37/1284B32B38/0004B32B21/14B32B21/13B32B7/12C08K2003/2227C08K2003/265C08L2205/03B32B2317/16B32B2419/00C08L1/286C08L3/02C08K13/04C08K7/26C08K7/08C08K3/22C08K3/26
Inventor 李厚义涂松孙卫华张梓军王向硕范丽颖孙鹏胡兵波
Owner WANHUA CHEM GRP CO LTD
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