High-temperature-resistant ultraviolet curing adhesive and preparation method thereof

Abstract

The invention discloses a high-temperature-resistant ultraviolet light curing adhesive and a preparation method of the high-temperature-resistant ultraviolet light curing adhesive. The UV photocuring adhesive is prepared from the following raw materials in percentage by weight: 10 to 30 percent of acrylate-terminated hyperbranched polyester, 10 to 20 percent of polyester urethane acrylate or polyether urethane acrylate flexible oligomer, 5 to 10 percent of urethane acrylate, 10 to 20 percent of acrylate monomer, 1 to 5 percent of epoxy resin, 5 to 10 percent of reactive diluent, 1 to 5 percent of silane coupling agent, 1 to 5 percent of photoinitiator, 1 to 10 percent of photosensitizer and 1 to 5 percent of mercaptan. The light-cured adhesive can be endowed with relatively high rigidity, high hardness, no surface crack and good mechanical property, and has good bonding strength, heat resistance and waterproofness.

Description

technical field [0001] The invention relates to the technical field of light-curing materials, in particular to a high-temperature-resistant ultraviolet light-curing adhesive and a preparation method thereof. Background technique [0002] Light-curing materials have been widely studied due to their outstanding advantages such as fast curing speed, environmental friendliness, low energy consumption, and no solvent volatilization, and they are rapidly promoted in various industries. However, UV-curable adhesives also have their own limitations. Conventional UV-curable adhesives have obvious limitations in the application of high temperature resistance, due to the low cross-linking density of acrylate molecular chains, large content of linear molecular chains, and the rigidity of molecular chain There are few functional groups. When the ambient temperature rises, some molecular chains will slip relative to each other, and the mechanical properties of the material will decrease ...

AI Technical Summary

Problems solved by technology

However, UV-curable adhesives also have their own limitations. Conventional UV-curable adhesives have obvious limitations in the application of high temperature resistance, due to the low cross-linking density of acrylate molecular chains, large content of linear molecular chains, and the rigidity of molecular chains There are few functional groups. When the ambient temperature rises, some molecular chains will slip relative to each other, and the mechanical properties of the material will decline rapidly. Therefore, UV adhesives cannot be widely used in high temperature resistant applications.

Images