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Bonding method of flip Micro LED chip and substrate

A chip and flip-chip technology, which is applied in the bonding field of flip-chip Micro LED chips and substrates, can solve the problems of affecting production costs and high unit price of Au, and achieve the effects of lower production costs, lower bonding temperatures, and easier bonding

Active Publication Date: 2021-06-08
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, Au-In bonding, Au-Au bonding and Au-Sn bonding are mostly used, the effect is stable, and the bonding strength is high, but the unit price of Au is high, which affects the production cost. Therefore, this application urgently needs a A technical solution to reduce costs on the premise of bonding strength and bonding stability

Method used

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  • Bonding method of flip Micro LED chip and substrate
  • Bonding method of flip Micro LED chip and substrate
  • Bonding method of flip Micro LED chip and substrate

Examples

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Embodiment 1

[0064] see figure 1 , an embodiment of the present invention provides a method for bonding a flip-chip Micro LED chip to a substrate, the method comprising:

[0065] S1. Cover the upper surface of the flip-chip Micro LED chip 200 with an adhesive layer 210; while increasing the adhesion between the chip and the seed layer 220, avoid the metal of the seed layer 220 from the metal and SiO on the chip surface 2 Diffusion occurs, resulting in reduced electrical performance. The material of the adhesion layer 210 can be titanium, nickel, tungsten, molybdenum, platinum, tantalum, etc., which can be one or more layers, or two or more alloys. The thickness ranges from 1 nm to 1 μm; wherein, the adhesion layer 210 can be completed by means of sputter, E-beam, electroplating, chemical plating, etc., such as figure 2 shown.

[0066] S2. Form a seed layer covering the adhesion layer; form a seed layer 220 on the adhesion layer 210, the material of the seed layer 220 is Cu, the thicknes...

Embodiment 2

[0092] see Figure 10 , an embodiment of the present invention provides a method for bonding a flip-chip Micro LED chip to a substrate, the cross-sectional structure of each layer is as follows Figure 11 As shown, the method includes:

[0093] A1. Expose the P electrode 206 and N electrode 207 of the Micro LED chip 200 through a photolithography process, and form a pattern on the electrode;

[0094] Spin-coat a negative photoresist on the flip-chip Micro LED chip 200; form a desired pattern through a photolithography process; the area of ​​the pattern is smaller than or equal to the surface area of ​​the electrode, thereby exposing the P electrode 206 and N electrode of the Micro LED chip 207.

[0095] A2. Cover the pattern with a layer of adhesion layer 201; increase the adhesion between the chip and the seed layer, the material of the adhesion layer 201 can be titanium, nickel, tungsten, molybdenum, etc., which can be one or more layers The layer can also be two or more ...

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Abstract

The invention relates to a bonding method of a flip Micro LED chip and a substrate. The bonding method comprises the steps of sequentially preparing an adhesion layer, a seed layer, a first bonding layer, a catalyst layer and a second bonding layer on the surface of the flip Micro LED chip, and then bonding the first bonding layer, the catalyst layer and the second bonding layer of the Micro LED chip with the substrate. According to the bonding method, the cost can be reduced without influencing the bonding strength and the bonding stability, and meanwhile low-temperature bonding can be achieved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for bonding a flip-chip Micro LED chip and a substrate. Background technique [0002] In the field of display, flexible display has always been the research direction of researchers. Due to its unique organic properties and simple display structure, organic light-emitting diode (OLED) display makes flexible display feasible. With the continuous development of display technology, Micro LED has emerged in the field of display technology. Due to its advantages such as high brightness, high contrast, long life, high stability in extreme environments, and low power consumption, it is considered to be used in flexible displays. future technology. [0003] Chip bonding mainly uses metal bonding, that is, metal or an alloy formed of multiple metals is used as the dielectric layer, and the surface is diffused or melted by applying temperature and pressure, so that the two chips...

Claims

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Application Information

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IPC IPC(8): H01L33/62
CPCH01L33/62H01L24/27H01L24/29H01L24/83H01L2224/2908H01L2224/29026H01L2933/0066
Inventor 张建华殷录桥嵇啸啸
Owner SHANGHAI UNIV
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